CN114507494A - High-temperature-resistant high-strength epoxy adhesive - Google Patents
High-temperature-resistant high-strength epoxy adhesive Download PDFInfo
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- CN114507494A CN114507494A CN202210221694.6A CN202210221694A CN114507494A CN 114507494 A CN114507494 A CN 114507494A CN 202210221694 A CN202210221694 A CN 202210221694A CN 114507494 A CN114507494 A CN 114507494A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4092—Curing agents not provided for by the groups C08G59/42 - C08G59/66 titanium containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention relates to a high-temperature-resistant high-strength epoxy adhesive which comprises the following raw materials in parts by weight: 30-60 parts of bisphenol A epoxy resin, 10-40 parts of dendritic epoxy resin, 10-40 parts of modified curing agent, 0.5-5 parts of accelerator, 0.1-10 parts of thixotropic agent and 1-60 parts of filler; the curing agent comprises 10-15 parts of polyisocyanate, 3-5 parts of perovskite, 3-5 parts of Ni-phthalocyanine COF3-5 parts, 20-30 parts of sulfonic acid and 0.1-1 part of methyl isobutyl carbinol. The invention solves the problem that the high temperature resistance and the high strength of the epoxy adhesive can not be balanced.
Description
Technical Field
The invention belongs to the field of epoxy adhesives, and particularly relates to a high-temperature-resistant high-strength single-component epoxy adhesive.
Background
With the rapid development of industry and the popularization of electronic products, industrial products and electronic components have high requirements on the reliability of the adhesive used therein, such as high temperature resistance, cold and heat cycle resistance, humidity and heat resistance and the like.
Epoxy adhesives are widely used in industrial bonding and bonding of electronic components as one of the most conventional and commonly used structural adhesives. For some glue sites which need to maintain high strength at high temperature, the current industry mainly adopts a mode of matching multifunctional epoxy resin with toughening agent (such as CTBN, polyurethane modified epoxy resin and the like) to achieve the purpose, and the reason is that the common toughening agent can cause the glass transition temperature of the epoxy adhesive to be reduced and the highest temperature which can be endured to be reduced. Although the method of matching multifunctional epoxy resin with a common toughening agent can meet the common requirements of temperature resistance and high strength to a certain extent, the method has higher cost, and the product has high viscosity and insufficient toughness. This problem severely restricts the wide application of such adhesives.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a single-component epoxy adhesive, which solves the problem that the high temperature resistance and the high strength of the epoxy adhesive cannot be balanced and can provide better reliability for industrial products and electronic components.
The technical scheme of the invention is as follows:
the high-temperature-resistant high-strength epoxy adhesive comprises the following raw materials in parts by weight: 30-60 parts of bisphenol A epoxy resin, 10-40 parts of dendritic epoxy resin, 10-40 parts of modified curing agent, 0.5-5 parts of accelerator, 0.1-10 parts of thixotropic agent and 1-60 parts of filler;
the curing agent comprises 10-15 parts of polyisocyanate, 3-5 parts of perovskite, 3-5 parts of Ni-phthalocyanine COF3-5 parts, 20-30 parts of sulfonic acid and 0.1-1 part of methyl isobutyl carbinol.
Further, the bisphenol A epoxy resin is one or more of Hongchang 128, Changchun 188 and DOW DER 331.
Furthermore, the dendritic epoxy resin is a resin with at least two epoxy groups on a dendritic macromolecule, the end part of the dendritic epoxy resin is provided with more than two epoxy groups and a great number of hydroxyl groups, the epoxy groups ensure the reactivity of the resin in the epoxy adhesive, and the hydroxyl groups can promote the adhesion and the bonding of the epoxy adhesive. In addition, the dendritic epoxy resin has the characteristics of flexible chains and high crosslinking density, so that the dendritic epoxy resin provides good toughness while maintaining the glass transition temperature of the epoxy adhesive. Due to the multiple characteristics, the dendritic epoxy resin provides possibility for high temperature resistance, high toughness and high adhesion of the epoxy adhesive. In a preferred embodiment, the dendritic epoxy resin is morning source CYE-001.
Furthermore, the accelerant is one or more of 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole, ajinomotol PN-23 and PN-H.
Further, the thixotropic agent is one of white carbon black, nano calcium carbonate, bentonite, polyamide wax, polyurea and polyolefin.
Further, the filler is one of silicon micropowder, calcium carbonate, talcum powder, alumina, aluminum hydroxide and titanium dioxide.
The preparation method of the high-temperature-resistant high-strength epoxy adhesive is characterized by comprising the following steps of:
firstly, adding bisphenol A epoxy resin and dendritic epoxy resin into a double-planet stirrer, stirring for 5-30min in vacuum, then adding a thixotropic agent and a filler, preliminarily mixing uniformly, then stirring for 30-120min at high speed in vacuum, standing for 12-24h at room temperature, finally adding a modified curing agent and an accelerator, stirring uniformly, stirring for 30-120min in vacuum, and discharging.
Further, the preparation method of the modified curing agent comprises the steps of putting polyisocyanate, perovskite and Ni-phthalocyanine COF into a reaction kettle, stirring by a high-speed stirrer to achieve full mixing, then adding sulfonic acid and methyl isobutyl carbinol, heating to 80-100 ℃, and reacting for 30-45 minutes to obtain the modified curing agent.
By the scheme, the invention at least has the following advantages:
according to the technical scheme, the special modified curing agent is prepared, anion sulfonate is used as a hydrophilic monomer, the perovskite and the Ni-phthalocyanine COF are added to modify the composite material, the Ni-phthalocyanine COF has a two-dimensional reticular structure, meanwhile, the perovskite is a cubic crystal system structure and can be interlaced with the Ni-phthalocyanine COF, then the interlaced Ni-phthalocyanine COF and the perovskite can be modified by polyisocyanate, and the prepared modified curing agent has the advantages of good dispersity, low viscosity and excellent matching property with hydroxyl resin, and meanwhile, the structural characteristics of the Ni-phthalocyanine COF and the perovskite are reserved, so that the shear strength and the vitrification temperature are further improved, and the curing time can be shortened.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, the following is a detailed description of the preferred embodiments of the present invention.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1
The preparation method of the modified curing agent comprises the steps of putting 10 parts by weight of polyisocyanate, 3 parts by weight of perovskite and 3 parts by weight of Ni-phthalocyanine COF3 parts by weight into a reaction kettle, stirring the materials by a high-speed stirrer under the protection of nitrogen to realize full mixing, then adding 20 parts by weight of sulfonic acid and 0.1 part by weight of methyl isobutyl carbinol, heating the mixture to 80-100 ℃, and reacting the mixture for 30-45 minutes to obtain the modified curing agent.
The preparation method of the high-temperature-resistant high-strength epoxy adhesive comprises the steps of adding 128 parts of Hongchang and 30 parts of Chenyuan CYE-001 and 10 parts of Chenyuan CYE-001 into a double-planet stirrer, stirring for 5min in vacuum, adding 0.5 part of white carbon black and 1 part of silica powder, stirring uniformly in vacuum at a high speed for 30min, standing for 12h at room temperature, adding 10 parts of modified curing agent and 0.5 part of 2-ethyl-4-methylimidazole, stirring uniformly, stirring in vacuum for 30min, and discharging.
Example 2
The preparation method of the modified curing agent comprises the steps of putting 12 parts by weight of polyisocyanate, 4 parts by weight of perovskite and 0.5 part by weight of Ni-phthalocyanine COF5 into a reaction kettle, stirring the materials by a high-speed stirrer under the protection of nitrogen to achieve full mixing, then adding 25 parts by weight of sulfonic acid and 0.5 part by weight of methyl isobutyl carbinol, heating the mixture to 90 ℃, and reacting the mixture for 35 minutes to obtain the modified curing agent.
Preparing the high-temperature-resistant high-strength epoxy adhesive, namely adding 40 parts of DOW DER331 and 20 parts of morning-derived CYE-001 into a double-planet stirrer, stirring for 10min in vacuum, then adding 3 parts of nano calcium carbonate and 30 parts of calcium carbonate, primarily mixing uniformly, then stirring for 60min in vacuum at a high speed, standing for 18h at room temperature, finally adding 20 parts of modified curing agent and 2.5 parts of cyanoethyl-2-ethyl-4-methylimidazole, stirring uniformly, stirring for 60min in vacuum, and discharging.
Example 3
The preparation method of the modified curing agent comprises the steps of putting 15 parts by weight of polyisocyanate, 5 parts by weight of perovskite and 5 parts by weight of Ni-phthalocyanine COF into a reaction kettle, stirring the materials by a high-speed stirrer under the protection of nitrogen to achieve full mixing, then adding 30 parts by weight of sulfonic acid and 1 part by weight of methyl isobutyl carbinol, heating the mixture to 100 ℃, and reacting the mixture for 45 minutes to obtain the modified curing agent.
The preparation method of the high-temperature-resistant high-strength epoxy adhesive comprises the steps of adding 60 parts of Changchun 188 and 40 parts of morning-derived CYE-001 into a double-planet stirrer, stirring for 30min in vacuum, adding 10 parts of bentonite and 60 parts of titanium dioxide, stirring for 120min in vacuum after primary mixing is carried out uniformly, standing for 24h at room temperature, adding 40 parts of modified curing agent and 5 parts of ajinomotol PN-23, stirring uniformly, stirring for 120min in vacuum, and discharging.
Comparative example 1
The preparation method of the high-temperature-resistant high-strength epoxy adhesive comprises the steps of adding 30 parts of Hongchang 128 and 10 parts of Chenyuan CYE-001 into a double-planet stirrer, stirring for 5min in vacuum, adding 0.5 part of white carbon black and 1 part of silica powder, stirring for 30min in vacuum at a high speed after primary uniform mixing, standing for 12h at room temperature, stirring uniformly at 0.5 part of 2-ethyl-4-methylimidazole, stirring for 30min in vacuum, and discharging.
Comparative example 2
Preparing the high-temperature-resistant high-strength epoxy adhesive, namely adding 40 parts of DOW DER331 and 20 parts of morning-source CYE-001 into a double-planet stirrer, stirring for 10min in vacuum, then adding 3 parts of nano calcium carbonate and 30 parts of calcium carbonate, primarily mixing uniformly, then stirring for 60min in vacuum at a high speed, standing for 18h at room temperature, finally adding 2.5 parts of cyanoethyl-2-ethyl-4-methylimidazole, stirring uniformly, stirring for 60min in vacuum, and discharging.
The test results of the related examples are as follows
As can be seen from the table, the single-component epoxy adhesive obtained by the invention can resist higher temperature, has high bonding strength at normal temperature and high temperature, and can provide very good reliability for industrial products and electronic components.
According to the technical scheme, the special modified curing agent is prepared, anion sulfonate is used as a hydrophilic monomer, the perovskite and the Ni-phthalocyanine COF are added to modify the composite material, the Ni-phthalocyanine COF has a two-dimensional reticular structure, meanwhile, the perovskite is a cubic crystal system structure and can be interlaced with the Ni-phthalocyanine COF, then the interlaced Ni-phthalocyanine COF and the perovskite can be modified by polyisocyanate, and the prepared modified curing agent has the advantages of good dispersity, low viscosity and excellent matching property with hydroxyl resin, and meanwhile, the structural characteristics of the Ni-phthalocyanine COF and the perovskite are reserved, so that the shear strength and the vitrification temperature are further improved, and the curing time can be shortened.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The high-temperature-resistant high-strength epoxy adhesive is characterized by comprising the following raw materials in parts by weight: 30-60 parts of bisphenol A epoxy resin, 10-40 parts of dendritic epoxy resin, 10-40 parts of modified curing agent, 0.5-5 parts of accelerator, 0.1-10 parts of thixotropic agent and 1-60 parts of filler;
the modified curing agent comprises 10-15 parts of polyisocyanate, 3-5 parts of perovskite, 3-5 parts of Ni-phthalocyanine COF3-5 parts, 20-30 parts of sulfonic acid and 0.1-1 part of methyl isobutyl carbinol.
2. The high temperature resistant high strength epoxy adhesive of claim 1, wherein the bisphenol A epoxy resin is one or more of Macrochang 128, Changchun 188 and DOW DER 331.
3. The high temperature and high strength epoxy adhesive according to claim 1, wherein the dendritic epoxy resin is CYE-001 from morning origin.
4. The high-temperature-resistant high-strength epoxy adhesive as claimed in claim 1, wherein the accelerator is one or more of 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole, ajinomotol PN-23 and PN-H.
5. The high temperature resistant high strength epoxy adhesive according to claim 1, wherein the thixotropic agent is one of white carbon black, nano calcium carbonate, bentonite, polyamide wax, polyurea and polyolefin.
6. The high-temperature-resistant high-strength epoxy adhesive as claimed in claim 1, wherein the filler is one of silica powder, calcium carbonate, talc powder, alumina, aluminum hydroxide and titanium dioxide.
7. The method for preparing the high-temperature-resistant high-strength epoxy adhesive according to any one of claims 1 to 6, which is characterized by comprising the following steps:
firstly, adding bisphenol A epoxy resin and dendritic epoxy resin into a double-planet stirrer, stirring for 5-30min in vacuum, then adding a thixotropic agent and a filler, preliminarily mixing uniformly, then stirring for 30-120min at high speed in vacuum, standing for 12-24h at room temperature, finally adding a modified curing agent and an accelerator, stirring uniformly, stirring for 30-120min in vacuum, and discharging.
8. The method for preparing the high temperature resistant and high strength epoxy adhesive according to claim 7, wherein the modified curing agent is prepared by putting polyisocyanate, perovskite and Ni-phthalocyanine COF into a reaction kettle, stirring by a high speed stirrer to achieve sufficient mixing, adding sulfonic acid and methyl isobutyl carbinol, heating to 80-100 ℃, and reacting for 30-45 minutes to obtain the modified curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210221694.6A CN114507494A (en) | 2022-03-09 | 2022-03-09 | High-temperature-resistant high-strength epoxy adhesive |
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| CN202210221694.6A CN114507494A (en) | 2022-03-09 | 2022-03-09 | High-temperature-resistant high-strength epoxy adhesive |
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| CN114507494A true CN114507494A (en) | 2022-05-17 |
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Cited By (2)
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| CN116376407A (en) * | 2023-01-06 | 2023-07-04 | 山东东宏管业股份有限公司 | Fusion bonding epoxy powder for inner wall of large-caliber steel pipe and preparation method and application thereof |
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| CN116376407A (en) * | 2023-01-06 | 2023-07-04 | 山东东宏管业股份有限公司 | Fusion bonding epoxy powder for inner wall of large-caliber steel pipe and preparation method and application thereof |
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