JPS6238414B2 - - Google Patents

Info

Publication number
JPS6238414B2
JPS6238414B2 JP59168684A JP16868484A JPS6238414B2 JP S6238414 B2 JPS6238414 B2 JP S6238414B2 JP 59168684 A JP59168684 A JP 59168684A JP 16868484 A JP16868484 A JP 16868484A JP S6238414 B2 JPS6238414 B2 JP S6238414B2
Authority
JP
Japan
Prior art keywords
wire
copper alloy
alloy wire
copper
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59168684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6148543A (ja
Inventor
Kazuo Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP59168684A priority Critical patent/JPS6148543A/ja
Publication of JPS6148543A publication Critical patent/JPS6148543A/ja
Publication of JPS6238414B2 publication Critical patent/JPS6238414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP59168684A 1984-08-10 1984-08-10 半導体素子結線用銅合金線 Granted JPS6148543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168684A JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168684A JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Publications (2)

Publication Number Publication Date
JPS6148543A JPS6148543A (ja) 1986-03-10
JPS6238414B2 true JPS6238414B2 (index.php) 1987-08-18

Family

ID=15872552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168684A Granted JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Country Status (1)

Country Link
JP (1) JPS6148543A (index.php)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61113740A (ja) * 1984-11-09 1986-05-31 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61258463A (ja) * 1985-05-13 1986-11-15 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPH0747791B2 (ja) * 1985-10-18 1995-05-24 住友電気工業株式会社 ボンデイングワイヤ
JPH0785483B2 (ja) * 1986-07-15 1995-09-13 株式会社東芝 半導体装置
TWI287282B (en) 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
SG190482A1 (en) * 2011-12-01 2013-06-28 Heraeus Materials Tech Gmbh Doped 4n copper wire for bonding in microelectronics device
SG11201608819VA (en) * 2014-04-21 2016-12-29 Nippon Steel & Sumikin Mat Co Bonding wire for semiconductor device
TWI550638B (zh) 2015-02-26 2016-09-21 日鐵住金新材料股份有限公司 Connecting wires for semiconductor devices
WO2016189752A1 (ja) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2016189758A1 (ja) 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2016203659A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP5912008B1 (ja) 2015-06-15 2016-04-27 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP5893230B1 (ja) 2015-07-23 2016-03-23 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6002337B1 (ja) * 2015-08-12 2016-10-05 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
TW202143414A (zh) * 2015-12-15 2021-11-16 日商日鐵化學材料股份有限公司 半導體裝置用接合線
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2019031497A1 (ja) * 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
KR102187539B1 (ko) 2017-12-28 2020-12-07 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
JP7637063B2 (ja) 2019-12-02 2025-02-27 日鉄マイクロメタル株式会社 半導体装置用銅ボンディングワイヤ及び半導体装置
PH12022552004A1 (en) 2020-02-21 2024-02-05 Nippon Micrometal Corp Copper bonding wire
WO2022270051A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20240026927A (ko) 2021-06-25 2024-02-29 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
US20240290744A1 (en) 2021-06-25 2024-08-29 Nippon Micrometal Corporation Bonding wire for semiconductor devices
US11929343B2 (en) 2021-06-25 2024-03-12 Nippon Micrometal Corporation Bonding wire for semiconductor devices
CN115803856B (zh) 2021-06-25 2023-08-18 日铁新材料股份有限公司 半导体装置用接合线
US12166006B2 (en) 2022-06-24 2024-12-10 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor devices
JPWO2023249037A1 (index.php) 2022-06-24 2023-12-28
WO2024247286A1 (ja) 2023-05-30 2024-12-05 日鉄マイクロメタル株式会社 ボンディングワイヤ
CN119452459A (zh) 2023-05-30 2025-02-14 日铁新材料股份有限公司 接合线

Also Published As

Publication number Publication date
JPS6148543A (ja) 1986-03-10

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