JPS58127356A - 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム - Google Patents

半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Info

Publication number
JPS58127356A
JPS58127356A JP57010452A JP1045282A JPS58127356A JP S58127356 A JPS58127356 A JP S58127356A JP 57010452 A JP57010452 A JP 57010452A JP 1045282 A JP1045282 A JP 1045282A JP S58127356 A JPS58127356 A JP S58127356A
Authority
JP
Japan
Prior art keywords
tie bar
lead
leads
tie
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57010452A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347270B2 (https=
Inventor
Teruyuki Koga
古賀　照幸
Ryoji Arikawa
有川　良治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Japan Ltd
Original Assignee
Texas Instruments Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Japan Ltd filed Critical Texas Instruments Japan Ltd
Priority to JP57010452A priority Critical patent/JPS58127356A/ja
Publication of JPS58127356A publication Critical patent/JPS58127356A/ja
Publication of JPS6347270B2 publication Critical patent/JPS6347270B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57010452A 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム Granted JPS58127356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57010452A JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57010452A JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58127356A true JPS58127356A (ja) 1983-07-29
JPS6347270B2 JPS6347270B2 (https=) 1988-09-21

Family

ID=11750529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57010452A Granted JPS58127356A (ja) 1982-01-26 1982-01-26 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58127356A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260142A (ja) * 1984-06-06 1985-12-23 Shinko Electric Ind Co Ltd リ−ドフレ−ム
JPS6169840U (https=) * 1984-10-11 1986-05-13
JPS6265848U (https=) * 1985-10-16 1987-04-23
JPS62160553U (https=) * 1986-04-02 1987-10-13
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
JPH02105448A (ja) * 1988-10-13 1990-04-18 Nec Corp リードフレーム
US5137479A (en) * 1990-03-15 1992-08-11 Nippon Steel Corporation Lead structure for packaging semiconductor chip

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524451A (en) * 1978-08-08 1980-02-21 Nec Kyushu Ltd Lead frame for semiconductor
JPS5665665U (https=) * 1979-10-25 1981-06-01
JPS5669852A (en) * 1979-11-09 1981-06-11 Mitsubishi Electric Corp Lead frame for semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524451A (en) * 1978-08-08 1980-02-21 Nec Kyushu Ltd Lead frame for semiconductor
JPS5665665U (https=) * 1979-10-25 1981-06-01
JPS5669852A (en) * 1979-11-09 1981-06-11 Mitsubishi Electric Corp Lead frame for semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260142A (ja) * 1984-06-06 1985-12-23 Shinko Electric Ind Co Ltd リ−ドフレ−ム
JPS6169840U (https=) * 1984-10-11 1986-05-13
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
JPS6265848U (https=) * 1985-10-16 1987-04-23
JPS62160553U (https=) * 1986-04-02 1987-10-13
JPH02105448A (ja) * 1988-10-13 1990-04-18 Nec Corp リードフレーム
US5137479A (en) * 1990-03-15 1992-08-11 Nippon Steel Corporation Lead structure for packaging semiconductor chip

Also Published As

Publication number Publication date
JPS6347270B2 (https=) 1988-09-21

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