JPS62297493A - 半導体ウェハー用メッキ装置 - Google Patents
半導体ウェハー用メッキ装置Info
- Publication number
- JPS62297493A JPS62297493A JP13829386A JP13829386A JPS62297493A JP S62297493 A JPS62297493 A JP S62297493A JP 13829386 A JP13829386 A JP 13829386A JP 13829386 A JP13829386 A JP 13829386A JP S62297493 A JPS62297493 A JP S62297493A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- plating solution
- soln
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 151
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 claims description 50
- 238000003756 stirring Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 abstract description 17
- 238000002347 injection Methods 0.000 abstract description 13
- 239000007924 injection Substances 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 59
- 239000007788 liquid Substances 0.000 description 32
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000013019 agitation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13829386A JPS62297493A (ja) | 1986-06-16 | 1986-06-16 | 半導体ウェハー用メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13829386A JPS62297493A (ja) | 1986-06-16 | 1986-06-16 | 半導体ウェハー用メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62297493A true JPS62297493A (ja) | 1987-12-24 |
| JPH0240746B2 JPH0240746B2 (enrdf_load_stackoverflow) | 1990-09-13 |
Family
ID=15218499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13829386A Granted JPS62297493A (ja) | 1986-06-16 | 1986-06-16 | 半導体ウェハー用メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62297493A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152222A (ja) * | 1991-03-08 | 1993-06-18 | Motorola Inc | 液相堆積を用いた半導体装置における材料層の形成方法 |
| JPH08253892A (ja) * | 1995-03-16 | 1996-10-01 | Nippondenso Co Ltd | めっき装置およびめっき方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58759A (ja) * | 1981-03-30 | 1983-01-05 | ア−ルアイエイ・プロダクツ・インコ−ポレイテツド | 非煮沸変性によるアツセイ方法 |
-
1986
- 1986-06-16 JP JP13829386A patent/JPS62297493A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58759A (ja) * | 1981-03-30 | 1983-01-05 | ア−ルアイエイ・プロダクツ・インコ−ポレイテツド | 非煮沸変性によるアツセイ方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152222A (ja) * | 1991-03-08 | 1993-06-18 | Motorola Inc | 液相堆積を用いた半導体装置における材料層の形成方法 |
| JPH08253892A (ja) * | 1995-03-16 | 1996-10-01 | Nippondenso Co Ltd | めっき装置およびめっき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0240746B2 (enrdf_load_stackoverflow) | 1990-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |