JPS6230145A - Epoxy resin composition for electronic material - Google Patents
Epoxy resin composition for electronic materialInfo
- Publication number
- JPS6230145A JPS6230145A JP60170362A JP17036285A JPS6230145A JP S6230145 A JPS6230145 A JP S6230145A JP 60170362 A JP60170362 A JP 60170362A JP 17036285 A JP17036285 A JP 17036285A JP S6230145 A JPS6230145 A JP S6230145A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing
- reaction
- diol
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[技術分野]
本発明は、プリント配線板のMNJ基板や電子部品の封
止などに用いられる電子材料用エポキシ樹脂組成物に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an epoxy resin composition for electronic materials used for MNJ substrates of printed wiring boards, sealing of electronic components, and the like.
[背景技術]
エポキシ樹脂は、その優れた硬化物の耐熱性や電気特性
、接着性等の特性に応じて塗料、接着剤、電子(電気)
材料、複合材料等の分野で非常に幅広く用いられている
。そして工ざキシ樹脂は多種類の他の物質との接着性が
良くまた耐水性が優れ、硬化時に硬化物を多孔性にする
ような揮発物の生成がないと共に硬化時の収縮が低いと
いうような緒特性を有するために製品としての信頼性を
高めることができる。エポキシ樹脂はこれらの優れた特
性に基づいてとりわけ高性能を要求されるエレクトロニ
クス関連材料としての用途が広がり、電子部門で広範に
使用されるに至っている。しかし電子部門においてはこ
のように高い性能を要求されるためにこの要求を完全に
満たすものとしてエポキシ樹脂は到達しておらず、過去
より膨大な技術文献や特許文献が集積されているにもか
がわらず、現在においても数多くの研究開発がなされて
いるのが現状である。[Background technology] Epoxy resins are used in paints, adhesives, electronics (electrical), etc., depending on their excellent properties such as heat resistance, electrical properties, and adhesive properties of their cured products.
It is widely used in the fields of materials, composite materials, etc. In addition, the resin has good adhesion with a wide variety of other substances, has excellent water resistance, does not produce volatile substances that make the cured product porous, and has low shrinkage during curing. Because of its long-lasting properties, reliability as a product can be increased. Based on these excellent properties, epoxy resins have found wide use as electronics-related materials that require particularly high performance, and have come to be widely used in the electronics sector. However, because such high performance is required in the electronics sector, epoxy resin has not yet reached the point where it completely satisfies this requirement, and even though a huge amount of technical literature and patent literature has been accumulated since the past. However, the current situation is that a large amount of research and development is still being carried out.
特に電子材料としてのエポキシ樹脂に要求される特性は
、硬化物の耐熱性と耐水性、耐薬品性であっ、これらの
特性はa?脂の硬化度や架ms度に影響されるものであ
って、間違っても硬化が不十分であることは許されるこ
とではなく、硬化過程における生産性の問題はともかく
硬化物の特性上エポキシ樹脂は硬化速度が速いことが要
求されることになる。そこでエポキシ樹脂においてはそ
の硬化剤の研究及び硬化反応機構の研究に多くの努力が
なされてきている。しかしながら硬化反応機構について
は不明確な要素が多く残されており、また硬化剤の選定
も理論的根拠に基づくというより過去の経験に依存して
なされている。この結果、有機アミンや酸無水物などが
相変わらず硬化剤の主流となっており、ジシアンノアミ
ドなとは今だに特殊な硬化剤として重要視されているこ
とになるのである。In particular, the characteristics required of epoxy resins as electronic materials are heat resistance, water resistance, and chemical resistance of the cured product, and these characteristics are a? It is affected by the curing degree and cross-linking degree of the resin, and insufficient curing is not acceptable even if you make a mistake.Aside from productivity problems in the curing process, due to the characteristics of the cured product, epoxy resin is required to have a fast curing speed. Therefore, with regard to epoxy resins, much effort has been made to research the curing agent and the curing reaction mechanism. However, many elements regarding the curing reaction mechanism remain unclear, and the selection of curing agents has been made based on past experience rather than on theoretical grounds. As a result, organic amines and acid anhydrides continue to be the mainstream curing agents, and dicyanamides are still considered important as special curing agents.
[発明の目的]
本発明は、上記の息に鑑みて為されたものであり、エポ
キシ樹脂の硬化速度を向上させるにあたって、在米上り
数多くの研究がなされている硬化剤からエポキシ樹脂そ
のものに焦点を変え、この工ポキンυノ脂自体の選択で
硬化速度を向上させるようにしたものである。[Objective of the Invention] The present invention has been made in view of the above-mentioned problems, and in order to improve the curing speed of epoxy resin, it focuses on the epoxy resin itself rather than the curing agent, which has been extensively researched since its arrival in the United States. The curing speed was improved by changing the process and selecting the resin itself.
[発明の開示]
しかして本発明に係る電子材料用エポキシ樹脂組成物は
、加水分解性塩素の含有率が0601重量%以下で且つ
αジオールの含有率がo、oig1%以下のエポキシ樹
脂に、硬化剤及び硬化触媒を配合して成ることを特徴と
するものであり、以下本発明の詳細な説明する。[Disclosure of the Invention] Accordingly, the epoxy resin composition for electronic materials according to the present invention comprises an epoxy resin having a hydrolyzable chlorine content of 0601% by weight or less and an α diol content of o, oig 1% or less, The present invention is characterized in that it contains a curing agent and a curing catalyst, and the present invention will be described in detail below.
本発明においては通常のビス7エ/−ルA・エピクロル
ヒドリン系のエポキシ樹脂及びこのブロム化やクロル化
されたエポキシ樹脂を対象とするもので、このエポキシ
樹脂においては末端にエポキシ基以外の加水分解性塩素
やαジオールを含有するものが多かれ少なかれ存在する
。これはビスフェノールAとエピクロルヒドリンとの反
応の際に生成されるものである。そして本発明者はこの
加水分解性塩素やαジオールを含有するエポキシ
′樹脂の存在量が一定量以下になると、目立った変曲
点をもってエポキシ樹脂の硬化速度が速くなることを見
出して、本発明を完成するに至ったものである。ここで
いう硬化速度とは、いわゆるデルタイム・ストロ−クキ
エアーで定義される各要因が交絡し合ったレベルのもの
を言うのではなく、T B A (T orsiona
l B raid Analysis)測定−ガラス繊
維にエポキシ樹脂を含浸硬化させねじりによる戻りの際
の粘弾性測定−における、■デル化開始温度の着しい増
大、■硬化完了温度の着しい低下、■デル化の活性化エ
ネルギーの著しい低下、という現象を示すことを意味す
る。これは加水分解性塩素やαジオールの含有量の多い
通常のエポキシ樹脂に比べて、デル化は遅いがデル化が
始まれば急速に硬化が完了すること、すなわち樹脂の流
動時間が短いということを意味しており、例えばこのエ
ポキシ樹脂を用いて積層板を加熱加圧成形するときに、
樹脂の流出を防止して厚み偏差を少なくすることができ
ることになる。またこのように硬化が急速に進行するこ
とによって、硬化物の耐熱性や耐水性、耐薬品性を向上
させることができることにもなる。The present invention targets ordinary bis7er/-epichlorohydrin-based epoxy resins and brominated or chlorinated epoxy resins. There are more or less compounds containing chlorine and alpha diol. This is produced during the reaction between bisphenol A and epichlorohydrin. The present inventor has developed an epoxy resin containing hydrolyzable chlorine and α-diol.
'We have completed the present invention by discovering that when the amount of resin present falls below a certain level, the curing speed of the epoxy resin increases with a noticeable inflection point. The curing speed referred to here does not refer to the level at which various factors defined by so-called Deltime and Stroke Air are intertwined;
l Braid Analysis) Measurements - Measurement of viscoelasticity when glass fibers are impregnated with epoxy resin and cured and then returned by twisting - - Gradual increase in delta initiation temperature, ■ Gradual decrease in curing completion temperature, ■ Delpification This means that the activation energy of a substance is significantly reduced. This means that compared to regular epoxy resins that contain a high content of hydrolyzable chlorine and α-diol, although deltation is slow, once deltation begins, curing is completed rapidly, meaning that the flow time of the resin is short. For example, when molding a laminate using heat and pressure using this epoxy resin,
This means that the resin can be prevented from flowing out and the thickness deviation can be reduced. Further, by rapidly proceeding with curing in this manner, the heat resistance, water resistance, and chemical resistance of the cured product can be improved.
上記のようにエポキシ樹脂の末端に加水分解性塩素やα
ジオールのようにエポキシ基以外の基、つまり−CI基
や一〇H基が存在すると、エポキシ樹脂の反応活性点が
減少して硬化速度が遅くなり、また硬化物の架橋密度が
低下して耐熱性、耐水性、耐薬品性等に悪い影響を及ぼ
しているものと考えられ、加水分解性塩素やαジオール
の存在量を少なくすることによって上記のような効果を
得ることができるものであると考えられる。そしてエポ
キシ樹脂中において、エポキシ樹脂の全量に対して加水
分解性塩素の含有量が0.010重量%以下でかつαジ
オールの含有量がo、o i 。As mentioned above, hydrolyzable chlorine and α
The presence of groups other than epoxy groups such as diols, such as -CI groups and 10H groups, reduces the number of reaction active sites in the epoxy resin, slowing down the curing speed, and lowering the crosslinking density of the cured product, resulting in poor heat resistance. This is thought to have a negative effect on properties, water resistance, chemical resistance, etc., and the above effects can be obtained by reducing the amount of hydrolyzable chlorine and α-diol. Conceivable. In the epoxy resin, the content of hydrolyzable chlorine is 0.010% by weight or less based on the total amount of the epoxy resin, and the content of α diol is o, o i .
重量%以下のものであることが、上記効果を奏するうえ
で必要である。これらの含有量がそれぞれo、o i
o重量%にまで低くなると、顕著な変化点をもって上記
効果が現れるものである。% by weight or less is necessary in order to achieve the above effects. These contents are o and o i respectively
When the content decreases to 0% by weight, the above effects appear with a noticeable change point.
このように加水分解性塩素とαジオールの含有率の低い
エポキシ樹脂を得るためには、ビス7エ7−ルAとエピ
クロルヒドリンとを二段法で反応させてエポキシ樹脂の
調製をおこなうようにするのがよい。すなわち、エポキ
シ樹脂を調製するにあたって、一般的にはとス7二/−
ルAとエピクロルヒドリンとをアルカリ存在下で逐次反
応させて高分子量化するようにする一段法が用いられる
が、この−殺性では加水分解性塩素とαジオールの含有
率の高いエポキシ樹脂が調製される。これ(こ対して一
段目としてビスフェノールAとエピクロルヒドリンとを
アルカリ存在下で反応させて低分子量の固形エポキシ樹
脂を生成させ、さらに二段目としてこの一段目で生成さ
せた低分子量エポキシ樹脂にビスフェノールAを加えて
反応させることによって、高分子量化したエポキシ樹脂
を調製する二段法の方が加水分解性塩素とαジオールの
含有率の低いエポキシ樹脂を14製することができる。In order to obtain an epoxy resin with a low content of hydrolyzable chlorine and α-diol, the epoxy resin is prepared by reacting bis7er7-A and epichlorohydrin in a two-step process. It is better. That is, in preparing epoxy resin, generally 72/-
A one-step method is used in which the polymer A and epichlorohydrin are sequentially reacted in the presence of an alkali to increase the molecular weight, but in this -killing method, an epoxy resin with a high content of hydrolyzable chlorine and α-diol is prepared. Ru. In contrast, in the first step, bisphenol A and epichlorohydrin are reacted in the presence of an alkali to produce a low molecular weight solid epoxy resin, and in the second step, bisphenol A is added to the low molecular weight epoxy resin produced in the first step. The two-step method of preparing a high-molecular-weight epoxy resin by adding and reacting can produce an epoxy resin with a low content of hydrolyzable chlorine and α-diol.
この二段法にあって一般的には、−751目の反応を9
9〜第19°C程度の反応温度で3.5時間程度(2,
5時間〜4.5時間程度)の反応時間でおこなうように
すると共に、二段目の反応を200°C程度の反応温度
、90分程度の反応時間で反応をおこなうようにしてい
る。しかしこの場合には加水分解性塩素の含有率が0.
02重量%程度まで、αジオールの含有率が0.03重
址%程度までのエポキシ樹脂を得ることができるに止ど
まり、加水分解性塩素とαジオールの含有率を低下させ
るにおいて十分とはいえない。In this two-step method, the −751st reaction is generally
About 3.5 hours at a reaction temperature of about 9 to 19 degrees Celsius (2,
The second stage reaction is carried out at a reaction temperature of about 200° C. for a reaction time of about 90 minutes. However, in this case, the content of hydrolyzable chlorine is 0.
Although it is possible to obtain an epoxy resin with an α-diol content of up to about 0.02% by weight and an α-diol content of about 0.03% by weight, it is not sufficient to reduce the content of hydrolyzable chlorine and α-diol. do not have.
そこで、二段目の反応を上記従来の一般的な二段法にお
ける二段目の反応の際の反応温度や反応時間よりも低い
温度や長い反応時間で、つまり低温長時間でおこなうよ
うにすることによって調製したエポキシ樹脂f脂を用い
るようにするのがよい。Therefore, the second-stage reaction is performed at a lower temperature and longer reaction time than the reaction temperature and reaction time during the second-stage reaction in the conventional general two-stage method described above, that is, at a low temperature and for a long time. It is preferable to use an epoxy resin prepared by this method.
すなわち、一段目の反応においては従来の二段法での一
段目と同じ条件で反応をおこなわせることができ、例え
ばビスフェノールAを15モル程度、エピクロルヒドリ
ンを1.5モル程度、さらにアルカリとして水酸化ナト
リウムを3モル程度それぞれ仕込み、99〜第19℃の
反応温度で3.5時間程度(2,5〜4.5時間)反応
をおこなわせ、低分子量の固形エポキシ樹脂を得る。そ
してこの一段目で得た低分子量エポキシ樹脂にビス7エ
/−ルAを加え、従来の一般的な二段法における二段目
の反応条件である200℃、90分の反応温度や反応時
間よりも低い温度の120〜150℃、長い時間の18
0〜360℃で、低温長時間の二段目の反応をおこなわ
せて高分子量化したエポキシ樹脂を得るものである。こ
こで二段目の反応において添加するとスフエノールAの
配合量によって目的とするエポキシ樹脂の分子量を調整
することができるが、通常は(ビスフェノールA/一段
目で生成された低分子量エポキシ樹脂)のモル比が15
以下になるように設定されるのがよい、このような二段
目の反応を低温長時間反応でおこなうことによって、加
水分解性塩素とαジオールの含有量がそれぞれ0.01
0重童5以下のエポキシ樹脂を調製することができるも
のである。In other words, the first stage reaction can be carried out under the same conditions as the first stage of the conventional two-stage method, for example, about 15 moles of bisphenol A, about 1.5 moles of epichlorohydrin, and further hydroxylation as an alkali. About 3 moles of sodium are charged in each, and the reaction is carried out for about 3.5 hours (2.5 to 4.5 hours) at a reaction temperature of 99° C. to 19° C. to obtain a low molecular weight solid epoxy resin. Bis7el/A is added to the low molecular weight epoxy resin obtained in the first step, and the reaction temperature and reaction time are 200°C and 90 minutes, which are the second step reaction conditions in the conventional two-step method. Temperature lower than 120~150℃, long time 18
A second stage reaction is carried out at 0 to 360°C for a long time at low temperature to obtain an epoxy resin with a high molecular weight. If added in the second stage reaction, the molecular weight of the target epoxy resin can be adjusted by adjusting the blending amount of Suphenol A, but usually the molar amount of (bisphenol A/low molecular weight epoxy resin produced in the first stage) is The ratio is 15
It is preferable to set the following. By performing such a second stage reaction at a low temperature and a long time, the contents of hydrolyzable chlorine and α-diol can be reduced to 0.01% each.
It is possible to prepare epoxy resins with a weight of 0.5 or less.
そして本発明にあっては、この加水分解性塩素とαジオ
ールの含有量がそれぞれ0.010重量%以下のエポキ
シ樹脂に硬化剤や硬化触媒を配合してエポキシ樹脂組成
物を調製し、プリント配線板の積層板やその他電子部品
の封止樹脂材料など電子材料用として使用に供するもの
である。ユニで、硬化剤としてはジシアンジアミドを、
硬化触媒としては2−エチル−4−メチルイミダゾール
を用いることができる。ジシアンジアミドの添加量は0
.2〜1.5当量程度が、2−エチル−4−メチルイミ
ダゾールの添加量は10モル%以下程度が好ましい、ま
たジシアンジアミドや2−エチル−4−メチルイミダゾ
ールはメチルセルソルブやN、N−ジメチルホルムアミ
ドなどの溶媒に溶解してこれをエポキシ樹脂に添加する
ことで、例えばエポキシ樹脂ワニスを調製することがで
きる。In the present invention, an epoxy resin composition is prepared by blending a curing agent and a curing catalyst into an epoxy resin in which the content of hydrolyzable chlorine and α-diol is 0.010% by weight or less, respectively. It is used for electronic materials such as plate laminates and sealing resin materials for other electronic components. Uni uses dicyandiamide as a hardening agent.
2-ethyl-4-methylimidazole can be used as a curing catalyst. The amount of dicyandiamide added is 0.
.. The amount of 2-ethyl-4-methylimidazole added is preferably about 10 mol% or less, and the amount of dicyandiamide and 2-ethyl-4-methylimidazole is preferably about 2 to 1.5 equivalents. For example, an epoxy resin varnish can be prepared by dissolving it in a solvent such as formamide and adding it to an epoxy resin.
次に本発明を実施例によって具体的に説明する。Next, the present invention will be specifically explained using examples.
K1九二
ビスフェノールAを15モル、エピクロルヒドリンを1
.5モル、水酸化ナトリウムを3モルそれぞれ仕込み、
第10℃、3.5時間の条件で一段目の反応をさせ、つ
いでこの反応物に(ビスフェノールA/一段目で生成さ
れた低分子量エポキシ樹脂)のモル比が10になるよう
にビスフェノールAを加え、135℃、270分の条件
で二段目の反応をさせてエポキシ樹脂をl1li製した
。15 mol of K192 bisphenol A, 1 mol of epichlorohydrin
.. Prepare 5 mol and 3 mol of sodium hydroxide,
The first stage reaction was carried out at 10°C for 3.5 hours, and then bisphenol A was added to this reaction product so that the molar ratio of (bisphenol A/low molecular weight epoxy resin produced in the first stage) was 10. In addition, a second reaction was carried out at 135°C for 270 minutes to produce 11li of epoxy resin.
このエポキシ樹脂に対してジシアンジアミドを0.41
当量、2−エチル−4−メチル盪、見グゾールを0.9
4モル%となるようにこれらを採ってメチルセロソルブ
に溶解したのちにこれを上記エポキシ樹脂に添加混合し
て、電子材料用エポキシ樹脂組成物のフ二スを調製した
。Add 0.41 dicyandiamide to this epoxy resin.
equivalent, 2-ethyl-4-methyl, 0.9 guzol
These were taken and dissolved in methyl cellosolve to a concentration of 4 mol %, and then added and mixed with the above epoxy resin to prepare an epoxy resin composition for electronic materials.
犬第1」−
加水分解性塩素とαジオールの含有率は製造バッチ毎に
若干の変化が生じるので、この変化の量を確認するため
に実施例1と同様にしてエポキシ樹脂を調製すると共に
実施例1と同様にして電子材料用エポキシ樹脂組成物の
フェスを調製した。Dog No. 1 - The content of hydrolyzable chlorine and α-diol varies slightly from production batch to batch, so in order to confirm the amount of this variation, an epoxy resin was prepared in the same manner as in Example 1, and an experiment was carried out. A face of an epoxy resin composition for electronic materials was prepared in the same manner as in Example 1.
埼1涯り
一段目の反応を実施例1と同様におこない、二段目の反
応を反応温度200℃、反応時開90分でおこなうよう
にした他は実施例1と同様にしてエポキシ樹脂を二段法
で調製し、以下実施例1と同様にして電子材料用エポキ
シ樹脂組成物のフ二スを調製した。The first reaction was carried out in the same manner as in Example 1, and the epoxy resin was prepared in the same manner as in Example 1, except that the second reaction was carried out at a reaction temperature of 200°C and a reaction time of 90 minutes. A two-step method was used to prepare an epoxy resin composition for electronic materials in the same manner as in Example 1.
上記の実施例1,2及び比較例1によって調製されたエ
ポキシ樹脂、及び従来の一段法によって?RHされたエ
ポキシ樹脂(比較例2)について、その加水分解性塩素
とαジオールの含有率を第1表に示す。Epoxy resins prepared according to Examples 1, 2 and Comparative Example 1 above, and by conventional one-step method? Regarding the RH-treated epoxy resin (Comparative Example 2), the contents of hydrolyzable chlorine and α-diol are shown in Table 1.
また実施例1,2及び比較例1で得られた電子材料用エ
ポキシ樹脂組成物フェス、比較例2のエポキシ樹脂を用
いて実施例1と同様にして得られた電子材料用エポキシ
樹脂組成物フェスについて、ゲル分率、活性化エネルギ
ー、デル化開始温度をそれぞれ測定し、結果を第2表に
示す。ここでデル分率の測定は、フェスを180℃×3
0分で焼き付けてフィルムを作成し、これをクロロホル
ムで抽出することによっておこなった。またデル化開始
温度は、TBA曲線で熱時剛性率が急激に増加を開始す
る温度、すなわち硬化反応の進行に伴っ第1表(重量%
)
第2表
第1表に見られるように二段法でしかも二段目の反応を
低温長時間でエポキシO(脂の51!製をおこなった実
施例1,2のものは、いずれも加水分解性塩素やαジオ
ールの含有率がそれぞれ0.01重量%以下と低いこと
が確認される。また第2表の結果、加水分解性塩素やα
ジオールの含有率がそれぞれ0.01重量%以下の実施
例1,2のものはデル分率が高くて反応性に富み、活性
化エネルギーが低くて硬化を迅速に進行し、さらにデル
化開始温度が高くて樹脂の流動時間を短くすることがで
きることが確認される。In addition, the epoxy resin composition for electronic materials obtained in Examples 1 and 2 and Comparative Example 1, and the epoxy resin composition for electronic material obtained in the same manner as in Example 1 using the epoxy resin of Comparative Example 2. The gel fraction, activation energy, and delta initiation temperature were measured for each, and the results are shown in Table 2. Here, the del fraction is measured at 180℃ x 3
This was done by baking for 0 minutes to create a film, which was then extracted with chloroform. In addition, the deltation initiation temperature is the temperature at which the stiffness modulus under heat starts to increase rapidly in the TBA curve, that is, the temperature at which the stiffness modulus under heat starts to increase rapidly as the curing reaction progresses.
) As shown in Table 2 and Table 1, in Examples 1 and 2, in which epoxy O (51! It is confirmed that the contents of hydrolyzable chlorine and α-diol are low at 0.01% by weight or less.In addition, as shown in Table 2, the content of hydrolyzable chlorine and α-diol is low, at 0.01% by weight or less.
Examples 1 and 2, each containing a diol content of 0.01% by weight or less, have a high del fraction and are highly reactive, have a low activation energy, rapidly proceed with curing, and have a low deltation initiation temperature. It is confirmed that the flow time of the resin can be shortened due to the high flow rate.
[発明の効果1
上述のように本発明に係る電子材料用エポキシ樹脂組成
物は、加水分解性塩素の含有率が0.01重量%以下で
且つαジオールの含有率が0.01重量%以下のエポキ
シ樹脂に、硬化剤及び硬化触媒を配合したものであるか
ら、加水分解性塩素やαジオールによる影響を排して、
デル化の開始から硬化の完了に至る硬化速度を速めるこ
とができ、電子材料として要求される流動特性や耐熱性
、耐水性、耐薬品性等の特性を向上させることが可能に
なるものである。[Effect of the invention 1 As described above, the epoxy resin composition for electronic materials according to the present invention has a hydrolyzable chlorine content of 0.01% by weight or less and an α-diol content of 0.01% by weight or less. Because it is a mixture of epoxy resin, curing agent and curing catalyst, it eliminates the effects of hydrolyzable chlorine and α-diol,
It is possible to accelerate the curing speed from the start of curing to the completion of curing, and it is possible to improve properties such as flow characteristics, heat resistance, water resistance, and chemical resistance required for electronic materials. .
Claims (2)
且つaジオールの含有率が0.01重量%以下のエポキ
シ樹脂に、硬化剤及び硬化触媒を配合して成ることを特
徴とする電子材料用エポキシ樹脂組成物。(1) A curing agent and a curing catalyst are blended into an epoxy resin having a hydrolyzable chlorine content of 0.01% by weight or less and an a-diol content of 0.01% by weight or less. Epoxy resin composition for electronic materials.
−エチル−4−メチルイミダゾールであることを特徴と
する特許請求の範囲第1項記載の電子材料用エポキシ樹
脂組成物。(2) The curing agent is dicyandiamide and the curing catalyst is 2
2. The epoxy resin composition for electronic materials according to claim 1, which is ethyl-4-methylimidazole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60170362A JPS6230145A (en) | 1985-08-01 | 1985-08-01 | Epoxy resin composition for electronic material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60170362A JPS6230145A (en) | 1985-08-01 | 1985-08-01 | Epoxy resin composition for electronic material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6230145A true JPS6230145A (en) | 1987-02-09 |
JPH037205B2 JPH037205B2 (en) | 1991-02-01 |
Family
ID=15903526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60170362A Granted JPS6230145A (en) | 1985-08-01 | 1985-08-01 | Epoxy resin composition for electronic material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6230145A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0515680A1 (en) * | 1988-05-09 | 1992-12-02 | Teijin Limited | Epoxy resin-impregnated prepreg |
JP2006002017A (en) * | 2004-06-17 | 2006-01-05 | Toto Kasei Co Ltd | Epoxy resin, method for producing the same, and epoxy resin composition |
JP2007254579A (en) * | 2006-03-23 | 2007-10-04 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition and cured material thereof |
EP3842466A1 (en) | 2019-12-24 | 2021-06-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol, epoxy resin composition, and process for producing product of glycidyl ether of a mono or polyhydric phenol |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59184250A (en) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | Resin composition for use in laminating or sealing electronic part |
JPS6031517A (en) * | 1983-07-29 | 1985-02-18 | Sumitomo Chem Co Ltd | Production of epoxy resin |
-
1985
- 1985-08-01 JP JP60170362A patent/JPS6230145A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59184250A (en) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | Resin composition for use in laminating or sealing electronic part |
JPS6031517A (en) * | 1983-07-29 | 1985-02-18 | Sumitomo Chem Co Ltd | Production of epoxy resin |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0515680A1 (en) * | 1988-05-09 | 1992-12-02 | Teijin Limited | Epoxy resin-impregnated prepreg |
JP2006002017A (en) * | 2004-06-17 | 2006-01-05 | Toto Kasei Co Ltd | Epoxy resin, method for producing the same, and epoxy resin composition |
JP4698170B2 (en) * | 2004-06-17 | 2011-06-08 | 新日鐵化学株式会社 | Epoxy resin, method for producing the same, and epoxy resin composition thereof |
JP2007254579A (en) * | 2006-03-23 | 2007-10-04 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition and cured material thereof |
EP3842466A1 (en) | 2019-12-24 | 2021-06-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol, epoxy resin composition, and process for producing product of glycidyl ether of a mono or polyhydric phenol |
Also Published As
Publication number | Publication date |
---|---|
JPH037205B2 (en) | 1991-02-01 |
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