JPS6313666Y2 - - Google Patents
Info
- Publication number
- JPS6313666Y2 JPS6313666Y2 JP1981190750U JP19075081U JPS6313666Y2 JP S6313666 Y2 JPS6313666 Y2 JP S6313666Y2 JP 1981190750 U JP1981190750 U JP 1981190750U JP 19075081 U JP19075081 U JP 19075081U JP S6313666 Y2 JPS6313666 Y2 JP S6313666Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- electronic component
- lead
- leads
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 31
- 239000012212 insulator Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 7
Description
【考案の詳細な説明】
本考案は小型電子機器において配線基板上に配
置された棒状のコネクタと電子部品とを接続する
構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for connecting a rod-shaped connector arranged on a wiring board and an electronic component in a small electronic device.
例えば小型電子式計算機において、LSI（大規
模集積回路）などのリードを突設した電子部品を
配線基板の配線パターンに接続するために、導電
体と絶縁体を交互に並べて積層してなる棒状のコ
ネクタを配線基板上に配置し、このコネクタの導
電体と配線基板の配線パターンとを接触させ、ま
た電子部品のリードをコネクタ上に配置してコネ
クタの導電体と接触させ、さらに押え具により電
子部品の上側から押圧力を加えてリード、コネク
タおよび配線基板を一体に押圧保持する構造が採
用されている。 For example, in small electronic calculators, in order to connect electronic components such as LSIs (Large Scale Integrated Circuits) with protruding leads to the wiring pattern on a wiring board, a rod-shaped device made of alternating layers of conductors and insulators is used. A connector is placed on the wiring board, the conductor of this connector is brought into contact with the wiring pattern of the wiring board, the leads of electronic components are placed on the connector and brought into contact with the conductor of the connector, and the electronic parts are A structure is adopted in which pressing force is applied from above the components to press and hold the leads, connector, and wiring board together.
しかして、この接続構造においては、通常電子
部品のパツケージの周縁部には多数のリードが並
べて突設されており、これに応じてコネクタの導
電体も多数並べて積層されるために、電子部品の
各リードとコネクタの各導電体とを正確に位置決
めして接続することが困難で、そのための組立作
業も大変である。また、押え具により電子部品を
上側から押圧するだけであると、リードがコネク
タ上を滑つて位置ずれを生じ易く、リードと導電
体との接続位置が変化してしまうことがある。 However, in this connection structure, a large number of leads are usually arranged and protruded from the periphery of the package of the electronic component, and accordingly, a large number of conductors of the connector are also stacked in a row. It is difficult to accurately position and connect each lead and each conductor of the connector, and the assembly work for this purpose is also difficult. Furthermore, if the electronic component is only pressed from above with the presser, the leads tend to slip on the connector and become misaligned, which may change the connection position between the leads and the conductor.
また、電子部品のパツケージの周縁部に複数の
棒状コネクタを配置する構造では、コネクタの間
隔や平行度を揃える手間も大変である。 Furthermore, in a structure in which a plurality of rod-shaped connectors are arranged around the periphery of an electronic component package, it takes a lot of effort to align the spacing and parallelism of the connectors.
本考案は前記事情に鑑みてなされたもので、電
子部品の各リードとコネクタの各導電体との位置
決めを容易且つ正確に行なえるとともに、リード
の位置ずれを防止して導電体との接触を確実に保
持でき且つコネクタの取付けも能率的に行なうこ
とができる電子部品とコネクタとの接続構造を提
供するものである。 The present invention was developed in view of the above-mentioned circumstances, and allows for easy and accurate positioning of each lead of an electronic component and each conductor of a connector, as well as preventing misalignment of the leads and preventing contact with the conductor. An object of the present invention is to provide a connection structure between an electronic component and a connector, which can be held securely and the connector can be mounted efficiently.
すなわち、本考案の接続構造は、電子部品のパ
ツケージの周囲を取り囲むように枠状に形成され
たコネクタに、電子部品の各リードに対応して導
電体が位置する複数個所に夫々凹部を形成し、こ
の凹部に電子部品のリードを嵌合することによ
り、リードをコネクタの導電体に対し位置決めし
て接触するとともにリードが位置ずれしないよう
に移動を防止したものである。 That is, in the connection structure of the present invention, recesses are formed in a connector formed in a frame shape so as to surround the periphery of a package of electronic components at a plurality of locations where conductors are located corresponding to each lead of the electronic component. By fitting the lead of the electronic component into this recess, the lead is positioned and brought into contact with the conductor of the connector, and the lead is prevented from shifting.
以下本考案を図面で示す実施例について説明す
る。 Embodiments of the present invention will be described below with reference to drawings.
第１図ないし第３図は本考案の電子部品とコネ
クタとの接続構造の一実施例を示すものであり、
例えば小型電子式計算機に適用される。図中１は
例えばLSI（大規模集積回路）である電子部品で、
この電子部品１は薄い角形をなすパツケージ２の
各周縁部に夫々複数のリード３が所定間隔を存し
て周縁部方向に並べて突設してある。このリード
３は例えば先端部が下側に段状に折曲されたもの
である。図中４はコネクタで、このコネクタ４は
例えば棒状をなす４個のコネクタ４1，４2，４3，
４4を電子部品１におけるパツケージ２の各周縁
部に夫々対応してその周縁部方向に沿うように配
置し一体に連結して形成したものである。すなわ
ち、コネクタ４はパツケージ２の周縁部周囲を囲
む角形枠体をなしている。これら棒状をなすコネ
クタ４1〜４4は、導電ゴムなどからなる角板状の
複数の導電体５と絶縁ゴムなどからなる角板状の
複数の絶縁体６を交互に位置するように一列に並
べて積層し一体化したものであり、両端部には棒
状の絶縁体６を一体に設けている。各コネクタ４
１〜４4は互に両端部の絶縁体６を一体に形成して
連結してある。コネクタ４1〜４4における導電体
５は、電子部品１におけるパツケージ２の周縁部
に設けられた各リード３に夫々対応するようにリ
ード３の数と配置間隔に相当する数と配置間隔を
もつて並べられ、且つコネクタ４1〜４4における
絶縁体６はパツケージ２の周縁部に設けられた各
リード３の隙間に夫々対応するようにリード３の
隙間の数に相当する数をもつて並べられている。
また、、各コネクタ４1〜４4の上側部には、電子
部品１におけるパツケージ２の周縁部に設けられ
た各リード３に対応してコネクタ軸方向に間隔を
存して並び且つ導電体５が位置する複数の個所に
夫々凹部７が形成してある。すなわち、凹部７は
コネクタ４1〜４4の軸方向に並べて配置されてい
る各導電体５の上部を夫々凹状に切欠することに
より、各絶縁体６に隔てられてコネクタ軸方向に
並べて形成されている。この凹部７は両側部に絶
縁体６，６が位置するとともに底部に導電体５が
位置して構成されている。なお、導電体５の厚さ
および長さをリード３の先端部に対応した大きさ
とするとともに、凹部７の深さをリード３の先端
部の厚さに対応した大きさとする。すなわち、凹
部７はその内部にリード３の先端部を嵌合できる
大きさとする。 1 to 3 show an embodiment of a connection structure between an electronic component and a connector according to the present invention,
For example, it is applied to small electronic calculators. 1 in the figure is an electronic component, for example an LSI (Large Scale Integrated Circuit).
In this electronic component 1, a plurality of leads 3 are provided on each peripheral edge of a thin rectangular package 2 and are arranged and protruding in the direction of the peripheral edge at a predetermined interval. The lead 3 has, for example, a tip bent downward into a step shape. In the figure, 4 is a connector, and this connector 4 includes, for example, four rod-shaped connectors 4 1 , 4 2 , 4 3 ,
4 4 are arranged along the peripheral edge direction of the package 2 in the electronic component 1 so as to correspond to each peripheral edge of the package 2, and are integrally connected to each other. That is, the connector 4 forms a rectangular frame surrounding the periphery of the package 2. These rod-shaped connectors 4 1 to 4 4 have a plurality of rectangular plate-shaped conductors 5 made of conductive rubber or the like and a plurality of rectangular plate-shaped insulators 6 made of insulating rubber etc. arranged in a row so as to be alternately positioned. They are stacked side by side and integrated, and rod-shaped insulators 6 are integrally provided at both ends. Each connector 4
1 to 4 4 are connected to each other by integrally forming insulators 6 at both ends. The conductors 5 in the connectors 4 1 to 4 4 have a number and arrangement spacing corresponding to the number and arrangement spacing of the leads 3 so as to correspond to each lead 3 provided on the periphery of the package 2 in the electronic component 1. The insulators 6 in the connectors 4 1 to 4 4 are arranged in a number corresponding to the number of gaps between the leads 3 so as to correspond to the gaps between the leads 3 provided on the periphery of the package 2. It is being
Further, on the upper side of each connector 4 1 to 4 4 , conductors 5 are arranged at intervals in the axial direction of the connector corresponding to the leads 3 provided on the peripheral edge of the package 2 in the electronic component 1 . Recesses 7 are formed at a plurality of locations, respectively. That is, the recesses 7 are formed so as to be separated by the insulators 6 and arranged in the axial direction of the connectors by cutting out the upper parts of the conductors 5 arranged in the axial direction of the connectors 4 1 to 4 4 in a concave shape. ing. This recess 7 has insulators 6, 6 located on both sides and a conductor 5 located at the bottom. The thickness and length of the conductor 5 are made to correspond to the tip end of the lead 3, and the depth of the recess 7 is made to be a size corresponding to the thickness of the tip end of the lead 3. That is, the recess 7 is made large enough to fit the tip of the lead 3 therein.
そして、コネクタ４は例えば小型電子式計算機
のケース内部に設けられた配置された配線基板８
の板面上に配置されている。配線基板８は板面上
に所定の配線パターンが形成されたもので、電子
部品１の配置個所の周囲すなわちコネクタ４の配
置個所には各コネクタ４1〜４4に設けられた各導
電体５に夫々対応して接点９が形成されている。
この接点９は他の回路に接続されている。コネク
タ４は配線基板８の板面上のコネクタ配置個所に
配置され、各コネクタ４1〜４4に設けられた各導
電体５の下面を配線基板８の接点９上に重ねて接
触している。また、電子部品１は配線基板８にお
ける電子部品配置個所の上方すなわち配線基板８
上に配置されたコネクタ４で囲まれる個所の上方
に配置される。電子部品１のパツケージ２の各周
縁部に並べて設けられた各リード３の先端部は、
コネクタ４の各コネクタ４1〜４4の上側部に夫々
並べて形成されている各凹部７内に嵌合されてい
る。なお、リード３は凹部７の上側から嵌合され
る。凹部５内に嵌合されたリード３の先端部は、
その下面が凹部５内の底部を構成する導電体５の
上面に上側から重ねて接触され、且つ凹部５の両
側部を構成する絶縁体６によりコネクタ軸方向へ
の移動を阻止されている。なお、電子部品１のパ
ツケージ２はリード３を介してコネクタ４により
支持されている。さらに、コネクタ４の凹部７に
嵌合されたリード３の先端部は押え具１０に設け
られた弾性部材１１により上側から押圧されてい
る。押え具１０は電子部品１の上方に設けられた
例えば板状をなすもので、その四隅部に形成した
脚部１０ａを配線基板８に形成した貫通孔１２に
通すとともに脚部１０ａの先端を配線基板８の下
面に係止することにより配線基板８に取付けられ
ている。押え具１０の下面にはコネクタ４の各コ
ネクタ４1〜４4に対応して角形枠状をなす弾性部
材１１が取付けられ、この弾性部材１１が電子部
品１の各リード２を上側から押圧している。この
ため、各リード２の先端部は弾性部材１１に押圧
されてコネクタ４の各導電体５の上面に確実に接
触し、また各導電体５の下面はリード２に押圧さ
れて配線基板８上の各接点９上に確実に接触す
る。導電体５は導電ゴムで形成されていればその
弾性によりリード３と接点９に夫々確実に接触す
る。また、リード３が弾性部材１１とコネクタ４
との間で挾持されることにより電子部品１も固定
される。 The connector 4 is, for example, a wiring board 8 provided inside the case of a small electronic calculator.
is placed on the board surface. The wiring board 8 has a predetermined wiring pattern formed on the board surface, and each conductor 5 provided on each of the connectors 4 1 to 4 4 is placed around the location where the electronic component 1 is arranged, that is, where the connector 4 is arranged. Contact points 9 are formed corresponding to each.
This contact 9 is connected to another circuit. The connector 4 is arranged at the connector arrangement location on the board surface of the wiring board 8, and the lower surface of each conductor 5 provided on each connector 4 1 to 4 4 overlaps and contacts the contact 9 of the wiring board 8. . Further, the electronic component 1 is located above the electronic component placement location on the wiring board 8, that is, on the wiring board 8.
It is placed above the area surrounded by the connector 4 placed above. The tips of the leads 3 arranged on each peripheral edge of the package 2 of the electronic component 1 are as follows:
The connectors 4 are fitted into respective recesses 7 formed side by side on the upper side of each of the connectors 4 1 to 4 4 . Note that the lead 3 is fitted into the recess 7 from above. The tip of the lead 3 fitted into the recess 5 is
Its lower surface contacts the upper surface of the conductor 5 constituting the bottom of the recess 5 from above, and is prevented from moving in the axial direction of the connector by the insulator 6 constituting both sides of the recess 5. Note that the package 2 of the electronic component 1 is supported by a connector 4 via a lead 3. Furthermore, the tip of the lead 3 fitted into the recess 7 of the connector 4 is pressed from above by an elastic member 11 provided on the presser 10. The holding tool 10 is provided above the electronic component 1 and has a plate shape, for example. Legs 10a formed at the four corners of the holding tool 10 are passed through through holes 12 formed in the wiring board 8, and the tips of the legs 10a are connected to the wiring. It is attached to the wiring board 8 by being engaged with the lower surface of the board 8. A rectangular frame-shaped elastic member 11 is attached to the lower surface of the holding tool 10 in correspondence with each connector 4 1 to 4 4 of the connector 4, and this elastic member 11 presses each lead 2 of the electronic component 1 from above. ing. Therefore, the tip of each lead 2 is pressed by the elastic member 11 and securely contacts the upper surface of each conductor 5 of the connector 4, and the lower surface of each conductor 5 is pressed by the lead 2 and placed on the wiring board 8. The contact point 9 is securely contacted. If the conductor 5 is made of conductive rubber, its elasticity allows it to reliably contact the lead 3 and the contact 9, respectively. In addition, the lead 3 is connected to the elastic member 11 and the connector 4.
The electronic component 1 is also fixed by being held between the two.
しかして、このような電子部品１とコネクタ４
との接続構造においては、電子部品１のリード３
の先端部をコネクタ４の凹部７内に嵌合すること
により、リード３をコネクタ４における導電体５
が存在する個所に直接位置決めして導電体５と接
触させることができ、また棒状のコネクタ４1，
４2，４3，４4が一体に連結して形成された枠状
のコネクタ４は、配線基板８上の各接点９に位置
合わせさえすれば、各棒状のコネクタ４1，４2，
４3，４4の間隔や平行度を揃える手間は必要がな
い。 However, such electronic component 1 and connector 4
In the connection structure with the lead 3 of the electronic component 1,
By fitting the tip of the lead 3 into the recess 7 of the connector 4, the lead 3 is connected to the conductor 5 of the connector 4.
The rod-shaped connector 4 1 ,
The frame-shaped connector 4 formed by integrally connecting 4 2 , 4 3 , 4 4 can be connected to each rod-shaped connector 4 1 , 4 2 , as long as it is aligned with each contact 9 on the wiring board 8.
There is no need to go through the trouble of adjusting the spacing and parallelism of 4 3 and 4 4 .
なお、コネクタ４は前述したように電子部品１
のリード３の幅と略同じ大きさの厚さを有する導
電体５をリード３に対応して夫々設ける構造に限
定されず、第４図で示すようにリード３の幅より
小さな厚さを有する薄肉の導電体５を同様に薄肉
の絶縁体６を介して多数並べて積層する構造にし
ても良く、この場合には凹部７を導電体５の位置
に限定されずに形成できる。 Note that the connector 4 is connected to the electronic component 1 as described above.
The present invention is not limited to the structure in which a conductor 5 having a thickness approximately the same as the width of the lead 3 is provided corresponding to each lead 3, and the conductor 5 has a thickness smaller than the width of the lead 3 as shown in FIG. A structure may be adopted in which a large number of thin conductors 5 are similarly stacked side by side with thin insulators 6 interposed therebetween, and in this case, the recesses 7 can be formed without being limited to the positions of the conductors 5.
また、押え具１０の構造は実施例に限定されな
い。 Further, the structure of the presser 10 is not limited to the embodiment.
本考案の電子部品とコネクタとの接続構造は以
上説明したように、電子部品のリードをコネクタ
の凹部に嵌合する簡単な操作により、リードをコ
ネクタの導電体と接触する個所に容易且つ確実に
位置決めすることができ、しかも、枠状のコネク
タは配線基板の各接点に対して能率的に位置決め
して取付けることができる。 As explained above, the connection structure between the electronic component and the connector of the present invention allows the lead of the electronic component to be easily and reliably connected to the part of the connector where it contacts the conductor by a simple operation of fitting the lead of the electronic component into the recess of the connector. Moreover, the frame-shaped connector can be efficiently positioned and attached to each contact point of the wiring board.
第１図ないし第３図は夫々本考案の接続構造の
一実施例を示すもので、第１図は分解斜視図、第
２図は接続状態を示す側面断面図、第３図はリー
ドとコネクタとの接続部を拡大して示す断面図、
第４図はコネクタの他の実施例を示す側面図であ
る。
１……電子部品、２……パツケージ、３……リ
ード、４……コネクタ、４1〜４4……コネクタ、
５……導電体、６……絶縁体、７……凹部、８…
…配線基板、９……接点、１０……押え具、１１
……弾性部材。
Figures 1 to 3 each show an embodiment of the connection structure of the present invention, with Figure 1 being an exploded perspective view, Figure 2 being a side sectional view showing the connected state, and Figure 3 being the lead and connector. A cross-sectional view showing an enlarged connection with the
FIG. 4 is a side view showing another embodiment of the connector. 1...Electronic component, 2...Package, 3...Lead, 4...Connector, 4 1 to 4 4 ...Connector,
5... Conductor, 6... Insulator, 7... Recess, 8...
...Wiring board, 9... Contact, 10... Holder, 11
...Elastic member.
Claims (1)
対向する一対の周縁部に並べて突設された複数の
リードを有する電子部品と、 前記電子部品の各リードに対向する複数の接点
を有する配線基板と、 前記電子部品と前記配線基板との間に配置さ
れ、導電体と絶縁体とが、少なくとも前記導電体
の１つが前記電子部品の各リードに対向されて、
前記リードの並び方向に交互に積層されるととも
に前記リードに対向して該リードを嵌合する凹部
が設けられ、且つ、前記電子部品のパツケージの
周囲を取り囲む枠状に形成されたコネクタと、 前記コネクタの凹部に嵌合された前記電子部品
のリードを前記コネクタを介して前記配線基板に
押圧する押え具と、 を具備してなる電子部品とコネクタとの接続構
造。[Claims for Utility Model Registration] A package, an electronic component having a plurality of leads juxtaposed and protruding from at least a pair of opposing peripheral edges of the package, and a plurality of contacts facing each lead of the electronic component. a wiring board; a conductor and an insulator disposed between the electronic component and the wiring board; at least one of the conductors faces each lead of the electronic component;
a frame-shaped connector that is alternately stacked in the direction in which the leads are arranged, is provided with a recess facing the leads and into which the leads are fitted, and that surrounds the periphery of the package of the electronic component; A connection structure between an electronic component and a connector, comprising: a presser for pressing a lead of the electronic component fitted into a recess of the connector onto the wiring board via the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981190750U JPS5895580U (en) | 1981-12-21 | 1981-12-21 | Connection structure between electronic components and connectors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981190750U JPS5895580U (en) | 1981-12-21 | 1981-12-21 | Connection structure between electronic components and connectors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5895580U JPS5895580U (en) | 1983-06-29 |
| JPS6313666Y2 true JPS6313666Y2 (en) | 1988-04-18 |
Family
ID=30104261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981190750U Granted JPS5895580U (en) | 1981-12-21 | 1981-12-21 | Connection structure between electronic components and connectors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5895580U (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144786U (en) * | 1984-08-27 | 1986-03-25 | 第一精工株式会社 | IC package socket |
| JPH0217430Y2 (en) * | 1984-09-17 | 1990-05-15 | ||
| JPH0414876Y2 (en) * | 1986-08-01 | 1992-04-03 | ||
| JPH0414877Y2 (en) * | 1986-08-01 | 1992-04-03 | ||
| JP2783075B2 (en) * | 1992-08-20 | 1998-08-06 | 日本電気株式会社 | Integrated circuit package assembly |
| JP3240793B2 (en) * | 1993-12-15 | 2001-12-25 | ソニー株式会社 | Probe assembly, method for manufacturing the same, and probe card for IC measurement using the same |
| WO2007007627A1 (en) * | 2005-07-11 | 2007-01-18 | Matsushita Electric Industrial Co., Ltd. | Substrate connecting member and connecting structure |
| JP5715482B2 (en) * | 2011-05-17 | 2015-05-07 | 日本信号株式会社 | PCB for surface mounting |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5676116A (en) * | 1979-11-22 | 1981-06-23 | Shinetsu Polymer Co | Method of manufacturing electric part having elastomer part |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741977Y2 (en) * | 1977-11-22 | 1982-09-14 |
-
1981
- 1981-12-21 JP JP1981190750U patent/JPS5895580U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5676116A (en) * | 1979-11-22 | 1981-06-23 | Shinetsu Polymer Co | Method of manufacturing electric part having elastomer part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5895580U (en) | 1983-06-29 |
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