JPH01290248A - Lead frame - Google Patents

Abstract

PURPOSE:To enable inner leads to increase in number and the enlargement of their chips in width by a method wherein two or more inner leads and die pads are non-electrically connected with each other instead of providing a die pad supporting suspension lead. CONSTITUTION:A quadrangular lead frame 1 is provided with two or more inner leads 3 which extend inward from a tie bar, whereas conventional suspension leads which a support a die pad are not provided. And, the die pad 5 is formed of a conductor or an insulator, and a joining member 4 is formed of an insulator when the die pad is formed of a conductor, and the inner leads 3 and the die pad 5 are not electrically connected with each other. By these processes, a lead frame is so structured that a die pad supporting suspension lead can be dispensed with, so that inner leads can be increased in number and in width instead.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to lead frames for semiconductor devices.

2. Description of the Related Art In a conventional lead frame for a semiconductor device, taking a quad type as an example, as shown in FIG.
I was supported by

Problems to be Solved by the Invention However, in this type of lead frame, the hanging dobbin can only be used as a ground pin for a semiconductor device.

Furthermore, in recent years, semiconductor packages have become increasingly multi-bin in order to improve the degree of integration of semiconductor devices, and at the same time, with the shrinking of semiconductor devices, the chip size has become smaller and smaller. In such conventional lead frames, the number of inner leads used has been reduced because suspension leads for the die pad are required, and as chip sizes have become smaller, the tips of inner leads have become thinner and thinner, pushing etching technology to its limits. ing. Therefore, in ultra-small chips, the wires that connect the semiconductor device and the inner leads inevitably become long, causing the problem that the wires come into contact with the die pad.

The present invention solves these problems, and aims to provide a lead frame that can increase the number of inner leads and widen the width of the tip compared to the conventional lead frame.

Means for Solving the Problems In order to solve the above problems, the lead frame for a semiconductor device of the present invention has a structure in which a plurality of inner leads and a die pad are electrically connected in a non-contact manner.

Effect: With the above configuration, it is possible to use the lead conventionally used as a suspension lead as an inner lead. Furthermore, even if the number of pins of the inner lead is the same, the width of the tip of the inner lead can be made wider by the space used as the hanging lead. Furthermore, if a non-conductive material is used for the die pad, there will be no problems such as short circuits even if a wire comes into contact with the die pad, and long wires can also be used.

Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a plan view of a main part of a lead frame showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the lead frame taken along the line AA in FIG. 1. In FIGS. 1 and 2, 1 is a quad-type lead frame, and a plurality of inner leads 3 extending inward from tie bars 2 are formed, but conventional hanging leads for supporting the die pad are not provided. Not yet.

A bonding member 4 such as an ESP plate is bonded to the lower surface of the tip of the inner lead 3, and a bonding member 4 such as an ESP plate is further connected to the
Two die pads 5 are bonded together.

The die pad 5 is made of conductive or insulating material,
When a conductive material is used, an insulating material is used for the bonding member 4, and each inner lead 3 and die pad 5 are not electrically in contact with each other.

With the above configuration, since no suspension leads for supporting the die pad 5 are formed on the lead frame l, the inner leads 3 can be formed in locations where suspension leads were conventionally provided. 5, all the inner leads 3 can be used as pins connected to the semiconductor chip.

Furthermore, by cutting the tips of the inner leads 3 using a press or the like, it can be used for larger semiconductor chips, and a wider range of chip sizes can be covered than with a single inner lead shape.

In addition to the effects of the invention, according to the present invention, a plurality of inner leads and a die pad are electrically connected without contact, so a hanging lead for supporting the die pad is unnecessary, and the number of inner leads can be increased accordingly. You can also increase the width of the inner lead.

In addition, by cutting the tip of the inner lead,
It can also be used for larger semiconductor chips, and a single inner lead shape can cover a wide range of chip sizes.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an essential part of a lead frame showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a plan view of an essential part of a conventional lead frame. 1... Lead frame, 2... Tie bar, 3...
Inner lead, 4... Joining member, 5... Die pad. Agent Yoshihiro MorimotoFigure 2

Claims (1)

[Claims] 1. A lead frame in which multiple inner leads and die pads are electrically connected without contact.