JPH0435908B2 - - Google Patents

Info

Publication number
JPH0435908B2
JPH0435908B2 JP60217613A JP21761385A JPH0435908B2 JP H0435908 B2 JPH0435908 B2 JP H0435908B2 JP 60217613 A JP60217613 A JP 60217613A JP 21761385 A JP21761385 A JP 21761385A JP H0435908 B2 JPH0435908 B2 JP H0435908B2
Authority
JP
Japan
Prior art keywords
resin
metal substrate
semiconductor pellet
thermosetting resin
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60217613A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6276747A (ja
Inventor
Kazuhiko Takahashi
Masahiro Takita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP60217613A priority Critical patent/JPS6276747A/ja
Publication of JPS6276747A publication Critical patent/JPS6276747A/ja
Publication of JPH0435908B2 publication Critical patent/JPH0435908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W72/5449—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60217613A 1985-09-30 1985-09-30 樹脂封止型半導体装置 Granted JPS6276747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60217613A JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60217613A JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6276747A JPS6276747A (ja) 1987-04-08
JPH0435908B2 true JPH0435908B2 (cg-RX-API-DMAC10.html) 1992-06-12

Family

ID=16707033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60217613A Granted JPS6276747A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6276747A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355955A3 (en) * 1988-07-25 1991-12-27 Hitachi, Ltd. Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
KR100386061B1 (ko) * 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
KR100621154B1 (ko) * 2005-08-26 2006-09-07 서울반도체 주식회사 발광 다이오드 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210646A (ja) * 1982-06-02 1983-12-07 Kyodo Printing Co Ltd Ｉｃチツプモ−ルド成形品

Also Published As

Publication number Publication date
JPS6276747A (ja) 1987-04-08

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