JPS6231496B2 - - Google Patents

Info

Publication number
JPS6231496B2
JPS6231496B2 JP53144208A JP14420878A JPS6231496B2 JP S6231496 B2 JPS6231496 B2 JP S6231496B2 JP 53144208 A JP53144208 A JP 53144208A JP 14420878 A JP14420878 A JP 14420878A JP S6231496 B2 JPS6231496 B2 JP S6231496B2
Authority
JP
Japan
Prior art keywords
dam
resin
frame
resin mold
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53144208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5571047A (en
Inventor
Juji Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14420878A priority Critical patent/JPS5571047A/ja
Publication of JPS5571047A publication Critical patent/JPS5571047A/ja
Publication of JPS6231496B2 publication Critical patent/JPS6231496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP14420878A 1978-11-24 1978-11-24 Lead frame for resin mold Granted JPS5571047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14420878A JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14420878A JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59152891A Division JPS6035550A (ja) 1984-07-25 1984-07-25 レジンモールド装置の製法

Publications (2)

Publication Number Publication Date
JPS5571047A JPS5571047A (en) 1980-05-28
JPS6231496B2 true JPS6231496B2 (https=) 1987-07-08

Family

ID=15356734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14420878A Granted JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Country Status (1)

Country Link
JP (1) JPS5571047A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
EP1068640A1 (de) 1998-04-06 2001-01-17 Infineon Technologies AG Verwendung der baulichen beschaffenheit eines elektronischen bauteils als referenz bei der positionierung des bauteils
DE10058622A1 (de) 2000-11-15 2002-05-29 Vishay Semiconductor Gmbh Gemouldetes elektronisches Bauelement
DE10058608A1 (de) 2000-11-25 2002-05-29 Vishay Semiconductor Gmbh Leiterstreifenanordnung für ein gemouldetes elektronisches Bauelement und Verfahren zum Moulden

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558923Y2 (https=) * 1973-09-17 1980-02-27
JPS511072A (en) * 1974-06-21 1976-01-07 Fujitsu Ltd Jushifujigatahandotaisochino seizohoho
JPS523358U (https=) * 1975-06-24 1977-01-11

Also Published As

Publication number Publication date
JPS5571047A (en) 1980-05-28

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