JPS63108761A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS63108761A
JPS63108761A JP61256104A JP25610486A JPS63108761A JP S63108761 A JPS63108761 A JP S63108761A JP 61256104 A JP61256104 A JP 61256104A JP 25610486 A JP25610486 A JP 25610486A JP S63108761 A JPS63108761 A JP S63108761A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
sealed semiconductor
leads
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61256104A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0545065B2 (enExample
Inventor
Tamakazu Suzuki
鈴木　瑞一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61256104A priority Critical patent/JPS63108761A/ja
Publication of JPS63108761A publication Critical patent/JPS63108761A/ja
Publication of JPH0545065B2 publication Critical patent/JPH0545065B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61256104A 1986-10-27 1986-10-27 樹脂封止型半導体装置 Granted JPS63108761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61256104A JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61256104A JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63108761A true JPS63108761A (ja) 1988-05-13
JPH0545065B2 JPH0545065B2 (enExample) 1993-07-08

Family

ID=17287943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61256104A Granted JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS63108761A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913221A1 (de) * 1988-04-22 1989-11-02 Mitsubishi Electric Corp Halbleiteranordnung
JPH0286153A (ja) * 1988-09-22 1990-03-27 Toshiba Corp 樹脂封止型半導体装置
JP2003018862A (ja) * 2001-07-03 2003-01-17 Mitsubishi Electric Corp インバータモジュール
JP2010530622A (ja) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気的構成部材

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913221A1 (de) * 1988-04-22 1989-11-02 Mitsubishi Electric Corp Halbleiteranordnung
JPH0286153A (ja) * 1988-09-22 1990-03-27 Toshiba Corp 樹脂封止型半導体装置
JP2003018862A (ja) * 2001-07-03 2003-01-17 Mitsubishi Electric Corp インバータモジュール
JP2010530622A (ja) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気的構成部材
US8379395B2 (en) 2007-06-21 2013-02-19 Robert Bosch Gmbh Electrical component

Also Published As

Publication number Publication date
JPH0545065B2 (enExample) 1993-07-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees