JPS6216038B2 - - Google Patents

Info

Publication number
JPS6216038B2
JPS6216038B2 JP55184773A JP18477380A JPS6216038B2 JP S6216038 B2 JPS6216038 B2 JP S6216038B2 JP 55184773 A JP55184773 A JP 55184773A JP 18477380 A JP18477380 A JP 18477380A JP S6216038 B2 JPS6216038 B2 JP S6216038B2
Authority
JP
Japan
Prior art keywords
gallium
conductive material
metal
eutectic
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55184773A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57107501A (en
Inventor
Kenji Oosawa
Takao Ito
Koichiro Tanno
Masayuki Oosawa
Keiji Kurata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP55184773A priority Critical patent/JPS57107501A/ja
Priority to CA000392417A priority patent/CA1166873A/en
Priority to US06/331,229 priority patent/US4398975A/en
Priority to GB8138603A priority patent/GB2090614B/en
Priority to FR8124027A priority patent/FR2497390A1/fr
Priority to DE19813150880 priority patent/DE3150880A1/de
Priority to NL8105784A priority patent/NL8105784A/nl
Priority to KR1019810005181A priority patent/KR880000822B1/ko
Publication of JPS57107501A publication Critical patent/JPS57107501A/ja
Publication of JPS6216038B2 publication Critical patent/JPS6216038B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
JP55184773A 1980-12-25 1980-12-25 Conduction material Granted JPS57107501A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP55184773A JPS57107501A (en) 1980-12-25 1980-12-25 Conduction material
CA000392417A CA1166873A (en) 1980-12-25 1981-12-16 Conductive paste
US06/331,229 US4398975A (en) 1980-12-25 1981-12-16 Conductive paste
GB8138603A GB2090614B (en) 1980-12-25 1981-12-22 Conductive pastes
FR8124027A FR2497390A1 (fr) 1980-12-25 1981-12-22 Pate conductrice pour plaquettes de circuits imprimes a plusieurs couches et procede de fabrication
DE19813150880 DE3150880A1 (de) 1980-12-25 1981-12-22 "leitende paste und verfahren zu ihrer herstellung"
NL8105784A NL8105784A (nl) 1980-12-25 1981-12-22 Geleidende pasta alsmede werkwijze ter bereiding van een geleidende samenstelling.
KR1019810005181A KR880000822B1 (ko) 1980-12-25 1981-12-26 도전재료

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55184773A JPS57107501A (en) 1980-12-25 1980-12-25 Conduction material

Publications (2)

Publication Number Publication Date
JPS57107501A JPS57107501A (en) 1982-07-05
JPS6216038B2 true JPS6216038B2 (enExample) 1987-04-10

Family

ID=16159056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55184773A Granted JPS57107501A (en) 1980-12-25 1980-12-25 Conduction material

Country Status (8)

Country Link
US (1) US4398975A (enExample)
JP (1) JPS57107501A (enExample)
KR (1) KR880000822B1 (enExample)
CA (1) CA1166873A (enExample)
DE (1) DE3150880A1 (enExample)
FR (1) FR2497390A1 (enExample)
GB (1) GB2090614B (enExample)
NL (1) NL8105784A (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
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US5053195A (en) * 1989-07-19 1991-10-01 Microelectronics And Computer Technology Corp. Bonding amalgam and method of making
US5198189A (en) * 1989-08-03 1993-03-30 International Business Machines Corporation Liquid metal matrix thermal paste
US5056706A (en) * 1989-11-20 1991-10-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5007163A (en) * 1990-04-18 1991-04-16 International Business Machines Corporation Non-destructure method of performing electrical burn-in testing of semiconductor chips
US5281176A (en) * 1991-07-22 1994-01-25 Daido Tokushuko Kabushiki Kaisha Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein
US5170930A (en) * 1991-11-14 1992-12-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5593082A (en) * 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
WO1996015283A1 (en) * 1994-11-15 1996-05-23 Tosoh Smd, Inc. Method of bonding targets to backing plate member
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
US6264093B1 (en) * 1998-11-02 2001-07-24 Raymond W. Pilukaitis Lead-free solder process for printed wiring boards
US6207259B1 (en) * 1998-11-02 2001-03-27 Kyocera Corporation Wiring board
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
JP2001237512A (ja) * 1999-12-14 2001-08-31 Nitto Denko Corp 両面回路基板およびこれを用いた多層配線基板ならびに両面回路基板の製造方法
US6620378B2 (en) * 2000-02-14 2003-09-16 Keith Weinstein Precious metal solder
US6372060B1 (en) * 2000-02-14 2002-04-16 Keith Weinstein Platinum solder
WO2001061063A1 (en) * 2000-02-15 2001-08-23 Georgia Tech Research Corporation System for, and method of, providing gallium alloy for multichip module substrates
US6339120B1 (en) 2000-04-05 2002-01-15 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US6984685B2 (en) * 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
US6797758B2 (en) * 2000-04-05 2004-09-28 The Bergquist Company Morphing fillers and thermal interface materials
US20020027294A1 (en) * 2000-07-21 2002-03-07 Neuhaus Herbert J. Electrical component assembly and method of fabrication
CN1498417A (zh) * 2000-09-19 2004-05-19 ����ŵ����Ƥ 用于在无线频率识别装置中装配元件和天线的方法
EP1328373A2 (en) * 2000-10-24 2003-07-23 Nanopierce Technologies Inc. Method and materials for printing particle-enhanced electrical contacts
US20020096254A1 (en) * 2001-01-22 2002-07-25 Michael Kober Optical device module and method of fabrication
JP2011202277A (ja) * 2004-10-20 2011-10-13 Dainippon Printing Co Ltd Ｇａ系合金及びこれを用いた有機機能素子
JP4803478B2 (ja) * 2004-10-20 2011-10-26 大日本印刷株式会社 Ｇａ系合金及びこれを用いた有機機能素子
US7441610B2 (en) * 2005-02-25 2008-10-28 Smith International, Inc. Ultrahard composite constructions
JP4720949B1 (ja) * 2010-04-09 2011-07-13 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金粉末の製造方法及びＣｕ−Ｇａ合金粉末、並びにＣｕ−Ｇａ合金スパッタリングターゲットの製造方法及びＣｕ−Ｇａ合金スパッタリングターゲット
JP5740891B2 (ja) * 2010-09-29 2015-07-01 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット及びＣｕ−Ｇａ合金スパッタリングターゲットの製造方法
JP5488377B2 (ja) * 2010-09-29 2014-05-14 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲットの製造方法及びＣｕ−Ｇａ合金スパッタリングターゲット
JP5617493B2 (ja) * 2010-09-29 2014-11-05 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット及びＣｕ−Ｇａ合金スパッタリングターゲットの製造方法
JP2012102358A (ja) * 2010-11-09 2012-05-31 Sumitomo Metal Mining Co Ltd Ｃｕ−Ｇａ合金粉末の製造方法及びＣｕ−Ｇａ合金粉末、並びにＣｕ−Ｇａ合金スパッタリングターゲットの製造方法及びＣｕ−Ｇａ合金スパッタリングターゲット
DE102011013172A1 (de) * 2011-02-28 2012-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
JP5617723B2 (ja) * 2011-03-25 2014-11-05 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット
WO2012142709A1 (en) * 2011-04-19 2012-10-26 Dynajoin Corporation Method and compositions for removing microelectronic components from circuit boards
JP5252050B2 (ja) * 2011-09-09 2013-07-31 富士通株式会社 回路基板、及び回路基板の製造方法
JP2013119089A (ja) * 2011-12-06 2013-06-17 Fujitsu Ltd 導電性接合材料、並びに電子部品及び電子機器
US8871143B2 (en) * 2012-01-20 2014-10-28 Leonard Nanis Amalgam method for forming a sputter target useful in the manufacture of thin-film solar photovoltaic cells
EP2880681A2 (en) * 2012-08-02 2015-06-10 Osram Sylvania Inc. Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
JP5435095B2 (ja) * 2012-09-12 2014-03-05 富士通株式会社 回路基板、及び回路基板の製造方法
JP5257539B2 (ja) * 2012-09-12 2013-08-07 富士通株式会社 回路基板の製造方法
JP5257546B2 (ja) * 2012-10-23 2013-08-07 富士通株式会社 電子機器の製造方法
US9731369B2 (en) 2013-03-13 2017-08-15 Intel Corporation Interconnect alloy material and methods
EP2991105B1 (en) * 2013-04-26 2020-09-30 Kyocera Corporation Composite laminate and electronic device
US20150217367A1 (en) * 2014-02-03 2015-08-06 North Carolina State University Three-Dimensional Printing of Metallic Materials
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
WO2017047293A1 (ja) 2015-09-15 2017-03-23 株式会社村田製作所 接合用部材、接合用部材の製造方法、および、接合方法
JP6528852B2 (ja) 2015-09-28 2019-06-12 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
WO2017077824A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 接合用部材、および、接合用部材の製造方法
TWI822659B (zh) 2016-10-27 2023-11-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
US12238870B2 (en) * 2020-01-15 2025-02-25 Liquid Wire Inc. Deposition with solid feedstock
KR20230126736A (ko) 2020-12-30 2023-08-30 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 전도성 특징부를 갖는 구조 및 그 형성방법

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US3141238A (en) * 1960-11-22 1964-07-21 Jr George G Harman Method of low temperature bonding for subsequent high temperature use
US3157539A (en) * 1961-09-28 1964-11-17 Dreher Manfrid Method of producing shaped metallic bodies having a copper alloy base and a noble metal outer coating
US3196007A (en) * 1962-06-12 1965-07-20 Brush Beryllium Co Beryllium copper composition and method of producing green compacts and sintered articles therefrom
SU236215A1 (ru) 1967-02-13 1969-01-24 Пастообразный припой для пайки деталей электровакуумных приборов
DE2526544A1 (de) * 1975-06-13 1976-12-30 Wieland Fa Dr Th Zahnaerztlicher fuellungswerkstoff auf amalgamgrundlage
US4015981A (en) * 1976-03-30 1977-04-05 Svetlana Tanovna Rogova Tooth filling alloy
JPS52126793A (en) * 1976-04-15 1977-10-24 Matsushita Electric Works Ltd Flexible conductor
US4233103A (en) * 1978-12-20 1980-11-11 The United States Of America As Represented By The Secretary Of The Air Force High temperature-resistant conductive adhesive and method employing same
JPS55108103A (en) * 1979-02-14 1980-08-19 Sony Corp Conductive materaial
IT1140843B (it) * 1979-05-17 1986-10-10 Jeffery James Cheethan Polveri meccaniche
JPS56134404A (en) * 1980-03-24 1981-10-21 Sony Corp Conductive material and method of prdoducing same

Also Published As

Publication number Publication date
KR830008350A (ko) 1983-11-18
FR2497390B1 (enExample) 1984-10-19
CA1166873A (en) 1984-05-08
GB2090614B (en) 1985-02-27
JPS57107501A (en) 1982-07-05
GB2090614A (en) 1982-07-14
KR880000822B1 (ko) 1988-05-11
NL8105784A (nl) 1982-07-16
FR2497390A1 (fr) 1982-07-02
US4398975A (en) 1983-08-16
DE3150880A1 (de) 1982-08-12

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