JPS6249614A - Manufacture of electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing electronic components, and in particular to an electronic component in which an external terminal is connected to an external electrode formed on the outer surface of an electronic component chip. The present invention relates to a manufacturing method.

[Prior Art] For example, some electronic components such as capacitors are chip-shaped. This has an external electrode formed on its outer surface, and by directly connecting this external electrode to the conductive part of the appropriate circuit board by soldering, etc., the electrical and mechanical connection can be fixed at the same time. It is achievable. Instead of this, there are also electronic components in which external terminals are formed using, for example, lead wires. This electronic component is electrically and mechanically connected and fixed to the circuit board via external terminals. Some electronic components including such external terminals are constructed by connecting the external terminals to the external electrodes of the electronic component chips as described above by soldering or the like. In this case, an insulating sheath containing the electronic component chip is formed.

The present invention is particularly directed to a method of manufacturing an electronic component in which an external terminal is connected to an intruder's electronic component chip.

By the way, in the case of such electronic components that are of interest to the present invention, there has been a problem in the past in that the soldering between the external electrodes and external terminals of the electronic component chips lacks reliability. More specifically, it has poor mechanical strength and low impact resistance.

The above problem occurs when the contact area between the external electrode and external terminal to be soldered is small, or when the external electrode and external terminal to be soldered are misaligned for some reason. It mainly occurred.

As a technique capable of solving the above-mentioned problems, there is a technique described, for example, in Japanese Utility Model Application Publication No. 55-74028. In this conventional technology, a plurality of comb teeth provided on a comb-shaped molded body made of a conductive metal plate are used as external terminals, and an external electrode of an electronic component chip is soldered to the tip of the comb teeth. The base of the comb teeth is cut off. A stepped attachment portion is provided at the tip of such a comb tooth, and a folded piece portion that contacts each end face of the electronic component chip placed on the stepped attachment portion is provided. The distance between the folded pieces formed on adjacent comb teeth is matched to the length of the end face m1 of the electronic component chip.

Therefore, according to this prior art, since the electronic component chip is placed on the stepped mounting part and its both end faces are supported by the folded pieces, accurate positioning is achieved, and the folded pieces are Since it contacts the external Ti pole of the component chip over a relatively wide area, highly reliable soldering can be performed.

[Problems to be Solved by the Invention] However, the prior art described in the above-mentioned Japanese Utility Model Application Publication No. 55-74028 includes problems that need to be solved.

In other words, even if folded pieces are formed, if a gap is formed between the pair of folded pieces and the electronic component chip, it is difficult to achieve the desired positioning with respect to the electronic component chip. Not only is it impossible to do this, but the soldering may also be incomplete. Conversely, if the distance between the pair of folded pieces is shorter than the distance between the end faces of the electronic component chip, the electronic component chip cannot be sandwiched between the folded pieces unless the comb teeth are forcibly deformed. Can not. However, such deformation of the comb teeth is undesirable because it impairs the alignment of the external terminals in the finished product. therefore,
With this conventional technology, the dimensions of electronic component chips are also limited.
Considerably high precision is also required for the position where the folded piece portion of the tip of the comb teeth is formed.

In addition, even if an electronic component chip is sandwiched between a pair of J-fold pieces and once accurately positioned, the subsequent soldering process may be subjected to a large impact or come into contact with some object. When this occurs, the position of the electronic component chip may shift.

This is because the comb teeth formed by beating from a metal plate are difficult to exert elasticity in a direction that brings their tips closer to each other. Of course, if an electronic component chip is sandwiched with the distance between the pair of folded pieces forcibly expanded, the folded pieces may exert elasticity in the direction of pinching the electronic component chip. However, in this case, as described above, the alignment of the external terminals after cutting is hindered.

Therefore, the present invention aims to provide a method of manufacturing electronic components that can solve the problems of the conventional limb surgery described above.

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention includes the following steps. There is a step of preparing an electronic component chip in which external electrodes are formed on a pair of opposing outer surfaces, and a step of preparing a plurality of comb teeth extending in the same direction, and forming a middle part of each of the comb teeth. A comb-shaped molded body made of a conductive metal plate is formed with a twisted part so that the tips of each comb tooth face each other and extend on a plane perpendicular to other parts. preparing the two comb teeth in a state where the pair of external electrodes of the electronic component chip are respectively in contact with the tips of two adjacent comb teeth selected from the plurality of comb teeth; a step of elastically sandwiching the electronic component chip between each tip of the comb teeth; and a step of sandwiching the external electrode of the electronic component chip sandwiched between the tips of the two comb teeth and the comb teeth a step of electrically and mechanically connecting and fixing; and a step of forming an insulating exterior covering the electronic component chip and a part of the comb teeth adjacent to the electronic component chip that are connected and fixed to the external electrode. , cutting a base portion of the comb teeth connected and fixed to an external electrode of the electronic component chip.

[Function] In the present invention, the comb teeth provided in the comb-shaped molded body are prepared with a twisted portion formed in the middle portion thereof, so that the electronic component chip can be placed between the tip portions of two adjacent comb teeth. It can be held elastically. Therefore, up to the electrical and mechanical connection fixing steps such as soldering that will be performed later,
The two comb teeth always hold the electronic component chip in an elastic state.

[Example] FIG. 1 is a front view of an electronic component 1 obtained by implementing an example of the present invention. Figures 2 to 4 are
2 is a plan view, FIG. 3 is a left side view, and FIG. 4 is a front view. FIG. 5 is a cross-sectional structural diagram of a multilayer capacitor chip as an example of the electronic component chip 2. As shown in FIG. FIG. 6 is a perspective view showing a stage in the middle of manufacturing the electronic component 1 of FIG. 1.

As shown in FIGS. 1 to 4, in the electronic component 1 that has become a product, a pair of external electrodes 3 of an electronic component chip 2 are each connected to a pair of external terminals 4 by solder (not shown) or the like. An insulating sheath 5 is formed to cover the electronic component chip 2 and its connecting portion with the external terminal 4.

The external electrodes 3 are arranged on opposing electrodes 1 on the outer surface of the electronic component chip 2.
It is sufficient that they are formed on each pair of surfaces. However, in the illustrated electronic component 1, the external electrode 3 is formed extending to a part of the outer surface adjacent to the pair of mutually opposing surfaces, but this is simply a manufacturing problem. Only.

As the electronic component chip 2, for example, a multilayer capacitor chip is applied. The detailed structure of such a multilayer capacitor chip will be described below with reference to FIG.

The multilayer capacitor chip as the electronic component chip 2 includes a plurality of dielectric layers 6, and internal R817a and 7b are formed between each dielectric layer W16.

The plurality of internal electrodes are divided into two groups depending on their formation, and the internal electrodes 7a of the first group are connected to the external electrodes 3(a) on the right side of FIG. ! 7b are respectively connected to the left external electrode 3(b). In this way, a pair of external electrodes 3 (
By forming a large number of capacitances connected in parallel between a) and 3(b), a large capacity can be obtained despite the relatively small size. In this multilayer capacitor chip, external electrodes 3 (a) and 3 (b) correspond to external electrodes 3.3 of electronic component chip 2.

Next, a method for manufacturing the electronic component 1 shown in FIG. 1 will be described with reference mainly to FIG. 6.

The external terminal 4 provided in the electronic component 1 is provided in one comb-shaped molded body 8 and is constituted by two adjacent trees 16i9. The comb-shaped molded body 8 is integrally formed from a conductive metal plate, and has a thickness of, for example, 0.25 to 0.25 mm.
A 3III brass plate plated with tin or solder is used. Although a particularly large number of combs m9 are not shown in the comb-shaped molded body 8, one set includes two combs m9, and a large number of such sets are arranged in the length direction. A twisted portion 10 is formed in the middle of each comb tooth 9, and an electronic component chip 2 is formed at the tip of the twisted portion 10.
A contact piece 11 that contacts the external electrode 3 is formed. By forming the twisted portion 10, the contact pieces 11 of each comb tooth 9 face each other and extend on a plane perpendicular to other parts.

A flap 12 is preferably formed extending integrally from the side of the contact piece 11 in a direction perpendicular to the contact piece 11 .

Next, each external electrode 3 is in contact with the contact pieces 11 of two adjacent comb teeth 9, and the electronic component chip 2 is held between these contact pieces 11. In this state, the electronic component chip 2 is temporarily held by the elasticity of the material of the molded body 8. The state in which the electronic component chip 2 shown in FIG. 6 is elastically held between the pair of contact pieces 11 is maintained until the step in the manufacturing process of the electronic component 1 shown in FIG. 1. That is, in order to connect the external electrode 3 of the electronic component chip 2 and the contact piece 11,
While the electronic component chip 2 is mechanically held between the comb teeth 9 of the molded body 8, it is immersed in a solder bath or exposed to a solder jet. As a result, the contact piece 11 and the external electrode 3 are soldered with solder (not shown), and are electrically and mechanically connected and fixed. In this embodiment, since the flap 12 is formed, positioning and soldering when mechanically clamping the electronic component chip 2 as described above also occurs between the flap 12 and the external power source 13. This results in more reliable electrical and mechanical connections. Note that if such an advantage is not desired, the flap 12 may not be formed on the contact piece 11 from Ill''InL.

Next, the insulating sheath 5 is formed. This insulating exterior 5
is made of, for example, an insulating resin, such as a phenol resin. Formation of the insulating exterior 5 using such an insulating resin is carried out, for example, by placing the molded body 8 holding the electronic component chip 2 in a molding die and injecting the resin into the die. This resin may be molded by injection molding or low pressure transfer molding. Alternatively, the insulating sheath 5 may be formed by dipping it into an insulating resin. Note that, as shown in FIGS. 1 to 4, the insulating sheath 5 is formed to include a twisted portion 10 therein.

After the insulating sheath 5 is formed in this way, the comb teeth 9 at the molding holiday shown in FIG. When cut in this way, the comb teeth 9 are separated and become independent flat external terminals 4.

When each of the above-mentioned steps is completed, an electronic component 1 having an appearance as shown in FIG. 1 is obtained. In this way, electronic component 1
The process of obtaining a comb-shaped compact 8
It is extremely efficient because it is carried out in a form that is maintained in a uniform manner. Note that, as shown in FIG. 6, the molded body 8 has through holes 14.
are formed, and such through holes 14 are distributed at equal intervals in the length direction of the molded body 8. The through hole 14 advantageously functions as a positioning or feeding device for performing the above-described process under mechanical υj control.

FIG. 7 schematically shows an interesting mounting arrangement state of the electronic component 1 obtained as described above. As shown here,
A plurality of electronic components 1 are in close contact with each other. This is a model showing the state in which it is mounted on a suitable board (not shown). This mounting arrangement state is advantageously achieved due to the presence of the insulating sheath 5 and the external terminals 4 being led out in the radial direction.

According to such a mounting arrangement state, a large number of electronic components 1 can be mounted on the uneven root while occupying a small area.

FIG. 8 is a front view without showing the comb-shaped molded body 8 used in another embodiment of the present invention. The molded body 8, not shown here, is one in which the shape of the comb teeth 9, which are cut with a knife and become the external terminals 4, has been changed. That is, in each comb tooth 9, the curved portion 1 is formed in a U-shape between the twisted portion 10 and the contact piece 11.
5 is formed. This curved portion 15 bulges outward relative to the electronic component chip 2'G held between the pair of contact pieces 11. According to such a molded body 8, it is possible to have greater elasticity from the twisted portion 10 to the tip end, and before the process of connecting the contact piece 11 and the external electrode 3 of the electronic component depth 2. The holding state of the electronic component chip 2 can be further stabilized.

FIG. 9 is a front view showing a comb-shaped molded body 8 used in still another embodiment of the present invention. Molded body 8 shown here
8, the bulging direction of the curved portion 15 is reversed compared to the molded body 8 of FIG.

This molded body 8 can also provide the same advantages as the case shown in FIG.

FIG. 10 is a perspective view showing a molded body 8 used in still another embodiment of the present invention, and corresponds to FIG. 6 described above. Therefore, in FIG. 10, similar references may be made to the portions corresponding to those shown in FIG. With No. 1 attached,
Duplicate explanations will be omitted. The molded body 8 shown in FIG. 10 is characterized by the fact that the teeth 9, especially the portions exposed from the insulating sheath 5 (FIG. 1), have an enlarged end surface of the cut portion along the dot chain @13 in FIG. As shown in FIG. 11, its cross section is V-shaped, and it is curved and molded so that the ridgeline appears in the direction of the S tooth 9. With such a configuration, even if the molded body 8 is formed from a thin plate, it can have sufficient strength against bending.

Note that the present invention is applicable not only to the case where the electronic component chip is a multilayer capacitor chip but also to the case where the electronic component chip is a normal capacitor chip or other elements such as a resistive element chip.

[Effects of the Invention] As described above, according to the present invention, the ll
Until the external electrodes of the electronic component chip are electrically and mechanically connected and fixed to the I-teeth by soldering, etc., the electronic component chip has each external electrode in contact with each tip of the comb teeth. However, the state of being elastically sandwiched between the tips of the comb teeth is maintained. Therefore, electronic component chips,
It can be held securely without any misalignment,
The subsequent soldering can be carried out with high reliability in the shade step. In addition, since elasticity is applied to the electronic component chip in the direction in which it is sandwiched from the tip of each of the two 1lIilI11, it is relatively ff1ffi.
Even electronic component chips with rough edges can be stably held.

In particular, it should be noted that the following effects are produced by forming interlocking portions on the comb teeth of the comb-shaped molded body used in the present invention.

That is, generally, a metal plate exhibits elasticity in the direction in which its surface is curved, but if a twisted portion is formed in the middle part of the comb teeth as in this invention, the elasticity can be exerted in any direction. It is also possible to plow. As mentioned above, the elasticity that acts in the direction of holding the electronic component chip is produced mainly at the tip of the comb teeth, and the elasticity that acts in the direction perpendicular to this direction is produced mainly on the 34N5 side of the comb teeth. produced. The elasticity directed in each direction intermediate between these two directions is mainly produced by the torsion portion. Therefore, the tips of such comb teeth can elastically hold the electronic component chip in a state where they closely follow the respective external electrodes of the electronic component chip. Therefore, great precision is not required for the dimensions of the electronic component chip or the distance between the tips of the two m teeth, and the alignment of the external terminals after being cut is also prevented from being disturbed. be done.

[Brief explanation of the drawing]

FIG. 1 is a front view of an electronic component 1 obtained by implementing an embodiment of the present invention. Figures 2 to 4 are
This figure shows the electronic component 1 with the insulating sheath 5 removed.
FIG. 2 is a plan view, FIG. 3 is a left side view, and FIG. 4 is a front view. FIG. 5 shows l1 as an example of the electronic component chip 1.
ll! FIG. 2 is a cross-sectional structural diagram of a t-capacitor chip. FIG. 6 is a perspective view of the electronic component 1 shown in FIG. 1, not showing a stage in the middle of manufacturing. FIG. 7 schematically shows an interesting mounting arrangement state of the electronic component 1. FIG. 8 is a front view showing a comb-shaped molded body 8 used in another embodiment of the present invention. FIG. 9 is a front view showing a comb-shaped molded body 8 used in still another embodiment of the present invention. FIG. 10 is a perspective view showing a comb-shaped molded body 8 used in still another embodiment of the present invention, and corresponds to FIG. 6. FIG. 11 is an enlarged end view of a cut portion taken along the dashed line 13 in FIG. 10. In the figure, 1 is an electronic component, 2 is an electronic component chip, 3 is an external electrode, 4 is an external terminal, 5 is an insulating exterior, 8 is a comb-shaped molded body, 9 is II) teeth, 10 is a twisted part, and 11 is contact piece,
12 is a flap, and 15 is a curved portion.

Claims (3)

[Claims] (1) preparing an electronic component chip having external electrodes formed on a pair of opposing outer surfaces, and having comb teeth extending in the same direction, with a twisted portion in the middle of each of the comb teeth; preparing a comb-shaped molded body made of a conductive metal plate, in which the tips of the comb teeth face each other and extend on a plane perpendicular to other parts; , each tip of two adjacent comb teeth selected from the plurality of comb teeth with the pair of external electrodes of the electronic component chip in contact with each tip of the two adjacent comb teeth; a step of elastically sandwiching the electronic component chip between the two comb teeth; forming an insulating exterior by covering the electronic component chip and a portion of the comb teeth adjacent to the electronic component chip that are connected and fixed to the external electrode; A method of manufacturing an electronic component, comprising: cutting a base of the comb teeth connected and fixed to an external electrode of the comb. (2) In the step of preparing the comb-shaped molded body,
Manufacturing the electronic component according to claim 1, wherein a flap that contacts a part of a surface adjacent to the pair of opposing surfaces of the electronic component chip is formed at the tip of the comb teeth. Method. (3) In the step of preparing the comb-shaped molded body,
Claim 1 or 2, wherein a U-shaped curved portion is formed between a portion of the tip of the comb teeth that contacts the external electrode and the twisted portion. 2. Method for manufacturing electronic components described in Section 1.