JPS5571047A - Lead frame for resin mold - Google Patents

Lead frame for resin mold

Info

Publication number
JPS5571047A
JPS5571047A JP14420878A JP14420878A JPS5571047A JP S5571047 A JPS5571047 A JP S5571047A JP 14420878 A JP14420878 A JP 14420878A JP 14420878 A JP14420878 A JP 14420878A JP S5571047 A JPS5571047 A JP S5571047A
Authority
JP
Japan
Prior art keywords
dam
domain
flash
resin mold
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14420878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6231496B2 (https=
Inventor
Yuji Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14420878A priority Critical patent/JPS5571047A/ja
Publication of JPS5571047A publication Critical patent/JPS5571047A/ja
Publication of JPS6231496B2 publication Critical patent/JPS6231496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP14420878A 1978-11-24 1978-11-24 Lead frame for resin mold Granted JPS5571047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14420878A JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14420878A JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59152891A Division JPS6035550A (ja) 1984-07-25 1984-07-25 レジンモールド装置の製法

Publications (2)

Publication Number Publication Date
JPS5571047A true JPS5571047A (en) 1980-05-28
JPS6231496B2 JPS6231496B2 (https=) 1987-07-08

Family

ID=15356734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14420878A Granted JPS5571047A (en) 1978-11-24 1978-11-24 Lead frame for resin mold

Country Status (1)

Country Link
JP (1) JPS5571047A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
US6541311B1 (en) 1998-04-06 2003-04-01 Infineon Technologies Ag Method of positioning a component mounted on a lead frame in a test socket
US6635955B2 (en) 2000-11-15 2003-10-21 Vishay Semiconductor Gmbh Molded electronic component
US6653564B2 (en) 2000-11-25 2003-11-25 Vishay Semiconductor Gmbh Conductor strip arrangement for a molded electronic component and process for molding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5054058U (https=) * 1973-09-17 1975-05-23
JPS511072A (en) * 1974-06-21 1976-01-07 Fujitsu Ltd Jushifujigatahandotaisochino seizohoho
JPS523358U (https=) * 1975-06-24 1977-01-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5054058U (https=) * 1973-09-17 1975-05-23
JPS511072A (en) * 1974-06-21 1976-01-07 Fujitsu Ltd Jushifujigatahandotaisochino seizohoho
JPS523358U (https=) * 1975-06-24 1977-01-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271148A (en) * 1988-11-17 1993-12-21 National Semiconductor Corporation Method of producing a leadframe
US6541311B1 (en) 1998-04-06 2003-04-01 Infineon Technologies Ag Method of positioning a component mounted on a lead frame in a test socket
US6635955B2 (en) 2000-11-15 2003-10-21 Vishay Semiconductor Gmbh Molded electronic component
US6653564B2 (en) 2000-11-25 2003-11-25 Vishay Semiconductor Gmbh Conductor strip arrangement for a molded electronic component and process for molding

Also Published As

Publication number Publication date
JPS6231496B2 (https=) 1987-07-08

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