JPS627701B2 - - Google Patents
Info
- Publication number
- JPS627701B2 JPS627701B2 JP51097707A JP9770776A JPS627701B2 JP S627701 B2 JPS627701 B2 JP S627701B2 JP 51097707 A JP51097707 A JP 51097707A JP 9770776 A JP9770776 A JP 9770776A JP S627701 B2 JPS627701 B2 JP S627701B2
- Authority
- JP
- Japan
- Prior art keywords
- channel
- transistor
- well
- type
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9770776A JPS5323577A (en) | 1976-08-18 | 1976-08-18 | Complementary type insulated gate effect transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9770776A JPS5323577A (en) | 1976-08-18 | 1976-08-18 | Complementary type insulated gate effect transistor |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59259137A Division JPS60143658A (ja) | 1984-12-10 | 1984-12-10 | 相補形絶縁ゲート電界効果トランジスタ集積回路 |
| JP59259135A Division JPS60143664A (ja) | 1984-12-10 | 1984-12-10 | 半導体メモリ集積回路 |
| JP59259136A Division JPS60143665A (ja) | 1984-12-10 | 1984-12-10 | 半導体メモリ |
| JP59259138A Division JPS60143659A (ja) | 1984-12-10 | 1984-12-10 | 相補形絶縁ゲート電界効果トランジスタ集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5323577A JPS5323577A (en) | 1978-03-04 |
| JPS627701B2 true JPS627701B2 (enrdf_load_stackoverflow) | 1987-02-18 |
Family
ID=14199378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9770776A Granted JPS5323577A (en) | 1976-08-18 | 1976-08-18 | Complementary type insulated gate effect transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5323577A (enrdf_load_stackoverflow) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57113286A (en) * | 1980-12-30 | 1982-07-14 | Seiko Epson Corp | Manufacture of semiconductor device |
| JPS57186353A (en) * | 1981-05-12 | 1982-11-16 | Seiko Epson Corp | Complementary metal oxide semiconductor type semiconductor device |
| JPS5848959A (ja) * | 1981-09-18 | 1983-03-23 | Toshiba Corp | 半導体装置 |
| JPS59121865A (ja) * | 1982-12-28 | 1984-07-14 | Toshiba Corp | 相補型半導体装置の製造方法 |
| JPS6031276A (ja) * | 1983-07-29 | 1985-02-18 | Toshiba Corp | 半導体装置及びその製造方法 |
| JPS6047457A (ja) * | 1983-08-26 | 1985-03-14 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60154555A (ja) * | 1984-01-24 | 1985-08-14 | Nec Corp | 相補型電界効果トランジスタを用いた半導体装置 |
| JPS60143658A (ja) * | 1984-12-10 | 1985-07-29 | Hitachi Ltd | 相補形絶縁ゲート電界効果トランジスタ集積回路 |
| FR2577338B1 (fr) * | 1985-02-12 | 1987-03-06 | Eurotechnique Sa | Procede de fabrication d'une memoire dynamique en circuit integre et memoire obtenue par ce procede |
| JP2724459B2 (ja) * | 1987-06-05 | 1998-03-09 | セイコーインスツルメンツ株式会社 | 半導体集積回路装置の製造方法 |
| US5238860A (en) * | 1987-07-10 | 1993-08-24 | Kabushiki Kaisha Toshiba | Semiconductor device having different impurity concentration wells |
| IT1222158B (it) * | 1987-07-28 | 1990-09-05 | Sgs Microelettronica Spa | Procedimento per la fabbricazione di dispositivi cmos con riduzione del numero di fasi di mascheratura |
| JPH0372668A (ja) * | 1990-07-26 | 1991-03-27 | Seiko Epson Corp | 半導体装置 |
-
1976
- 1976-08-18 JP JP9770776A patent/JPS5323577A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5323577A (en) | 1978-03-04 |
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