JPS63108761A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS63108761A
JPS63108761A JP25610486A JP25610486A JPS63108761A JP S63108761 A JPS63108761 A JP S63108761A JP 25610486 A JP25610486 A JP 25610486A JP 25610486 A JP25610486 A JP 25610486A JP S63108761 A JPS63108761 A JP S63108761A
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
resin
semiconductor chip
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25610486A
Other languages
Japanese (ja)
Other versions
JPH0545065B2 (en
Inventor
Tamakazu Suzuki
鈴木　瑞一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP25610486A priority Critical patent/JPS63108761A/en
Publication of JPS63108761A publication Critical patent/JPS63108761A/en
Publication of JPH0545065B2 publication Critical patent/JPH0545065B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the lowering of moisture resistance due to the intrusion of water from a hanging pin by placing a semiconductor chip through an insulator extending over a plurality of leads extended from oppositely faced both sides. CONSTITUTION:The title semiconductor device is constituted including a plurality of leads 2, which are elongated toward the inside from oppositely faced both sides and take a shape that they are tangled mutually without contacts at a central section, and a semiconductor chip 1, which is placed through an insulator 3 extending over a plurality of the leads 2 at the central section and in which bonding-pads 5 and the noses of a plurality of the leads 2 are connected by metallic small-gage wires 4. Accordingly, an island section in which water is easy to intrude from a hanging pin is removed, and the length of the leads 2 is extended, thus improving moisture resistance.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関し、特にデュアル・
イン・ライン型の樹脂封止型半導体装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and particularly to a dual semiconductor device.
The present invention relates to an in-line resin-sealed semiconductor device.

〔従来の技術〕[Conventional technology]

樹脂封止型半導体装置は、ハーメティ・γり封止型半導
体装置に比べて低原価であり量産性にもすぐれているが
、耐湿性の面では僅かながら不足している。Resin-sealed semiconductor devices are lower in cost and more easily mass-produced than hermetically sealed semiconductor devices, but they are slightly lacking in moisture resistance.

第２図（ａ）、（ｂ）は従来のデュアル・イン・ライン
型の樹脂封止型半導体装置を示す一部切欠き平面図およ
びＢ−Ｂ’線断面図である。FIGS. 2(a) and 2(b) are a partially cutaway plan view and a sectional view taken along the line BB' of a conventional dual-in-line resin-sealed semiconductor device.

第２図（ａ）、（ｂ）に示すように、従来の樹脂封止型
半導体装置は半導体チップ１と、半導体チップ１を載置
し釣りビン８で支持されたアイランド部６と、アイラン
ド部６の周辺に配置され半導体チップ１のボンディング
・バ・ンド５と金属細線４で接続された複数のリード７
を含んで構成される。As shown in FIGS. 2(a) and 2(b), the conventional resin-sealed semiconductor device includes a semiconductor chip 1, an island portion 6 on which the semiconductor chip 1 is mounted and supported by a fishing bottle 8, and an island portion 6. A plurality of leads 7 are arranged around the semiconductor chip 1 and connected to the bonding bands 5 of the semiconductor chip 1 by thin metal wires 4.
It consists of:

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の樹脂封止型半導体装置は、アイランド部
を支持する釣りビン表面と樹脂封止面の間隙を伝わって
水が侵入し半導体装置の耐湿性を低下させるという問題
点がある。The conventional resin-sealed semiconductor device described above has a problem in that water enters through the gap between the fishing bottle surface that supports the island portion and the resin-sealed surface, reducing the moisture resistance of the semiconductor device.

本発明の目的は、耐湿性の良好な樹脂封止型半導体装置
を提供することにある。An object of the present invention is to provide a resin-sealed semiconductor device with good moisture resistance.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の樹脂封止型半導体装置は、デュアル・イン・ラ
イン型の樹脂封止型半導体装置において、相対する両側
より内側に向って伸長し中央部で接触することなく互い
に入り組んだ形状をなす複数のリードと、前記中央部で
前記複数のリード上にまたがり絶縁物を介して載置され
た半導体チップを含んで構成される。The resin-sealed semiconductor device of the present invention is a dual-in-line resin-sealed semiconductor device in which a plurality of semiconductor devices extend inward from opposite sides and have an intricate shape with each other without touching in the center. and a semiconductor chip mounted at the center portion over the plurality of leads with an insulator interposed therebetween.

〔実施例〕〔Example〕

次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第１図（ａ）、（ｂ）は本発明の一実施例を示す一部切
欠き平面図およびＡ−Ａ’線断面図である。FIGS. 1(a) and 1(b) are a partially cutaway plan view and a sectional view taken along the line AA', showing an embodiment of the present invention.

第１図（ａ＞、（ｂ）に示すように、デュアル・イン・
ライン型の樹脂封止型半導体装置において、相対する両
側より内側に向って伸長し中央部で接触することなく互
いに入り組んだ形状をなす複数のリード２と、前記中央
部で複数のリード２にまたがり絶縁物３を介して載置さ
れボンディング・パッド５と、複数リード２の先端を金
属細線４で接続された半導体チップ１を含んで構成され
る。As shown in Figure 1 (a>, (b)), the dual-in
In a line-type resin-sealed semiconductor device, a plurality of leads 2 extend inward from opposite sides and form an intricate shape with each other without contacting at the center, and a plurality of leads 2 extend across the plurality of leads 2 at the center. The semiconductor chip 1 includes a bonding pad 5 mounted on an insulator 3, and a semiconductor chip 1 in which the tips of a plurality of leads 2 are connected with thin metal wires 4.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、相対する両側から伸長す
る複数のリードにまたがり絶縁物を介して半導体チップ
を載置することによって釣りビンから水が侵入し易いア
イランド部を排除し、樹脂封止されるリードの長さを従
来に比べ伸長して浸水経路を実質的に長くし半導体装置
の耐湿性を向上させる効果がある。As explained above, the present invention eliminates the island portion where water easily enters from the fishing bottle by placing the semiconductor chip across a plurality of leads extending from opposite sides via an insulator, and seals the semiconductor chip with resin. This has the effect of increasing the length of the leads compared to the conventional method, substantially lengthening the water ingress path, and improving the moisture resistance of the semiconductor device.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）、（ｂ）は本発明の実施例を示す樹脂封止
型半導体装置の一部切欠き平面図およびＡ−Ａ’線断面
図、第２図（ａ）、（ｂ）は従来の樹脂封止型半導体装
置の一部切欠き平面図およびＢ−Ｂ’線断面図である。 １・・・半導体チップ、２・・・リード、３・・・絶縁
物、４・・・金属細線、５・・・ボンディング・パッド
、６・・・アイランド部、７・・・リード、８・・・釣
りビン。 （α） ８１区FIGS. 1(a) and (b) are a partially cutaway plan view and a cross-sectional view taken along line A-A' of a resin-sealed semiconductor device showing an embodiment of the present invention, and FIGS. 2(a) and (b) 1 is a partially cutaway plan view and a sectional view taken along the line BB' of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Lead, 3... Insulator, 4... Metal thin wire, 5... Bonding pad, 6... Island portion, 7... Lead, 8... ...Fishing bottle. (α) Ward 81

Claims (1)

【特許請求の範囲】[Claims] デュアル・イン・ライン型の樹脂封止型半導体装置にお
いて、相対する両側より内側に向って伸長し中央部で接
触することなく互いに入り組んだ形状をなす複数のリー
ドと、前記中央部で前記複数のリード上にまたがり絶縁
物を介して載置された半導体チップを含むことを特徴と
する樹脂封止型半導体装置。In a dual-in-line resin-sealed semiconductor device, a plurality of leads extend inward from opposite sides and form an intricate shape with each other without contacting in the center, and A resin-sealed semiconductor device comprising a semiconductor chip placed over leads with an insulator interposed therebetween.
JP25610486A 1986-10-27 1986-10-27 Resin sealed semiconductor device Granted JPS63108761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25610486A JPS63108761A (en) 1986-10-27 1986-10-27 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25610486A JPS63108761A (en) 1986-10-27 1986-10-27 Resin sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS63108761A true JPS63108761A (en) 1988-05-13
JPH0545065B2 JPH0545065B2 (en) 1993-07-08

Family

ID=17287943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25610486A Granted JPS63108761A (en) 1986-10-27 1986-10-27 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS63108761A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913221A1 (en) * 1988-04-22 1989-11-02 Mitsubishi Electric Corp SEMICONDUCTOR ARRANGEMENT
JPH0286153A (en) * 1988-09-22 1990-03-27 Toshiba Corp Resin sealed type semiconductor device
JP2003018862A (en) * 2001-07-03 2003-01-17 Mitsubishi Electric Corp Inverter module
JP2010530622A (en) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3913221A1 (en) * 1988-04-22 1989-11-02 Mitsubishi Electric Corp SEMICONDUCTOR ARRANGEMENT
JPH0286153A (en) * 1988-09-22 1990-03-27 Toshiba Corp Resin sealed type semiconductor device
JP2003018862A (en) * 2001-07-03 2003-01-17 Mitsubishi Electric Corp Inverter module
JP2010530622A (en) * 2007-06-21 2010-09-09 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Electrical components
US8379395B2 (en) 2007-06-21 2013-02-19 Robert Bosch Gmbh Electrical component

Also Published As

Publication number Publication date
JPH0545065B2 (en) 1993-07-08

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