JPS6131629B2 - - Google Patents
Info
- Publication number
- JPS6131629B2 JPS6131629B2 JP8015780A JP8015780A JPS6131629B2 JP S6131629 B2 JPS6131629 B2 JP S6131629B2 JP 8015780 A JP8015780 A JP 8015780A JP 8015780 A JP8015780 A JP 8015780A JP S6131629 B2 JPS6131629 B2 JP S6131629B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- electronic components
- lead frame
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 238000005476 soldering Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は樹脂封止形電子部品の端子半田付方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a terminal soldering method for resin-sealed electronic components.
従来より樹脂でモールドされた樹脂封止形電子
部品（以下電子部品と称す）の端子の外装処理と
して半田付けが行なわれているが、自動化の要請
により電子部品３を吊りピン２を介してリードフ
レーム１に保持したまま該リードフレーム１を垂
下し、あらかじめ折曲された電子部品の端子４の
根本まで電子部品を半田槽に浸漬して該端子４に
半田を付着させることが行なわれている（第１図
イ，ロ参照）。しかし、かかる方法では半田を付
着させる際に電子部品の下部半分以上が高温の溶
融半田中に浸漬されるので、半田の熱により樹脂
部に歪みが生じたり、あるいはクラツクが発生し
たりして内部の半導体素子を損傷させるなど、電
子部品の特性を劣化させる原因ともなつていた。 Conventionally, soldering has been performed as an exterior treatment for the terminals of resin-molded electronic components (hereinafter referred to as electronic components), but due to demands for automation, electronic components 3 are leaded through hanging pins 2. The lead frame 1 is hung down while being held in the frame 1, and the electronic component is immersed up to the base of the pre-bent terminal 4 in a solder bath to adhere solder to the terminal 4. (See Figure 1 A and B). However, in this method, more than half of the lower part of the electronic component is immersed in high-temperature molten solder when applying the solder, so the heat of the solder can cause distortion in the resin part or cracks, causing internal damage. It was also a cause of deteriorating the characteristics of electronic components, such as damaging semiconductor elements.
一方、上記の難点を回避するために電子部品の
端子４の部分のみが半田に浸漬されるように、吊
りピン２を回転して電子部品を時計方向にそれぞ
れ90゜ずつ回転させ片側ずつ半田を付着させるこ
とも考えられるが、この場合には両側の端子４に
半田を付着し終るまでに吊りピン２がねじ切れる
こともあり実施が困難であつた。 On the other hand, in order to avoid the above-mentioned difficulty, the suspension pins 2 are rotated to rotate each electronic component by 90 degrees clockwise so that only the terminal 4 portion of the electronic component is immersed in the solder, and the solder is applied to one side at a time. Although it is possible to attach the solder to the terminals 4 on both sides, it is difficult to implement this because the hanging pin 2 may be screwed off by the time the solder is attached to the terminals 4 on both sides.
本発明は上記難点を解消するためになされたも
ので、リードフレームに保持された電子部品の端
子に半田を付着させるにあたり、電子部品の下面
を遮蔽治具で遮蔽し、溶融した噴流半田を用いて
電子部品の端子に半田を付着させる電子部品の端
子半田付方法を提供することを目的とするもので
ある。 The present invention has been made to solve the above-mentioned problems, and when attaching solder to the terminals of electronic components held in a lead frame, the lower surface of the electronic component is shielded with a shielding jig, and molten jet solder is used. It is an object of the present invention to provide a method for soldering terminals of electronic components in which solder is applied to terminals of electronic components.
以下図面に基づき本発明の一実施例につき詳細
に説明する。本発明の実施に用いられる遮蔽治具
５は耐熱性、断熱性および半田になじまない性質
を有する短尺の角材６および長尺の角材７，７か
らなつており、角材６は電子部品のリードフレー
ムへの取り付けと同一ピツチで角材７，７に直角
に並設せしめてある（第２図参照）。該角材６の
断面はこれに跨す電子部品の下面を半田から遮蔽
できかつ該電子部品の端子の全体に半田が付着で
きるような大きさとなつており、例えば0.3イン
チの標準型DIP（Dual Inline Package）ICでは
幅６mm、高さ４mmの大きさに形成されている。角
材７，７は角材６を半田槽９の上面に密着させた
ときに噴流半田８が該槽９の外に落流できるよう
に半田槽９の横幅より大きく形成されている（第
〓〓〓〓
３図）。 An embodiment of the present invention will be described in detail below based on the drawings. The shielding jig 5 used to carry out the present invention is made up of a short square piece 6 and a long square piece 7, which have heat resistance, heat insulation properties, and properties that do not fit with solder.The square piece 6 is a lead frame of an electronic component. They are installed in parallel at right angles to the square members 7, 7 at the same pitch as when they were attached to the (see Fig. 2). The cross section of the square bar 6 is large enough to shield the bottom surface of the electronic component that straddles it from solder and to allow solder to adhere to the entire terminal of the electronic component. Package) IC is formed with a width of 6 mm and a height of 4 mm. The square pieces 7, 7 are formed to be larger than the width of the solder tank 9 so that when the square piece 6 is brought into close contact with the upper surface of the solder tank 9, the jet solder 8 can flow down to the outside of the tank 9. 〓
Figure 3).
しかしてかかる遮蔽治具５を用いて電子部品の
端子へ半田付けをする方法は次のとおりである。
すなわちリードフレーム１に保持された電子部品
３を第４図のように角材６に跨せて電子部品の下
面１０を遮蔽し、治具５を垂下して角材６を半田
槽９の上面に密着させる。角材６と６の間で半田
槽９の床に設けられている吹き出し口から吹き出
した、溶融している噴流半田８を流動と表面張力
の作用により山なりに盛り上らせ電子部品の端子
４の根本まで半田を付着させる（第５図、第６
図）。 The method for soldering the terminals of electronic components using the shielding jig 5 is as follows.
That is, as shown in FIG. 4, the electronic component 3 held on the lead frame 1 is placed over a square piece 6 to shield the bottom surface 10 of the electronic component, and the jig 5 is hung down to tightly fit the square piece 6 onto the top surface of the solder tank 9. let The molten jet of solder 8 blown out from the outlet provided on the floor of the solder tank 9 between the square pieces 6 and 6 is heaped up in a mountain shape by the action of flow and surface tension to form the terminal 4 of the electronic component. Adhere the solder to the root of the (Figures 5 and 6)
figure).
上記一実施例から明らかなように本発明の半田
付けの方法によれば噴流半田を用いかつ電子部品
の下面を遮蔽治具で半田から遮蔽して行なうので
樹脂部の歪みやクラツクの発生を防止して電子部
品の端子へ完全に半田を付着することができ、リ
ードフレームに保持したままでも信頼性の高い電
子部品の半田付けが行なえる。 As is clear from the above embodiment, according to the soldering method of the present invention, jet soldering is used and the bottom surface of the electronic component is shielded from the solder using a shielding jig, thereby preventing distortion and cracks in the resin part. This allows solder to completely adhere to the terminals of electronic components, and highly reliable soldering of electronic components can be performed even when the electronic components are held on the lead frame.
なお本実施例においては遮蔽治具として角材６
を用いたが、電子部品３を跨せたときに電子部品
の下面１０を半田から遮蔽できかつ端子４の全体
に半田を付着させることができる形状のものであ
ればよい。例えば第７図のように凹みをつけたも
のでもよく、この場合は伝熱する面積が減少する
のでなお好ましい。またリードフレーム１に半田
が付着すると半田付け後吊りピン２の切断時に金
型を摩耗するので、それを無くすためにリードフ
レーム１に上から遮蔽治具１１を押し当てた状態
で半田付けを行なつてもよい（第８図、第９
図）。 In this example, a square piece 6 is used as a shielding jig.
However, any shape may be used as long as it can shield the bottom surface 10 of the electronic component from solder when the electronic component 3 is straddled, and also allow solder to adhere to the entire terminal 4. For example, it may be recessed as shown in FIG. 7, which is more preferable since the heat transfer area is reduced. Furthermore, if solder adheres to the lead frame 1, the mold will be worn out when the hanging pin 2 is cut after soldering, so in order to avoid this, soldering is performed with the shielding jig 11 pressed against the lead frame 1 from above. You may grow old (Fig. 8, 9)
figure).
第１図イはリードフレームに保持された電子部
品の斜視図、ロは同平面図、第２図は半田付け遮
蔽治具の斜視図、第３図は噴流半田槽上に垂下し
た遮蔽治具と半田の流れを示す説明図、第４図は
遮蔽治具に電子部品を跨らしたときの説明図、第
５図、第６図は電子部品の半田付けの説明図、第
７図は電子部品が跨つた遮蔽治具を示す断面図、
第８図はリードフレームとリードフレームの遮蔽
治具の説明図、第９図はリードフレームに遮蔽治
具を用いたときの半田付けの説明図である。
１……リードフレーム、３……電子部品、４…
…端子、５……遮蔽治具、６……角材、８……噴
流半田。
〓〓〓〓
Figure 1 A is a perspective view of the electronic component held on the lead frame, B is the same plan view, Figure 2 is a perspective view of the soldering shielding jig, and Figure 3 is the shielding jig suspended above the jet soldering bath. Figure 4 is an explanatory diagram showing the flow of solder, Figure 4 is an explanatory diagram when an electronic component is straddled over a shielding jig, Figures 5 and 6 are explanatory diagrams of soldering of electronic components, and Figure 7 is an illustration of electronic components A cross-sectional view showing a shielding jig with parts straddling it,
FIG. 8 is an explanatory diagram of a lead frame and a shielding jig for the lead frame, and FIG. 9 is an explanatory diagram of soldering when the shielding jig is used for the lead frame. 1...Lead frame, 3...Electronic components, 4...
...terminal, 5...shielding jig, 6...square timber, 8...jet solder. 〓〓〓〓
Claims (1)
子部品の端子に半田を付着するにあたり、前記電
子部品の下面を遮蔽し、溶融した噴流半田を用い
て前記端子に半田を付着することを特徴とする電
子部品の端子半田付方法。1. When applying solder to the terminals of a resin-sealed electronic component held in a lead frame, the lower surface of the electronic component is shielded, and the solder is applied to the terminals using molten jet solder. How to solder terminals of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015780A JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015780A JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS577145A JPS577145A (en) | 1982-01-14 |
| JPS6131629B2 true JPS6131629B2 (en) | 1986-07-21 |
Family
ID=13710459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015780A Granted JPS577145A (en) | 1980-06-16 | 1980-06-16 | Soldering method of terminal for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS577145A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63169232U (en) * | 1987-04-25 | 1988-11-04 | ||
| JPH0520838U (en) * | 1991-08-29 | 1993-03-19 | 三菱自動車工業株式会社 | Positioning and fixing device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225900Y2 (en) * | 1981-03-18 | 1987-07-02 | ||
| JPS58158993A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Method and device for soldering electronic part |
| JPS58158992A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Solder treating device for electronic part |
| US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
| CN112122889B (en) * | 2020-09-27 | 2021-11-19 | 西安远航真空钎焊技术有限公司 | Preparation method of thermal insulation board for power vectoring nozzle |
-
1980
- 1980-06-16 JP JP8015780A patent/JPS577145A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63169232U (en) * | 1987-04-25 | 1988-11-04 | ||
| JPH0520838U (en) * | 1991-08-29 | 1993-03-19 | 三菱自動車工業株式会社 | Positioning and fixing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS577145A (en) | 1982-01-14 |
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