JPH04163956A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPH04163956A
JPH04163956A JP28854090A JP28854090A JPH04163956A JP H04163956 A JPH04163956 A JP H04163956A JP 28854090 A JP28854090 A JP 28854090A JP 28854090 A JP28854090 A JP 28854090A JP H04163956 A JPH04163956 A JP H04163956A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
section
inner lead
sections
inner
lead sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28854090A
Inventor
Akiro Hoshi
Kazuo Shimizu
Toshiharu Takahashi
Original Assignee
Akita Denshi Kk
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To make a lead frame for semiconductor commonly available by inner lead sections, resulting in allowing the degree of freedom of internal circuit design of chip to increase by crossing inner lead sections.
CONSTITUTION: Inner lead section 5 is bent so as to cross an inner lead section 4 at the upper part of the inner lead section 4. The inner lead section 4 is indented in its middle, except its tip section that is treated for wire bonding, and the bent section 5 is made to pass through this sunken part of section 4. Between both section 5 and section 4, a gap is made for insulation. Further, if no sunken part is prepared in the section 4, an insulating member is inserted therebetween instead in order to protect the occurrence of shortcircuit therebetween. With this, the lead frame is commonly available by inner lead sections 5 and 4, and as a result the degree of freedom of circuit design of a chip 1 increases. Furthermore, even when the inner leads cross each other, since a gap between inner lead sections are filled with resin when molding the inner lead sections, no insulation failure occurs therebetween.
COPYRIGHT: (C)1992,JPO&Japio
JP28854090A 1990-10-29 1990-10-29 Lead frame for semiconductor device Pending JPH04163956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28854090A JPH04163956A (en) 1990-10-29 1990-10-29 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28854090A JPH04163956A (en) 1990-10-29 1990-10-29 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPH04163956A true true JPH04163956A (en) 1992-06-09

Family

ID=17731562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28854090A Pending JPH04163956A (en) 1990-10-29 1990-10-29 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPH04163956A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864173A (en) * 1995-04-05 1999-01-26 National Semiconductor Corporation Multi-layer lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864173A (en) * 1995-04-05 1999-01-26 National Semiconductor Corporation Multi-layer lead frame
US5994768A (en) * 1995-04-05 1999-11-30 National Semiconductor Corporation Multi-layer lead frame
US6087204A (en) * 1995-04-05 2000-07-11 National Semiconductor Corporation Method of making a multi-layer lead frame

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