JPS6214099B2 - - Google Patents

Info

Publication number
JPS6214099B2
JPS6214099B2 JP56127600A JP12760081A JPS6214099B2 JP S6214099 B2 JPS6214099 B2 JP S6214099B2 JP 56127600 A JP56127600 A JP 56127600A JP 12760081 A JP12760081 A JP 12760081A JP S6214099 B2 JPS6214099 B2 JP S6214099B2
Authority
JP
Japan
Prior art keywords
glass
nail
leadless
head
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56127600A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5828859A (ja
Inventor
Naoharu Teguri
Kenji Ishihara
Makoto Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP12760081A priority Critical patent/JPS5828859A/ja
Publication of JPS5828859A publication Critical patent/JPS5828859A/ja
Publication of JPS6214099B2 publication Critical patent/JPS6214099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12760081A 1981-08-13 1981-08-13 リ−ドレスガラス封止ダイオ−ド Granted JPS5828859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12760081A JPS5828859A (ja) 1981-08-13 1981-08-13 リ−ドレスガラス封止ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12760081A JPS5828859A (ja) 1981-08-13 1981-08-13 リ−ドレスガラス封止ダイオ−ド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP20419686A Division JPS62142336A (ja) 1986-08-29 1986-08-29 リ−ドレスガラス封止ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS5828859A JPS5828859A (ja) 1983-02-19
JPS6214099B2 true JPS6214099B2 (de) 1987-03-31

Family

ID=14964090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12760081A Granted JPS5828859A (ja) 1981-08-13 1981-08-13 リ−ドレスガラス封止ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5828859A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869953U (ja) * 1981-11-02 1983-05-12 日本電気株式会社 半導体装置
JPS5883154U (ja) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 電子部品
JPS5943558A (ja) * 1982-09-02 1984-03-10 Sumitomo Electric Ind Ltd ダイオ−ド電極部品
JPS6071148U (ja) * 1983-10-24 1985-05-20 ローム株式会社 ダイオ−ド
JPH0442932Y2 (de) * 1986-04-30 1992-10-12
JPH0442933Y2 (de) * 1986-04-30 1992-10-12

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022575A (de) * 1973-06-26 1975-03-11
JPS5534683B2 (de) * 1976-06-15 1980-09-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843235Y2 (ja) * 1978-08-28 1983-09-30 日本電気ホームエレクトロニクス株式会社 Ｄｈｄ形ダイオ−ド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022575A (de) * 1973-06-26 1975-03-11
JPS5534683B2 (de) * 1976-06-15 1980-09-09

Also Published As

Publication number Publication date
JPS5828859A (ja) 1983-02-19

Similar Documents

Publication Publication Date Title
JPH0239865B2 (de)
US3337678A (en) Sealed microminiature electronic package
JPS6214099B2 (de)
JPH0110934Y2 (de)
JPS59154054A (ja) ワイヤおよびそれを用いた半導体装置
JPH0637401A (ja) 光半導体容器
JP5193522B2 (ja) 半導体素子収納用セラミックパッケージとその製造方法
JPS6311779B2 (de)
JP2000228482A (ja) 混成集積回路装置
JPS637029B2 (de)
JP2593524Y2 (ja) ハイブリッドｉｃ
JP2528941B2 (ja) ファイバ導入型パッケ―ジとその気密封止方法
JPH0572751B2 (de)
JP4151207B2 (ja) 半導体装置
JP2537630B2 (ja) 半導体装置の製造方法
JPS63285960A (ja) 半導体搭載基板用の導体ピン
JPS622771Y2 (de)
JPH0122260Y2 (de)
JP2533675B2 (ja) 半導体装置及びその製造方法
JPS5916349A (ja) 集積回路装置
JPH0445251Y2 (de)
JPS6077443A (ja) 混成集積回路
JPS6050340B2 (ja) 半導体素子
JPS62205635A (ja) ハイブリツド集積回路の製造方法
JPH07235628A (ja) 電子装置及び半導体集積回路装置の実装方法