JPH0228309A - Manufacture of electronic part - Google Patents

Abstract

PURPOSE:To accurately align a terminal of a terminal material and an electrode of an electronic part element by a method wherein an electronic part element is imposed between facing terminal arrays of a terminal material which is fitted over said element. CONSTITUTION:An electronic part element 2 wherein a plurality of electrodes 22 are arranged along two opposite sides of a substrate is prepared, and a plurality of terminals 62 are extended inward corresponding to the arrayed electrodes of the electronic part element 2. A terminal material 6 is prepared wherein each terminal 62 is bent upward at its middle to align the external shape of the electronic part element 2 and the tip of the terminal is bent parallel with the electrode 22 so that the electronic part element 2 is set between opposite terminal arrays. Then, the terminal material 6 is fitted from over the electronic part element 2 so that the tip of each terminal 62 comes above each electrode 22 of the electronic part element 2. The respective electrodes 22 and the respective terminals 62 of the material 6 are conductively joined in this state. This enables a standing portion of each terminal 62 to determine the position in a direction perpendicular to the terminal array of the electronic part element 2 and force to interpose prevents movement in a direction along the terminal array of the electronic part element.

Description

[Detailed description of the invention] [Industrial application field] The second invention is, for example, a resistance network, a hybrid I
C. This invention relates to a method for manufacturing electronic components such as a capacitor network, and more specifically to improvements in a method for connecting terminals to electronic component elements.

[Conventional technology]

Conventional examples of this type of method are shown in Figures 3 and 4 (note that terminal materials 3.4.
The illustration of the plate thickness of No. 6 is omitted.

).

In both figures, 2 is an electronic component element, and in this example, a plurality of electrodes 22 for terminal connection are arranged in parallel on one surface of a rectangular substrate 21 along the edges of two opposing sides thereof. . A resistor, a capacitor, an IC chip, etc. are connected between the opposing electrodes 22 depending on the type of electronic component (all not shown).

In the example shown in FIG. 3, a terminal material 3 is used in which a plurality of terminals 32 corresponding to the arrangement of the electrodes 22 of the electronic component element 2, the tips of which are bent in a 10-shape shape, are extended from the carrier 31. The electronic component element 2 is inserted in the direction of the arrow using a jig (not shown), and each terminal 32 and each electrode 22 are soldered to each other. Note that the electrode 22 on the front side
A similar terminal material 3 is also used for connection.

On the other hand, in the example shown in FIG. 4, the electronic component element 2 is placed on the stand 5 and positioned to a certain extent, and from above, a plurality of flat terminals are inserted inward from two opposing sides of the frame 41. 4
2 is placed on the terminal material 4 extended to match the arrangement of the electrodes 22 of the electronic component element 2, and in that state, each terminal 42 and each electrode 22
and are soldered to each other. Incidentally, a plurality of positioning pins 51 are provided protrudingly provided on the base 5, and the terminal material 4 is positioned by passing the pins 51 through the plurality of holes 43 provided in the terminal material 4, respectively.

In either case, after connecting the terminals as described above, the electronic component element 2 is usually sealed with resin.
Then, each terminal is cut into a predetermined length to obtain a desired electronic component.

[Problem to be solved by the invention]

However, when electronic components have a large number of pins and the terminal pitch becomes small, the method shown in Figure 3 has to reduce the width of each terminal 32 accordingly, making it difficult to process the 10-shaped shape. There is a problem that the terminal material 3 cannot cope with this problem.

Furthermore, with the method shown in FIG. 4, it becomes difficult to align each electrode 22 and each terminal 42, and the mechanical fixation between the electronic component element 2 and the terminal material 4 is not directly achieved.
There are problems with soldering, such as misalignment between the electronic component element 2 and the terminal material 4 during resin molding.

Therefore, the main object of the present invention is to provide a method for manufacturing electronic components that improves these points.

[Means to solve the problem]

In order to achieve the above object, the manufacturing method of the present invention prepares an electronic component element having a plurality of electrodes arranged in parallel along the edges of two opposite sides of a substrate, and at least one of the frame portions. A plurality of terminals are extended inward from the two opposing sides to match the electrode arrangement of the electronic component element, and each terminal is bent upward in the middle to match the external shape of the electronic component element, and the tip is made into an electrode. Prepare a terminal material that can be bent in parallel so that an electronic component element can be sandwiched between opposing rows of terminals, and insert this terminal material from above the electrical component element so that the tip of each terminal is connected to the electronic component. It is characterized in that it is fitted over each electrode of the element, and in this state, each electrode of the electronic component element and each terminal of the terminal material are electrically connected to each other.

[Function] According to the above method, since the electronic component element can be sandwiched between the opposing terminal rows of the terminal material fitted from above,
The raised portion of each terminal positions the electronic component element in a direction perpendicular to the terminal row, and the pinching force prevents the electronic component element from moving in the direction along the terminal row.

Further, the tip portion of each terminal prevents the electronic component element from lifting up.

〔Example〕

1 and 2 are perspective views for explaining a manufacturing method according to an embodiment of the present invention, and FIG. 1 shows the state before the terminal material is placed on the electronic component element, and the second The figure shows the terminal material placed on it.

Components equivalent to those in the examples shown in FIGS. 3 and 4 are given the same reference numerals, and the differences from the conventional example will be mainly explained below.

In this embodiment, the following terminal material 6 is used.

That is, in the terminal material 6, a plurality of terminals 62 are provided inwardly extending from two opposing sides of the frame portion 61 in accordance with the arrangement of the electrodes 22 of the electronic component element 2 as described above, and each terminal 62, by pressing or the like, to match the outer shape of the electronic component element 2, bending the part upwards at a substantially right angle in the middle, and further bending the tip almost horizontally.
The electronic component element 2 can be sandwiched between opposing terminal rows.

Further, in this example, two auxiliary wires vi, 64 and 64 are passed between the two opposing sides of the terminal material 6 at intervals corresponding to the dimensions of the electronic component element 2.

Note that 63 is a hole through which the positioning pin 51 of the stand 5 is passed.

As shown in FIG. 1, the electronic component element 2 is placed on the stand 5 and positioned to some extent, and the terminal material 6 is
, the tip portion 62b of each terminal 62 is the electronic component element 2.
Fit (cover) each electrode 22 of
. At this time, each positioning pin 51 on the stand 5 is passed through each person 63 of the terminal material 6, respectively. The resulting state is shown in FIG.

In the state shown in FIG. 2, the electronic component element 2 (more specifically, its opposing sides) is sandwiched between the rising portions 62a of the opposing terminals 62 of the terminal material 6. Part 6
2a in a direction perpendicular to the terminal row of the electronic component element 2;
That is, positioning in the X direction in the figure is achieved, and movement of the electronic component element 2 in the direction along the terminal array, that is, in the Y direction in the figure, is also prevented by the pinching force. Further, the tip portion 62b of each terminal 62 prevents the electronic component element 2 from floating up.

Further, in this example, auxiliary plates 64 are provided at both ends of the electronic component element 2 in the Y direction at intervals corresponding to the dimensions thereof, and each auxiliary plate 64
Since the plate is in contact with the end face of the electronic component element 2 due to its thickness, movement of the electronic component element 2 in the Y direction is surely prevented.

Then, in the above state, the end portion 62b of each terminal 62 of the terminal material 6 and each electrode 22 of the electronic component element 2 are conductively joined by soldering or the like.

Therefore, with this method, the terminal material 6 connects the electronic component element 2.
Since each terminal 62 of the terminal material 6 and each electrode 22 of the electronic component element 2 can be aligned with high accuracy, the electronic component element 2 and the terminal material 6 can be sandwiched together during soldering.
It is also possible to prevent misalignment between the two. Moreover, unlike the conventional example shown in FIG. 3, this method does not require bank processing on the terminals, and is therefore effective even when there are many pins and the terminal pitch is small.

Furthermore, in the method of this embodiment, since the auxiliary plate 64 is provided on the terminal material 6, the electrode 22 of the electronic component element 2 and the terminal of the terminal material 6 can be connected only by the structure of the terminal material 6 without any jig. It is also possible to perform alignment with 62.

After the terminal material 6 is soldered to the electronic component element 2 as described above, the area around the electronic component element 2 is usually covered with resin. This prevents the electronic component element 2 from coming off. Furthermore, lifting of the electronic component element 2 when injection molding or transfer molding the resin is also prevented.

After resin sealing, a desired electronic component is obtained by cutting each terminal 62 of the terminal material 6 into an appropriate length using a press or the like, and simultaneously removing unnecessary portions of the auxiliary plate 64.

However, if the auxiliary plate 64 does not cause movement of the electronic component element 2 during resin sealing even without it, the soldering may be removed later before resin sealing.

In addition, the both-sleeve support plate 64 is not just a plate-like one, but a second
As shown by the broken line in the figure, the protruding piece 64a is bent upward.
(If this is done, the electronic component element 2 can be fixed in the Y direction more reliably regardless of the thickness of the auxiliary plate 64.

Although it is preferable to provide the auxiliary plate 64 as described above or as described above, it is preferable to sandwich the electronic component element 2 between the opposing rising portions 62a of each terminal 62 of the terminal material 6 as described above. Since the movement in the Y direction can be prevented to some extent by this, this auxiliary plate 64 is not necessarily required.

Further, the terminal material 6 may be provided with a plurality of connection points with the electronic component elements 2 as described above, so that connections with the plurality of electronic component elements 2 can be made simultaneously.

Further, although the above examples are all examples of manufacturing a so-called DIP type electronic component in which terminals are drawn out from two opposing sides, the present invention is not limited thereto. For example, an electronic component element may have a plurality of electrodes arranged side by side on each of the four edges of a nearly square board. They can be extended from each section.

〔Effect of the invention〕

As described above, according to the present invention, since the electronic component element can be sandwiched between the opposing rows of terminals of the terminal material fitted from above, each terminal of the terminal material and each electrode of the electronic component element can be connected with precision. Good positioning can be achieved, and misalignment between the electronic component element and the terminal material during conductive bonding such as soldering can be prevented.

Moreover, this method is effective even when there are many pins and the terminal pitch is small, since there is no need to perform bank processing on the terminals unlike the conventional method.

Further, even when the electronic component element is sealed with resin after the terminals are connected as described above, it is possible to prevent the electronic component element from shifting or lifting up for the same reason.

[Brief explanation of the drawing]

1 and 2 are perspective views for explaining a manufacturing method according to an embodiment of the present invention, and FIG. 1 shows the state before the terminal material is placed on the electronic component element, and the second The figure shows the terminal material placed on it. 3 and 4 are perspective views for explaining the conventional manufacturing method, respectively. 2... Electronic component element, 21... Board, 22... Electrode, 5... Stand, 6... Terminal material, 61... Frame, 6
2...Terminal.

Claims (1)

[Claims] (1) An electronic component element is prepared in which a plurality of electrodes are arranged in parallel along the edges of at least two opposite sides of the substrate, and a plurality of terminals are arranged inward from at least two opposite sides of the frame. The terminals are extended to match the electrode arrangement of the electronic component element, and each terminal is bent upward in the middle to match the external shape of the electronic component element, and then the tip is bent parallel to the electrode, thereby creating an electronic connection between the opposing terminal rows. Prepare a terminal material that can sandwich the component element, fit this terminal material over the electrical component element so that the tip of each terminal is on each electrode of the electronic component element, and A method for manufacturing an electronic component, which comprises electrically bonding each electrode of the electronic component element and each terminal of the terminal material in this state.