JP3018847B2 - Bending test method for chip components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test method for evaluating the mechanical bending strength of a chip-shaped electronic component.

[0002] Chip components surface-mounted on a printed circuit board are:
It is required that the printed circuit board is not damaged even if it bends. For this reason, in the structure of the chip part, a test in which a chip part is attached to a test board, and the board is bent to evaluate bending strength is described in JIS C 6429. [Substrate bending resistance
Test method] .

FIG. 5 shows a test board used in a conventional bending test. A pair of electrodes 2 and 2 are provided on one side of a test board 1 made of glass epoxy or the like, and a pair of electrodes 2 and 2 are provided in opposite directions. The extracted land electrodes 3 and 3 are provided.
And one side of the substrate 1 is covered with an insulating film 4 so that the land electrodes 3 and 3 are exposed.

In order to perform a bending test using the test board 1, as shown in FIG. 6, a chip component A is fixed to both electrodes 2 and 2 by soldering, and then the substrate 1 is placed so that the chip component A is on the lower side. Are supported by jigs 5, 5, and a central portion of the substrate 1 is pressed from above by a pressing member 6 to bend, and the bending strength of the chip component A is measured by a measuring device connected to the land electrodes 3, 3. Is measured.

[0005]

However, in the conventional bending test, since only one chip component can be attached to the test board, only one chip component can be tested at a time, and the work efficiency is poor. is there.

Further, when a plurality of chip components are individually subjected to a bending test, there is a problem that an error occurs in the measurement due to a change in test conditions or a test board, and the reliability of data is deteriorated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip component bending test method capable of simultaneously evaluating a plurality of chip components, improving work efficiency, reducing measurement errors, and increasing data reliability. Is to do.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a test board which is arranged in parallel on both sides in the width direction.
A plurality of slits extending Jo, the one surface of the test substrate
Provided at the center of each section divided by multiple slits
A pair of electrodes which are, and the land pattern extending on both sides of the test substrate by continuous from each of the pair of electrodes, wherein
Provided at an end of the land pattern different from the pair of electrodes.
Land electrode and the land pattern on both sides of the test board
And a protective pattern located down near provided, mount the chip components between the pair of electrodes of the test substrate, giving bending to the substrate while supporting both sides of the test substrate at a portion of the protective pattern, the land pattern This is a configuration in which a bending test of a chip component is electrically performed via the electronic component.

[0009]

The chip component is fixed between the electrodes of the test board by soldering or the like, and both sides of the board are supported by the portions of the protective pattern. When the board is bent with the supporting portion as a fulcrum, the gap between the electrodes is obtained. Bending stress acts on the fixed chip component,
If the characteristics of the chip component are measured by a measuring device connected to the land pattern, a bending test of a plurality of chip components can be performed simultaneously.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIGS. 1 to 3 show a test substrate 11 used for a bending test of a chip component. The test substrate 11 is made of, for example, a glass epoxy material having a thickness of about 1.6 mm, and is formed in a rectangular shape having a projection on one side edge. Many slits 1 that extend in the width direction on both sides
2 are provided in parallel at a fixed interval.

A pair of electrodes 13 and 13a located on both sides of a central portion and a pair of electrodes 13 and 13a are connected to each of the portions defined by the slits 12 on one surface side of the test substrate 11, respectively. Land pattern 1 extending on both sides of
Protection patterns 15 are provided on both sides of the test substrate 11 on both sides of the land patterns 14 and 14a.

The electrodes 13, 13a and the land pattern 1
4 and 14a are formed using a conductive material, and FIG.
1A, the one land pattern 14 on the left side is independently drawn out to the protruding portion 11a of the test substrate 11, and the end portions are independent land electrodes 16.

The other land pattern 14a is assembled at the side edge of the test substrate 11, and is connected to the land electrode 16a of the protrusion 11a.

The protection pattern 15 is located at a portion serving as a fulcrum when the test substrate 11 is bent, and is for preventing the land patterns 14 and 14a from being damaged, and has the same conductivity as the land patterns 14 and 14a. It is formed using a material or another insulating material.

The thickness of the protection pattern 15 is equal to or larger than the land patterns 14 and 14a.
When a conductive material is used, the land patterns 14, 14a
It is preferable to form a gap between them.

One surface of the test substrate 11 has electrodes 13,
13a and the land electrodes 16 and 16a are covered with an insulating film 17 such as a solder resist so as to be exposed.

In the test board 11, the interval between the slits 12 is set to 10 mm so that ten chip components can be tested simultaneously. However, the interval between the slits 12 and the number of fixed chip components can be arbitrarily selected. I just need.

Next, a method of a bending test using the test substrate 11 will be described.

The chip part A is fixed between the electrodes 13 and 13a of the test board 11 by soldering, as shown in FIG.
The test board 11 is set so that the chip component A faces downward, and the protection patterns 15 on both sides thereof are fixed to the jig 1.
8 and 18. In this state, the center of the upper surface of the test substrate 11 is pressed down by the pressing member 19, and the test substrate 1
When bending is applied to 1, a bending stress acts on the chip component A.

The test substrate 11 bends about the supporting portions of the jigs 18 as a fulcrum when the central portion is depressed, and the bending causes the contact portions of the jigs 18 to move.

At this time, if the land patterns 14 and 14a are in direct contact with the jigs 18 and 18, the insulating patterns 1 and 14a are caused by the frictional force acting on the contact portions.
When the jigs 18 and 18 are conductors, the land patterns 14 and 14a are in a conductive state, and the measurement of each chip component A cannot be performed. Will be.

On the other hand, in the present invention, the protection pattern 15 is located at a position sandwiching the land patterns 14 and 14a.
Is provided, so that the protection pattern 15
18 and the land patterns 14, 14a and the jig 1
8 and 18 are reduced, and the land patterns 14 and 14 are reduced.
a, and the occurrence of peeling of the insulating film 17 can be prevented, and the land patterns 14, 14a are not conducted through the jigs 18, 18.

In the test substrate 11, the portions of the electrodes 13 and 13a for fixing the chip component A are defined by the slits 12, so that when the substrate 11 is bent, the slits 12 bend independently and adjacently. There is almost no influence between the slits, and the bending stress can be reliably applied to each chip component A.

As described above, in order to measure the impedance and the like of each chip component A subjected to bending stress, a measuring device is connected to the land electrodes 16 and 16a, and the chip component A to be measured is quickly scanned by a scanner or the like. By switching, substrate 1
1 can be evaluated simultaneously.

[0026]

As described above, according to the present invention, a plurality of chip components can be evaluated by a bending test at the same time, the working efficiency of the bending test is greatly improved, the measurement error is reduced, and the reliability of data is reduced. Sex rises.

Further, by providing the protection pattern, damage to the land pattern can be prevented, and a large number of test substrates can be used, which is economically advantageous.

[Brief description of the drawings]

1A is a plan view of a test substrate, and FIG. 1B is an enlarged plan view of a part of the test substrate.

FIG. 2 is a sectional view taken along arrows II-II in FIG.

FIG. 3 is a perspective view showing a part of a test board.

FIG. 4 is a front view showing a bent state of the test substrate.

FIG. 5 is a test board used for a conventional bending test.

FIG. 6 is a front view showing measurement of bending strength of a conventional test substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Test board 12 Slit 13 and 13a Electrode 14 and 14a Land pattern 15 Protection pattern 17 Insulating film 18 Jig 19 Press member

Claims (2)

(57) [Claims] To 1. A test substrate, a plurality of slits Ru <br/> extend on both sides widthwise in parallel form, provided in a central portion of each of the portions partitioned by the plurality of slits in one surface of the test substrate as an <br/> pair of electrodes, and the land pattern extending on both sides of the test substrate by continuous from each of the pair of electrodes, said Randopa
A run provided at a different end of the turn from the pair of electrodes.
And cathode electrode, and a protective pattern <br/> located on the land pattern near the opposite sides of the test substrate is provided, wherein the test substrate-
A chip component is mounted between a pair of electrodes, bending is applied to the test substrate while both sides of the test substrate are supported by the protection pattern portion, and a bending test of the chip component is performed electrically via a land pattern. Test method for chip components. 2. The method according to claim 1, wherein the protection pattern has a thickness equal to that of the land.
It is formed equal to or thicker than the pattern
2. The bending test method for a chip component according to claim 1, wherein
Law .