JPS6131629B2 - - Google Patents
Info
- Publication number
- JPS6131629B2 JPS6131629B2 JP8015780A JP8015780A JPS6131629B2 JP S6131629 B2 JPS6131629 B2 JP S6131629B2 JP 8015780 A JP8015780 A JP 8015780A JP 8015780 A JP8015780 A JP 8015780A JP S6131629 B2 JPS6131629 B2 JP S6131629B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- electronic components
- lead frame
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 238000005476 soldering Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8015780A JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8015780A JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS577145A JPS577145A (en) | 1982-01-14 |
JPS6131629B2 true JPS6131629B2 (un) | 1986-07-21 |
Family
ID=13710459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8015780A Granted JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577145A (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63169232U (un) * | 1987-04-25 | 1988-11-04 | ||
JPH0520838U (ja) * | 1991-08-29 | 1993-03-19 | 三菱自動車工業株式会社 | 位置決め固定装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6225900Y2 (un) * | 1981-03-18 | 1987-07-02 | ||
JPS58158993A (ja) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | 電子部品の半田処理方法および装置 |
JPS58158992A (ja) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | 半田処理方法 |
US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
CN112122889B (zh) * | 2020-09-27 | 2021-11-19 | 西安远航真空钎焊技术有限公司 | 用于动力矢量喷管隔热板的制备方法 |
-
1980
- 1980-06-16 JP JP8015780A patent/JPS577145A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63169232U (un) * | 1987-04-25 | 1988-11-04 | ||
JPH0520838U (ja) * | 1991-08-29 | 1993-03-19 | 三菱自動車工業株式会社 | 位置決め固定装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS577145A (en) | 1982-01-14 |
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