JPS6249614A - 電子部品の製造方法 - Google Patents
電子部品の製造方法Info
- Publication number
- JPS6249614A JPS6249614A JP61197783A JP19778386A JPS6249614A JP S6249614 A JPS6249614 A JP S6249614A JP 61197783 A JP61197783 A JP 61197783A JP 19778386 A JP19778386 A JP 19778386A JP S6249614 A JPS6249614 A JP S6249614A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- comb teeth
- comb
- component chip
- molded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 244000126211 Hericium coralloides Species 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 210000001520 comb Anatomy 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197783A JPS6249614A (ja) | 1986-08-22 | 1986-08-22 | 電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61197783A JPS6249614A (ja) | 1986-08-22 | 1986-08-22 | 電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6249614A true JPS6249614A (ja) | 1987-03-04 |
| JPS6316895B2 JPS6316895B2 (enrdf_load_stackoverflow) | 1988-04-11 |
Family
ID=16380276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61197783A Granted JPS6249614A (ja) | 1986-08-22 | 1986-08-22 | 電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249614A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196818A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 積層セラミック部品 |
| US11862400B2 (en) | 2021-09-17 | 2024-01-02 | Kabushiki Kaisha Toshiba | Electronic component and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5348562B2 (ja) * | 2010-02-10 | 2013-11-20 | 三菱マテリアル株式会社 | 電子部品製造装置 |
| DE102018104459A1 (de) * | 2018-02-27 | 2019-08-29 | Tdk Electronics Ag | Vielschichtbauelement mit externer Kontaktierung |
-
1986
- 1986-08-22 JP JP61197783A patent/JPS6249614A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196818A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 積層セラミック部品 |
| US11862400B2 (en) | 2021-09-17 | 2024-01-02 | Kabushiki Kaisha Toshiba | Electronic component and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6316895B2 (enrdf_load_stackoverflow) | 1988-04-11 |
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