JPH0554264B2 - - Google Patents

Info

Publication number
JPH0554264B2
JPH0554264B2 JP57047383A JP4738382A JPH0554264B2 JP H0554264 B2 JPH0554264 B2 JP H0554264B2 JP 57047383 A JP57047383 A JP 57047383A JP 4738382 A JP4738382 A JP 4738382A JP H0554264 B2 JPH0554264 B2 JP H0554264B2
Authority
JP
Japan
Prior art keywords
gate
resin
mold
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57047383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58165358A (ja
Inventor
Takashi Nakagawa
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57047383A priority Critical patent/JPS58165358A/ja
Publication of JPS58165358A publication Critical patent/JPS58165358A/ja
Publication of JPH0554264B2 publication Critical patent/JPH0554264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57047383A 1982-03-26 1982-03-26 半導体装置の製造方法およびそれに用いるリ−ドフレ−ム Granted JPS58165358A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57047383A JPS58165358A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法およびそれに用いるリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57047383A JPS58165358A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法およびそれに用いるリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58165358A JPS58165358A (ja) 1983-09-30
JPH0554264B2 true JPH0554264B2 (https=) 1993-08-12

Family

ID=12773573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57047383A Granted JPS58165358A (ja) 1982-03-26 1982-03-26 半導体装置の製造方法およびそれに用いるリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58165358A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100572393B1 (ko) * 1998-12-30 2006-08-30 삼성전자주식회사 비지에이 패키지용 인쇄회로기판_

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS57128148U (https=) * 1981-02-04 1982-08-10

Also Published As

Publication number Publication date
JPS58165358A (ja) 1983-09-30

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