KR830008350A - 도전재료 - Google Patents

도전재료 Download PDF

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Publication number
KR830008350A
KR830008350A KR1019810005181A KR810005181A KR830008350A KR 830008350 A KR830008350 A KR 830008350A KR 1019810005181 A KR1019810005181 A KR 1019810005181A KR 810005181 A KR810005181 A KR 810005181A KR 830008350 A KR830008350 A KR 830008350A
Authority
KR
South Korea
Prior art keywords
conductive material
metal
metal powder
blindness
alloying
Prior art date
Application number
KR1019810005181A
Other languages
English (en)
Other versions
KR880000822B1 (ko
Inventor
겐지 오오사와
나까오 이또오
고우이찌로오 단노
마사유끼 오오사와
게이지 구라마
Original Assignee
이와마 가즈오
소니 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이와마 가즈오, 소니 가부시기 가이샤 filed Critical 이와마 가즈오
Publication of KR830008350A publication Critical patent/KR830008350A/ko
Application granted granted Critical
Publication of KR880000822B1 publication Critical patent/KR880000822B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)

Abstract

내용 없음

Description

도전재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1a도 및 제1b도는 본 발명의 설명을 위한 칼륨합금에 의한 페이스트형 도전재료의 도해도.
제2도는 본 발명의 도전재료의 도해도.
제3도는 그 반응경화의 상태를 도시한 도해도.

Claims (1)

  1. 액상 가리움증에 가리움과 공정하는 제1의 금속을 적어도 포화할때까지 함유한 융액중에 가리움과 합금화할 수 있는 금속분을 함유한 페이스트로부터 이루어지는 도전재료에 있어서 상기 금속분의 표면이 상기 제1의 금속으로 덮혀져 있는 것을 특징으로 하는 도전재료.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019810005181A 1980-12-25 1981-12-26 도전재료 KR880000822B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP55184773A JPS57107501A (en) 1980-12-25 1980-12-25 Conduction material
JP80-184773 1980-12-25
JP184773 1980-12-25

Publications (2)

Publication Number Publication Date
KR830008350A true KR830008350A (ko) 1983-11-18
KR880000822B1 KR880000822B1 (ko) 1988-05-11

Family

ID=16159056

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810005181A KR880000822B1 (ko) 1980-12-25 1981-12-26 도전재료

Country Status (8)

Country Link
US (1) US4398975A (ko)
JP (1) JPS57107501A (ko)
KR (1) KR880000822B1 (ko)
CA (1) CA1166873A (ko)
DE (1) DE3150880A1 (ko)
FR (1) FR2497390A1 (ko)
GB (1) GB2090614B (ko)
NL (1) NL8105784A (ko)

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US5007163A (en) * 1990-04-18 1991-04-16 International Business Machines Corporation Non-destructure method of performing electrical burn-in testing of semiconductor chips
US5281176A (en) * 1991-07-22 1994-01-25 Daido Tokushuko Kabushiki Kaisha Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein
US5170930A (en) * 1991-11-14 1992-12-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
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WO1996015283A1 (en) * 1994-11-15 1996-05-23 Tosoh Smd, Inc. Method of bonding targets to backing plate member
US5808874A (en) 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
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US6207259B1 (en) * 1998-11-02 2001-03-27 Kyocera Corporation Wiring board
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
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US20020096254A1 (en) * 2001-01-22 2002-07-25 Michael Kober Optical device module and method of fabrication
JP4803478B2 (ja) * 2004-10-20 2011-10-26 大日本印刷株式会社 Ｇａ系合金及びこれを用いた有機機能素子
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JP4720949B1 (ja) * 2010-04-09 2011-07-13 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金粉末の製造方法及びＣｕ−Ｇａ合金粉末、並びにＣｕ−Ｇａ合金スパッタリングターゲットの製造方法及びＣｕ−Ｇａ合金スパッタリングターゲット
JP5617493B2 (ja) * 2010-09-29 2014-11-05 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット及びＣｕ−Ｇａ合金スパッタリングターゲットの製造方法
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CN107850400B (zh) 2015-09-28 2019-10-25 株式会社村田制作所 热导管、散热元件、热导管的制造方法
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Also Published As

Publication number Publication date
GB2090614B (en) 1985-02-27
CA1166873A (en) 1984-05-08
NL8105784A (nl) 1982-07-16
US4398975A (en) 1983-08-16
GB2090614A (en) 1982-07-14
KR880000822B1 (ko) 1988-05-11
FR2497390B1 (ko) 1984-10-19
JPS6216038B2 (ko) 1987-04-10
JPS57107501A (en) 1982-07-05
FR2497390A1 (fr) 1982-07-02
DE3150880A1 (de) 1982-08-12

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