JPS6347270B2 - - Google Patents

Info

Publication number
JPS6347270B2
JPS6347270B2 JP57010452A JP1045282A JPS6347270B2 JP S6347270 B2 JPS6347270 B2 JP S6347270B2 JP 57010452 A JP57010452 A JP 57010452A JP 1045282 A JP1045282 A JP 1045282A JP S6347270 B2 JPS6347270 B2 JP S6347270B2
Authority
JP
Japan
Prior art keywords
tie bar
lead
leads
cutting
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57010452A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58127356A (ja
Inventor
Teruyuki Koga
Ryoji Arikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON TEKISASU INSUTSURUMENTSU KK
Original Assignee
NIPPON TEKISASU INSUTSURUMENTSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON TEKISASU INSUTSURUMENTSU KK filed Critical NIPPON TEKISASU INSUTSURUMENTSU KK
Priority to JP57010452A priority Critical patent/JPS58127356A/ja
Publication of JPS58127356A publication Critical patent/JPS58127356A/ja
Publication of JPS6347270B2 publication Critical patent/JPS6347270B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57010452A 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム Granted JPS58127356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57010452A JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57010452A JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58127356A JPS58127356A (ja) 1983-07-29
JPS6347270B2 true JPS6347270B2 (https=) 1988-09-21

Family

ID=11750529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57010452A Granted JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58127356A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260142A (ja) * 1984-06-06 1985-12-23 Shinko Electric Ind Co Ltd リ−ドフレ−ム
JPS6169840U (https=) * 1984-10-11 1986-05-13
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
JPS6265848U (https=) * 1985-10-16 1987-04-23
JPS62160553U (https=) * 1986-04-02 1987-10-13
JP2580740B2 (ja) * 1988-10-13 1997-02-12 日本電気株式会社 リードフレーム
JPH0715918B2 (ja) * 1990-03-15 1995-02-22 新日本製鐵株式会社 半導体チップ実装用リード構造体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524451A (en) * 1978-08-08 1980-02-21 Nec Kyushu Ltd Lead frame for semiconductor
JPS5665665U (https=) * 1979-10-25 1981-06-01
JPS5669852A (en) * 1979-11-09 1981-06-11 Mitsubishi Electric Corp Lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS58127356A (ja) 1983-07-29

Similar Documents

Publication Publication Date Title
KR100809818B1 (ko) 반도체 장치의 제조 방법
CN1312768C (zh) 引线架、树脂密封模型及使用它们的半导体
KR20030031843A (ko) 리드프레임 및 그 리드프레임을 사용한 반도체 장치의제조 방법
JPH05226564A (ja) 半導体装置
US5424577A (en) Lead frame for semiconductor device
JP2912134B2 (ja) 半導体装置
CN103681379A (zh) 半导体装置的制造方法和半导体装置
JPS6347270B2 (https=)
KR100679598B1 (ko) 반도체 장치 및 그 제조 방법
JPH09129808A (ja) 樹脂封止型半導体装置およびその製造方法
JP2008113021A (ja) 半導体装置の製造方法
JP2580740B2 (ja) リードフレーム
JP2007294715A (ja) 半導体装置の製造方法
JP2866816B2 (ja) リードフレーム
JPS6084850A (ja) リ−ドフレ−ム
JPS6214451A (ja) リ−ドフレ−ム
JP4294034B2 (ja) 半導体装置
JP3566869B2 (ja) 半導体装置及び半導体装置の製造方法
JPH02170454A (ja) リードフレーム
JP6264193B2 (ja) モールドパッケージ
JPS63308358A (ja) リ−ドフレ−ム
JP4225990B2 (ja) 半導体装置の製造方法
JP2002026192A (ja) リードフレーム
JPS6197955A (ja) リ−ドフレ−ム
KR20040054087A (ko) 트림 장치