JPS577145A - Soldering method of terminal for electronic parts - Google Patents

Soldering method of terminal for electronic parts

Info

Publication number
JPS577145A
JPS577145A JP8015780A JP8015780A JPS577145A JP S577145 A JPS577145 A JP S577145A JP 8015780 A JP8015780 A JP 8015780A JP 8015780 A JP8015780 A JP 8015780A JP S577145 A JPS577145 A JP S577145A
Authority
JP
Japan
Prior art keywords
bars
jig
terminal
soldering
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8015780A
Other languages
Japanese (ja)
Other versions
JPS6131629B2 (en
Inventor
Yuji Miura
Minoru Kagino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8015780A priority Critical patent/JPS577145A/en
Publication of JPS577145A publication Critical patent/JPS577145A/en
Publication of JPS6131629B2 publication Critical patent/JPS6131629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent distortion and crackings of a resin coated section of parts and improve the reliability with a perfect soldering by mounting a terminal thereof retained with a lead frame employing a jet soldering while the undersurface thereof is shielded with a jig. CONSTITUTION:In the mounting process of soldering a terminal 4 of a resin sealed electronic parts 3, a shielding jig is used which is made up of square bars 6 and 7 with a proper heat resistance and heat insulation and completely alien to the solder used. The bars 6 of the jig 5 are arranged side by side at the same pitch as the lead frame 1 and at the right angle to the bars 7. The bars are spaced wider than the solder baths which will be in close contact with the bars 6. With the bars 6 laid over the jig 5, the parts is mounted thereon being shielded. Jet solder baths are put in close contact with the jig from below so that the terminal 4 may be soldered with a flow 8 of swelled solder. Such a thermal shielding of the resin sealed section of the parts enables the soldering thereof as retained with the lead frame thereby eliminating the deterioration in the component due to crackings of the resin section thereof.
JP8015780A 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts Granted JPS577145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8015780A JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8015780A JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Publications (2)

Publication Number Publication Date
JPS577145A true JPS577145A (en) 1982-01-14
JPS6131629B2 JPS6131629B2 (en) 1986-07-21

Family

ID=13710459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8015780A Granted JPS577145A (en) 1980-06-16 1980-06-16 Soldering method of terminal for electronic parts

Country Status (1)

Country Link
JP (1) JPS577145A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57150954U (en) * 1981-03-18 1982-09-22
JPS58158993A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Method and device for soldering electronic part
JPS58158992A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Solder treating device for electronic part
WO2006069368A2 (en) * 2004-12-21 2006-06-29 Intel Corporation Method and system for performing die attach using a flame
CN112122889A (en) * 2020-09-27 2020-12-25 西安远航真空钎焊技术有限公司 Preparation method of thermal insulation board for power vectoring nozzle

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169232U (en) * 1987-04-25 1988-11-04
JPH0520838U (en) * 1991-08-29 1993-03-19 三菱自動車工業株式会社 Positioning and fixing device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57150954U (en) * 1981-03-18 1982-09-22
JPS6225900Y2 (en) * 1981-03-18 1987-07-02
JPS58158993A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Method and device for soldering electronic part
JPS58158992A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Solder treating device for electronic part
JPH0142504B2 (en) * 1982-03-17 1989-09-13 Hitachi Seisakusho Kk
WO2006069368A2 (en) * 2004-12-21 2006-06-29 Intel Corporation Method and system for performing die attach using a flame
WO2006069368A3 (en) * 2004-12-21 2006-10-26 Intel Corp Method and system for performing die attach using a flame
US7288472B2 (en) 2004-12-21 2007-10-30 Intel Corporation Method and system for performing die attach using a flame
KR100891314B1 (en) 2004-12-21 2009-04-01 인텔 코오퍼레이션 Method and system for performing die attach using a flame
CN112122889A (en) * 2020-09-27 2020-12-25 西安远航真空钎焊技术有限公司 Preparation method of thermal insulation board for power vectoring nozzle
CN112122889B (en) * 2020-09-27 2021-11-19 西安远航真空钎焊技术有限公司 Preparation method of thermal insulation board for power vectoring nozzle

Also Published As

Publication number Publication date
JPS6131629B2 (en) 1986-07-21

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