JPS62290146A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62290146A
JPS62290146A JP61133212A JP13321286A JPS62290146A JP S62290146 A JPS62290146 A JP S62290146A JP 61133212 A JP61133212 A JP 61133212A JP 13321286 A JP13321286 A JP 13321286A JP S62290146 A JPS62290146 A JP S62290146A
Authority
JP
Japan
Prior art keywords
film
silicon
element isolation
oxidation
polycrystalline silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61133212A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565058B2 (enExample
Inventor
Shigeru Morita
茂 森田
Shoichi Kagami
正一 各務
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61133212A priority Critical patent/JPS62290146A/ja
Priority to US07/015,037 priority patent/US4746625A/en
Priority to KR1019870005761A priority patent/KR960001175B1/ko
Publication of JPS62290146A publication Critical patent/JPS62290146A/ja
Publication of JPH0565058B2 publication Critical patent/JPH0565058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Local Oxidation Of Silicon (AREA)
JP61133212A 1986-06-09 1986-06-09 半導体装置の製造方法 Granted JPS62290146A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP61133212A JPS62290146A (ja) 1986-06-09 1986-06-09 半導体装置の製造方法
US07/015,037 US4746625A (en) 1986-06-09 1987-02-17 A method of manufacturing semiconductor elements-isolating silicon oxide layers
KR1019870005761A KR960001175B1 (ko) 1986-06-09 1987-06-08 반도체장치의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61133212A JPS62290146A (ja) 1986-06-09 1986-06-09 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62290146A true JPS62290146A (ja) 1987-12-17
JPH0565058B2 JPH0565058B2 (enExample) 1993-09-16

Family

ID=15099347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61133212A Granted JPS62290146A (ja) 1986-06-09 1986-06-09 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US4746625A (enExample)
JP (1) JPS62290146A (enExample)
KR (1) KR960001175B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02162749A (ja) * 1988-12-15 1990-06-22 Mitsubishi Electric Corp 半導体装置の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968640A (en) * 1987-02-10 1990-11-06 Industrial Technology Research Institute Isolation structures for integrated circuits
US5019526A (en) * 1988-09-26 1991-05-28 Nippondenso Co., Ltd. Method of manufacturing a semiconductor device having a plurality of elements
US5059550A (en) * 1988-10-25 1991-10-22 Sharp Kabushiki Kaisha Method of forming an element isolating portion in a semiconductor device
JPH0775243B2 (ja) * 1989-02-22 1995-08-09 株式会社東芝 半導体装置の製造方法
US5002898A (en) * 1989-10-19 1991-03-26 At&T Bell Laboratories Integrated-circuit device isolation
US5057463A (en) * 1990-02-28 1991-10-15 Sgs-Thomson Microelectronics, Inc. Thin oxide structure and method
US5039625A (en) * 1990-04-27 1991-08-13 Mcnc Maximum areal density recessed oxide isolation (MADROX) process
KR930011460B1 (ko) * 1991-01-22 1993-12-08 삼성전자 주식회사 반도체 장치의 소자분리 영역 형성방법
EP1387407B1 (en) * 2001-05-09 2011-07-13 Shindengen Electric Manufacturing Company, Limited Semiconductor device and its manufacturing method
ITMI20012010A1 (it) * 2001-09-27 2003-03-27 Getters Spa Sistemi per la conversione di acqua in idrogeno e l'assorbimemnto di idrogeno in dispositivi elettronici e processo di produzione
US8941176B2 (en) 2009-09-29 2015-01-27 Stmicroelectronics S.R.L. Integrated device with raised locos insulation regions and process for manufacturing such device
EP2306509A1 (en) * 2009-09-29 2011-04-06 STMicroelectronics Srl Process for manufacturing an integrated device with "damascene" field insulation, and integrated device made by such process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207348A (en) * 1981-06-16 1982-12-20 Fujitsu Ltd Manufacture of semiconductor device
JPS59227137A (ja) * 1983-06-08 1984-12-20 Nec Corp 半導体基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214946A (en) * 1979-02-21 1980-07-29 International Business Machines Corporation Selective reactive ion etching of polysilicon against SiO2 utilizing SF6 -Cl2 -inert gas etchant
JPS5922344A (ja) * 1982-07-28 1984-02-04 Fujitsu Ltd 半導体装置の製造方法
US4570325A (en) * 1983-12-16 1986-02-18 Kabushiki Kaisha Toshiba Manufacturing a field oxide region for a semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207348A (en) * 1981-06-16 1982-12-20 Fujitsu Ltd Manufacture of semiconductor device
JPS59227137A (ja) * 1983-06-08 1984-12-20 Nec Corp 半導体基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02162749A (ja) * 1988-12-15 1990-06-22 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
KR880001048A (ko) 1988-03-31
US4746625A (en) 1988-05-24
JPH0565058B2 (enExample) 1993-09-16
KR960001175B1 (ko) 1996-01-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees