JPS6230145A - 電子材料用エポキシ樹脂組成物 - Google Patents

電子材料用エポキシ樹脂組成物

Info

Publication number
JPS6230145A
JPS6230145A JP60170362A JP17036285A JPS6230145A JP S6230145 A JPS6230145 A JP S6230145A JP 60170362 A JP60170362 A JP 60170362A JP 17036285 A JP17036285 A JP 17036285A JP S6230145 A JPS6230145 A JP S6230145A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing
reaction
diol
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60170362A
Other languages
English (en)
Japanese (ja)
Other versions
JPH037205B2 (enrdf_load_stackoverflow
Inventor
Takahisa Kamiyama
神山　孝久
Akinori Hibino
明憲 日比野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP60170362A priority Critical patent/JPS6230145A/ja
Publication of JPS6230145A publication Critical patent/JPS6230145A/ja
Publication of JPH037205B2 publication Critical patent/JPH037205B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60170362A 1985-08-01 1985-08-01 電子材料用エポキシ樹脂組成物 Granted JPS6230145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60170362A JPS6230145A (ja) 1985-08-01 1985-08-01 電子材料用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60170362A JPS6230145A (ja) 1985-08-01 1985-08-01 電子材料用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6230145A true JPS6230145A (ja) 1987-02-09
JPH037205B2 JPH037205B2 (enrdf_load_stackoverflow) 1991-02-01

Family

ID=15903526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60170362A Granted JPS6230145A (ja) 1985-08-01 1985-08-01 電子材料用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6230145A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002017A (ja) * 2004-06-17 2006-01-05 Toto Kasei Co Ltd エポキシ樹脂、及びその製造方法、並びにそのエポキシ樹脂組成物
JP2007254579A (ja) * 2006-03-23 2007-10-04 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
EP3842466A1 (en) 2019-12-24 2021-06-30 Chang Chun Plastics Co., Ltd. Product of glycidyl ether of a mono or polyhydric phenol, epoxy resin composition, and process for producing product of glycidyl ether of a mono or polyhydric phenol

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59184250A (ja) * 1983-04-04 1984-10-19 Sumitomo Chem Co Ltd 電子部品封止または積層用樹脂組成物
JPS6031517A (ja) * 1983-07-29 1985-02-18 Sumitomo Chem Co Ltd エポキシ樹脂の製造法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59184250A (ja) * 1983-04-04 1984-10-19 Sumitomo Chem Co Ltd 電子部品封止または積層用樹脂組成物
JPS6031517A (ja) * 1983-07-29 1985-02-18 Sumitomo Chem Co Ltd エポキシ樹脂の製造法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006002017A (ja) * 2004-06-17 2006-01-05 Toto Kasei Co Ltd エポキシ樹脂、及びその製造方法、並びにそのエポキシ樹脂組成物
JP2007254579A (ja) * 2006-03-23 2007-10-04 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
EP3842466A1 (en) 2019-12-24 2021-06-30 Chang Chun Plastics Co., Ltd. Product of glycidyl ether of a mono or polyhydric phenol, epoxy resin composition, and process for producing product of glycidyl ether of a mono or polyhydric phenol

Also Published As

Publication number Publication date
JPH037205B2 (enrdf_load_stackoverflow) 1991-02-01

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