JPS6276747A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS6276747A
JPS6276747A JP60217613A JP21761385A JPS6276747A JP S6276747 A JPS6276747 A JP S6276747A JP 60217613 A JP60217613 A JP 60217613A JP 21761385 A JP21761385 A JP 21761385A JP S6276747 A JPS6276747 A JP S6276747A
Authority
JP
Japan
Prior art keywords
resin
pellet
thermosetting resin
thermosetting
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60217613A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0435908B2 (cg-RX-API-DMAC10.html
Inventor
Kazuhiko Takahashi
一彦 高橋
Masahiro Takita
滝田　雅広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP60217613A priority Critical patent/JPS6276747A/ja
Publication of JPS6276747A publication Critical patent/JPS6276747A/ja
Publication of JPH0435908B2 publication Critical patent/JPH0435908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W72/5449—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60217613A 1985-09-30 1985-09-30 樹脂封止型半導体装置 Granted JPS6276747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60217613A JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60217613A JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6276747A true JPS6276747A (ja) 1987-04-08
JPH0435908B2 JPH0435908B2 (cg-RX-API-DMAC10.html) 1992-06-12

Family

ID=16707033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60217613A Granted JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6276747A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355955A3 (en) * 1988-07-25 1991-12-27 Hitachi, Ltd. Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
EP0771029A3 (en) * 1995-10-24 1997-07-30 Oki Electric Ind Co Ltd Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
KR100621154B1 (ko) 2005-08-26 2006-09-07 서울반도체 주식회사 발광 다이오드 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210646A (ja) * 1982-06-02 1983-12-07 Kyodo Printing Co Ltd Ｉｃチツプモ−ルド成形品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210646A (ja) * 1982-06-02 1983-12-07 Kyodo Printing Co Ltd Ｉｃチツプモ−ルド成形品

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355955A3 (en) * 1988-07-25 1991-12-27 Hitachi, Ltd. Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6724071B2 (en) 1993-09-03 2004-04-20 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
EP1039540A1 (en) * 1995-10-24 2000-09-27 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
US6177725B1 (en) 1995-10-24 2001-01-23 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
US6459145B1 (en) 1995-10-24 2002-10-01 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor
US5864174A (en) * 1995-10-24 1999-01-26 Oki Electric Industry Co., Ltd. Semiconductor device having a die pad structure for preventing cracks in a molding resin
US6569755B2 (en) 1995-10-24 2003-05-27 Oki Electric Industry Co., Ltd. Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same
EP0771029A3 (en) * 1995-10-24 1997-07-30 Oki Electric Ind Co Ltd Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same
KR100621154B1 (ko) 2005-08-26 2006-09-07 서울반도체 주식회사 발광 다이오드 제조방법
WO2007024069A1 (en) * 2005-08-26 2007-03-01 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode
US7704761B2 (en) 2005-08-26 2010-04-27 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode
US8053259B2 (en) 2005-08-26 2011-11-08 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode

Also Published As

Publication number Publication date
JPH0435908B2 (cg-RX-API-DMAC10.html) 1992-06-12

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