JPH04150063A - Cutter of electric component lead terminal - Google Patents
Cutter of electric component lead terminalInfo
- Publication number
- JPH04150063A JPH04150063A JP2275712A JP27571290A JPH04150063A JP H04150063 A JPH04150063 A JP H04150063A JP 2275712 A JP2275712 A JP 2275712A JP 27571290 A JP27571290 A JP 27571290A JP H04150063 A JPH04150063 A JP H04150063A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead terminal
- cutter
- cutting
- rust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000003449 preventive effect Effects 0.000 abstract 4
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Punching Or Piercing (AREA)
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品のリード端子切断装置に関し、より詳
細には通信機器等に使用されるＩＣチップ、ＬＳＩチッ
プ等の半導体チップを実装したリードフレームの櫛状リ
ードを切断することによってリード端子を有する電子部
品を得るための電子部品のリード端子切断装置の改良に
関する。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a lead terminal cutting device for electronic components, and more specifically to a lead terminal cutting device for electronic components, and more specifically for cutting leads mounted with semiconductor chips such as IC chips and LSI chips used in communication equipment, etc. The present invention relates to an improvement in an electronic component lead terminal cutting device for obtaining an electronic component having lead terminals by cutting comb-shaped leads of a frame.
（従来の技術）
従来の通信機器等に使用する電子部品は、生産効率を向
上するため以下のようにして製造するのが一般的である
。(Prior Art) Electronic components used in conventional communication equipment and the like are generally manufactured as follows in order to improve production efficiency.
即ち、製造工程をモデル的に示した第５図の如＜ Ｄ
Ｉ Ｐ （Ｄｕａｌ Ｉｎ Ｌｉｎｅ Ｐａｃｋａｇｅ
）式のＩＣ部品１０１は、所定の間隔をおいて平行に配
置した連接片１０３と、各連設片１０３の内側の適所か
ら内側へ向けて延ばした複数の櫛状リード１０５．１０
５・・・とから成り長手方向に搬送されるリードフレー
ム１０７の所定位置に、該リードフレーム１０７と対向
して移動するベルト１０８により搬送したＩＣチップ１
０９を配置してがらり−Ｈフレーム１０７のリード１０
５とＩＣチップ１０９の内部回路（図示しない）とをワ
イヤボンディング等により電気的に接続した後、ＩＣチ
ップ１０９の周辺全体をエポキシ樹脂１１１等によりモ
ールドし、然る後にリードフレーム１０７の櫛状リード
１０５．１０５・・・を適当な長さにて切断することに
よって所定長のリード端子１０５Ａ、１０５Ａ・・・を
有した個々のＩＣｆｆ１品１０１を得てから、ＩＣ部品
１０１のリード端子１０５Ａ、１０５Ａ・・・を所定形
状に成形していた。That is, as shown in Figure 5, which shows a model of the manufacturing process.
IP (Dual In Line Package)
) type IC component 101 includes connecting pieces 103 arranged in parallel at predetermined intervals, and a plurality of comb-shaped leads 105 and 10 extending inward from appropriate positions inside each connecting piece 103.
The IC chip 1 is placed at a predetermined position on a lead frame 107 which is conveyed in the longitudinal direction and is conveyed by a belt 108 that moves opposite to the lead frame 107.
Place 09 - Lead 10 of H frame 107
5 and the internal circuit (not shown) of the IC chip 109 by wire bonding or the like, the entire periphery of the IC chip 109 is molded with epoxy resin 111 or the like, and then the comb-shaped leads of the lead frame 107 are molded. 105, 105... to an appropriate length to obtain each ICff1 product 101 having lead terminals 105A, 105A... of a predetermined length, and then cut the lead terminals 105A, 105A of the IC component 101. ... was molded into a predetermined shape.
リードフレーム１０７の櫛状リード１０５．１０５・・
・を切り揃えることによってＩＣ部品１ｏ１のリード端
子１０５Ａ、１０５Ａ・・・を得るには、例えば第６図
に示す如きリード端子切断装置２０１を使用する。第６
図に示す切断装置２０１は、ＩＣ部品１０１のリードフ
レーム１０７からの切断とリード端子１０５Ａ、１０５
Ａ・・・の成形とを同時に行なうものであって、リード
端子１０５Ａ、１０５Ａ・・・を上下から挟圧すること
によって該リード端子１０５Ａ、１０５Ａ・・・をクラ
ンク状に成形するため所定の間隔をおいて対向配置した
上下一対の上下型２０３．２０５と、上下型２０３．２
０５の側面に芭接配置すると共に上方から降下すること
によって下方型２０５の角部２０５ａとの間で圧接状態
にあるリード７Ｌ、−ム１０７ｉ７）櫛状リード１０５
Ａ、１０５Ａ・・・を剪断するため切断刃（下端面）２
０７ａが平坦な形状を有したカッタ２０７とを備久るよ
う構成する。剪断後は上方型２０３を上昇することによ
り所定長のリード端子１０５Ａ、１０５Ａ・・・を有し
たＩＣ部品１０１を取外すことができる。Comb-shaped leads 105, 105 of lead frame 107...
In order to obtain the lead terminals 105A, 105A, . . . of the IC component 1o1 by trimming them, for example, a lead terminal cutting device 201 as shown in FIG. 6 is used. 6th
The cutting device 201 shown in the figure cuts the IC component 101 from the lead frame 107 and the lead terminals 105A, 105.
The molding of A... is carried out at the same time, and the lead terminals 105A, 105A... are pressed from above and below to form the lead terminals 105A, 105A... into a crank shape at a predetermined interval. A pair of upper and lower molds 203.205 and upper and lower molds 203.2 are arranged opposite to each other.
Comb-shaped lead 105 is placed in contact with the side surface of the mold 05 and descends from above to be in pressure contact with the corner 205a of the lower mold 205.
Cutting blade (lower end surface) 2 for shearing A, 105A...
The cutter 207 has a flat shape. After shearing, the IC component 101 having lead terminals 105A, 105A, . . . of a predetermined length can be removed by lifting the upper mold 203.
一方、第７図に示す切断装置２０９は、上下型２０３．
２０５の側面に烹接配置すると共に下方から上昇するこ
とによって上方型２０３の角部２０３ａとの間でリード
フレーム１０７の櫛状り−６１０５，１０５・・・を剪
断するため切断刃（上端面）２１１ａが平坦な形状を有
したカッタ２１１を備える。On the other hand, the cutting device 209 shown in FIG.
A cutting blade (upper end surface) for shearing the comb-like edges -6105, 105, etc. of the lead frame 107 between it and the corner 203a of the upper die 203 by disposing it in close contact with the side surface of the lead frame 205 and rising from below. The cutter 211 has a flat shape.
上記のようなりＩＰ式ＩＣの他にＱＳＰ（ＱｕａｄＦｌ
ａｔ Ｐａｃｋａｇｅ Ｊ式のＩＣ部品においてもこの
ような櫛状リード１０５．１０５・・・を有するリード
フレーム１０７を使用し、ＩＣ部品１０１の実装を終了
した後でカッタ２０７．２１１により切断することによ
ってリード端子１０５Ａ、１０５Ａ・・・を得るように
している。In addition to the IP type IC mentioned above, QSP (QuadFl)
At Package J type IC components also use a lead frame 107 having such comb-shaped leads 105, 105, etc. After mounting the IC component 101, the leads are cut by cutters 207, 211. Terminals 105A, 105A, . . . are obtained.
このようにして製造した個々のＩＣ部品１０１はそのク
ランク状リード端子１０５Ａ、１０５Ａ・・・の下面を
プリント基板（図示しない）上のパターンに半田付けす
ることにより該基板に実装するものであり、上述したリ
ードフレーム１０７のリード１０５．１０５・・・は銅
合金又は鉄合金より成っていると共にその外表面にはス
ズ又は半田等の防錆被覆１１１．１１１・・・を施して
成っている。The individual IC components 101 manufactured in this manner are mounted on a printed circuit board (not shown) by soldering the lower surfaces of the crank-shaped lead terminals 105A, 105A, . . . to a pattern on the circuit board. The leads 105, 105, etc. of the lead frame 107 described above are made of copper alloy or iron alloy, and their outer surfaces are coated with anti-rust coatings 111, 111, etc. of tin or solder.
しかしながら、このような従来のリード端子切断装置２
０１．２０９にあっては、カッタ２０７．２１１の切断
刃２０７ａ、２１１ａが平坦な形状を有しているためリ
ードフレーム１０７を切断すると、リード端子１０５Ａ
、１０５Ａ・・・の端面を鋭利に切断する結果、外表面
の防！ｌＩ被覆１１１．１１１・・・が切断面に伸展せ
ず該端面の銅材が大きな面積に渡って露出する。リード
端子１０５Ａ、１０５Ａ・・・の端面に銅材が大きな面
積に渡って露出していると、ＩＣ部品１０１がプリント
基板に実装されるまでの間に銅材端面に鎖が発生し半田
の付着力が弱くなってプリント基板への実装が困難とな
ることが少な（ない。However, such a conventional lead terminal cutting device 2
01.209, the cutting blades 207a and 211a of the cutter 207.211 have a flat shape, so when the lead frame 107 is cut, the lead terminal 105A
, 105A... As a result of cutting the end face sharply, the outer surface is prevented! The lI coating 111, 111... does not extend to the cut surface, and the copper material on the end surface is exposed over a large area. If a large area of copper material is exposed on the end faces of the lead terminals 105A, 105A, etc., chains will form on the end faces of the copper material before the IC component 101 is mounted on the printed circuit board, causing solder adhesion. It is rare that the adhesion strength becomes weak and mounting on a printed circuit board becomes difficult.
ところで、カッタ２０７を上昇することによって切断す
る装置２０１では切断後にリード端子１０５Ａ、１０５
Ａ・・・の端面１１３．１１３・・・の下部に防錆被１
１１１．１１１・・・が残存するため（第８図参明）、
プリント基板の接続部側（下側）に防錆被覆１１１．１
１１・・・が残存する結果、斯かる問題は生じにくい。By the way, in the device 201 that cuts by raising the cutter 207, the lead terminals 105A, 105 are removed after cutting.
Rust-preventive coating 1 on the bottom of the end face 113, 113... of A...
111.111... remains (see Figure 8),
Anti-rust coating 111.1 on the connection side (lower side) of the printed circuit board
11... remains, such a problem is less likely to occur.
ところが、カッタ２１１を下降することによってリード
端子１０５Ａ、１０５Ａ・・・を切断する装置２０９に
あっては、切断後にリード端子１０５Ａ、１０５Ａ・・
・の端面１１３．１１３・・・の上部に防錆被覆１１１
．１１１・・・が残存するため（第９図参昭）、プリン
ト基板の接続部側に防錆被覆１１１．１１１・・・が残
存するものではないから斯かる問題が生じやすい。However, in the device 209 that cuts the lead terminals 105A, 105A, etc. by lowering the cutter 211, the lead terminals 105A, 105A,...
・Anti-rust coating 111 on the top of the end surface 113, 113...
．． 111... remain (see Fig. 9), and the rust-preventive coating 111, 111... remains on the connection portion side of the printed circuit board, so such a problem is likely to occur.
（発明の目的）
上言己課題を達成するため、本発明は、リードフレーム
のリードを切断した後におけるリード端子の端面を防錆
処理するよう切断することができる電子部品のリード端
子切断装置の提供を目的とする。(Object of the Invention) In order to achieve the above-mentioned problems, the present invention provides a lead terminal cutting device for electronic components that can cut the end face of the lead terminal after cutting the lead of a lead frame so as to provide rust prevention treatment. For the purpose of providing.
（発明の概要）
上記目的を達成するため、本発明においては以下の如き
構成をとる。(Summary of the Invention) In order to achieve the above object, the present invention adopts the following configuration.
即ち、電子部品のリードを切断するカッタは、切断後に
おける電子部品のリード端子の先端部断面形状がカッタ
の昇降方向に対して傾斜した刃形状とすると共に、リー
ド端子の外表面に施した防錆被覆を伸展して該リード端
子の先端斜面の表面を覆うような角度を有するよう構成
する。In other words, the cutter for cutting the leads of electronic components has a blade shape in which the cross-sectional shape of the tip of the lead terminal of the electronic component after cutting is inclined with respect to the vertical direction of the cutter, and the cutter has a blade shape that is inclined with respect to the vertical direction of the cutter. The rust coating is configured to have an angle such that it extends to cover the surface of the sloped end of the lead terminal.
（発明の実施例）
以下、図面を参昭しつつ好適な実施例に基づいて本発明
の詳細な説明する。(Embodiments of the Invention) The present invention will be described in detail below based on preferred embodiments with reference to the drawings.
第１図は本発明の一実施例に係る電子部品のリード端子
切断装置１を示し、この切断装置１は、従来例で示した
リードフレーム３からのＩＣ部品（半導体部品）５の切
断とリード端子７．７・・・の成形とを同時に行なうも
のであって、リード端子７．７・・・を上下から挟圧し
てクランク状に成形するため所定の間隔をおいて対向配
置した上下一対の上下型９．１１と、上方型９の下縁部
に一体的に構成した上方カッタ１３と、下方型１１の側
部に密接配置すると共に下方より上昇することにより上
方カッタ１３との間で圧接状態にあるリードフレーム３
の櫛状リード１５．１５・・・を剪断するため切断面（
上端面）１７ａが平坦な形状を有した下方カッタ１７と
を備え、且つ前記上方カッタ１３は、切断後におけるＩ
Ｃ部品５のリード端子７．７・・・の先端部における断
面形状が上方カッタ１３の昇降方向に対して傾斜（本実
施例では約４０度）するような刃形状とすると共に、リ
ード端子７．７・・・の外表面に施した防錆被１！１１
９．１９・・・を伸展して該リード端子７．７・・・の
先端斜面２１．２１・・・の表面を覆うような角度を有
するよう構成する。FIG. 1 shows a lead terminal cutting device 1 for electronic components according to an embodiment of the present invention. The molding of the terminals 7.7... is carried out at the same time, and in order to press the lead terminals 7.7... from above and below and form them into a crank shape, a pair of upper and lower leads arranged oppositely at a predetermined interval are used. The upper and lower molds 9.11, the upper cutter 13 which is integrally formed at the lower edge of the upper mold 9, and the upper cutter 13 which is closely arranged on the side of the lower mold 11 and rises from below are pressed into contact with each other. Lead frame 3 in condition
The cut surface (
a lower cutter 17 whose upper end surface) 17a has a flat shape, and the upper cutter 13 has an I
The lead terminals 7. Rust-preventive coating applied to the outer surface of .7...1!11
9.19... are configured to have an angle such that they extend to cover the surfaces of the tip slopes 21, 21... of the lead terminals 7.7....
斯く構成することにより、リードフレーム３の所定位！
にＩＣチップ（図示しない）を実装した後、上方型９を
下降すると共に下方カッタ１７を上昇すると、リードフ
レーム３の櫛状リード１５．１５・・・を上下型９．１
１の間で挟持しつつ上方型９の上方カッタ１３と下方カ
ッタ１７との間でリード１５．１５・・・を適所にて切
断すると共に、上方カッタ１３がリード１５．１５・・
・の切断部における上方の防錆被覆１９．１９・・・を
傾斜した端面２１．２１・・・に沿って下方に押し伸ば
すことによって防錆被覆１９．１９・・・を残留するた
め、鋼材の露出部に錆が発生してもその面積は僅かであ
るから、その錆がＩＣ部品５をプリント基板へ半田付け
する際に与える影響も小さい。With this configuration, the lead frame 3 can be placed in the specified position!
After mounting an IC chip (not shown) on the upper mold 9, the upper mold 9 is lowered and the lower cutter 17 is raised.
The upper cutter 13 and lower cutter 17 of the upper mold 9 cut the leads 15, 15, .
・In order to leave the rust-proof coating 19.19... by pushing the upper rust-proof coating 19.19... downward along the inclined end surface 21.21..., the steel material Even if rust occurs on the exposed portion, the area is small, so the rust has little effect on soldering the IC component 5 to the printed circuit board.
又、前述の実施例の上方カッタ１３を上方型９の側部に
富接配置してもよく、下方カッタ１７も上方カッタ１３
の刃形状と対向するような傾斜した刃形状を有するよう
構成してもよい（第 図参昭）。この場合、リード端子
７．７・・・の先端形状が両刃状となることはいうまで
もない。Further, the upper cutter 13 of the above-described embodiment may be disposed in close contact with the side of the upper mold 9, and the lower cutter 17 is also connected to the upper cutter 13.
It may be configured to have an inclined blade shape that is opposite to the blade shape of (see Fig. 1). In this case, it goes without saying that the tips of the lead terminals 7, 7, . . . have a double-edged shape.
尚、本発明において電子部品とは、ＩＣ，ＬＳＩ等に限
定されるものではなく、電子部品を搭載する各種モジュ
ール、コネクタ等も含む概念である。又、リード端子７
．７・・・は、図示以外のフラットリード、コネクタの
ビン、ＤＩＰ端子、ＳＩＰ端子等であっても同様な切断
処理を行なえることは勿論である。Note that in the present invention, electronic components are not limited to ICs, LSIs, etc., but are a concept that also includes various modules, connectors, etc. on which electronic components are mounted. Also, lead terminal 7
．． Of course, the same cutting process can be applied to flat leads, connector pins, DIP terminals, SIP terminals, etc. other than those shown in the drawings.
（発明の効果）
以上説明した如く本発明は、電子部品のリード端子を切
断するカッタの刃形状をリード端子の外表面に施した防
錆被覆を伸展して該リード端子の先端斜面の表面を覆う
ような傾斜角度を有するよう構成したため、電子部品の
リード端子の端面を防錆処理することができる。(Effects of the Invention) As explained above, the present invention extends a rust-preventive coating on the outer surface of the lead terminal in the shape of a cutter blade for cutting the lead terminal of an electronic component, thereby cutting the surface of the sloped end of the lead terminal. Since it is configured to have an inclination angle that covers it, the end face of the lead terminal of the electronic component can be subjected to rust prevention treatment.
第１図は本発明に係る電子部品のリード端子切断装置の
一実施例を示す断面図、第２図は第１図の切断装置によ
り切断したリード端子の拡大された先端断面図、第３図
は他の実施例を示す断面図、第４図は第３図の切断装置
により切断したリード端子の拡大された先端断面図、第
５図は従来の電子部品の製造方法を示す平面図、第６図
は従来のリード端子切断装置の断面図、第７図は他の従
来例のリード端子切断装置の断面図、第８図は第６図の
切断装置により切断したリード端子の拡大された先端断
面図、第９図は第７図の装置により切断したリード端子
の拡大された先端断面図である。
３・・・リードフレーム、５・・・ＩＣ部品（電子部品
）、７．７・・・リード端子、ＩＳ・・・リード、１７
・・・カッタ、１９．１９・・・防錆被覆、２１．２１
・・・リード端子端面、２３・・・ＩＣチップ（半導体
チップ）
特許出願人 東洋通信機株式会社
代理人 弁理士 鈴 木 均
第１薗
第２図
第３図
第４図
１つFIG. 1 is a cross-sectional view showing one embodiment of a lead terminal cutting device for electronic components according to the present invention, FIG. 2 is an enlarged cross-sectional view of the tip of a lead terminal cut by the cutting device of FIG. 1, and FIG. 4 is an enlarged sectional view of the tip of a lead terminal cut by the cutting device shown in FIG. 3; FIG. 5 is a plan view showing a conventional method for manufacturing electronic components; Figure 6 is a sectional view of a conventional lead terminal cutting device, Figure 7 is a sectional view of another conventional lead terminal cutting device, and Figure 8 is an enlarged tip of a lead terminal cut by the cutting device of Figure 6. The sectional view, FIG. 9, is an enlarged sectional view of the tip of the lead terminal cut by the apparatus of FIG. 7. 3... Lead frame, 5... IC component (electronic component), 7.7... Lead terminal, IS... Lead, 17
... Cutter, 19.19 ... Rust-proof coating, 21.21
...Lead terminal end face, 23...IC chip (semiconductor chip) Patent applicant: Toyo Tsushinki Co., Ltd. Agent Patent attorney Hitoshi Suzuki
Claims (1)
るリードフレームより前記半導体チップを含む電子部品
とそのリード端子とを得るため該リードフレームに設け
たリードの軸と直交する方向に昇降することによって該
リードを切断するカッタを備えた電子部品のリード端子
切断装置であって、 前記カッタは、切断後における電子部品のリード端子の
先端部における断面形状が該カッタの昇降方向に対して
傾斜するような刃形状とすると共に、前記リード端子の
外表面に施した防錆被覆を伸展して該リード端子の先端
斜面の表面を覆うような角度を有したことを特徴とする
電子部品のリード端子切断装置。[Claims] In order to obtain an electronic component including the semiconductor chip and its lead terminals from a lead frame having comb-shaped leads connected to the internal circuit of the semiconductor chip, the electronic component and its lead terminals are perpendicular to the axis of the leads provided on the lead frame. A device for cutting a lead terminal of an electronic component, comprising a cutter that cuts the lead by moving up and down in the direction, wherein the cutter has a cross-sectional shape at the tip of the lead terminal of the electronic component after cutting. It is characterized by having a blade shape that is inclined relative to the lead terminal, and has an angle such that the anti-rust coating applied to the outer surface of the lead terminal extends to cover the surface of the sloped tip of the lead terminal. Lead terminal cutting device for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275712A JPH0740601B2 (en) | 1990-10-15 | 1990-10-15 | Lead terminal cutting device for electronic parts and rustproof structure for lead terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275712A JPH0740601B2 (en) | 1990-10-15 | 1990-10-15 | Lead terminal cutting device for electronic parts and rustproof structure for lead terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04150063A true JPH04150063A (en) | 1992-05-22 |
| JPH0740601B2 JPH0740601B2 (en) | 1995-05-01 |
Family
ID=17559323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2275712A Expired - Fee Related JPH0740601B2 (en) | 1990-10-15 | 1990-10-15 | Lead terminal cutting device for electronic parts and rustproof structure for lead terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0740601B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218525A (en) * | 2007-02-28 | 2008-09-18 | Sanyo Electric Co Ltd | Cutting method of conductive member, and method for manufacturing circuit device |
| CN106914567A (en) * | 2017-05-03 | 2017-07-04 | 宜兴市吉泰电子有限公司 | The general shearing die and cutting method of electronic encapsulation shell outer lead technique line |
| CN106925921A (en) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | Solar cell busbar welder |
| CN107900257A (en) * | 2017-12-31 | 2018-04-13 | 陈惠海 | A kind of device for being used to process stirrup |
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| CN110523846A (en) * | 2019-09-30 | 2019-12-03 | 中国电子科技集团公司第四十研究所 | A kind of general knife edge die of hydrid integrated circuit metal shell exit |
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1990
- 1990-10-15 JP JP2275712A patent/JPH0740601B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218525A (en) * | 2007-02-28 | 2008-09-18 | Sanyo Electric Co Ltd | Cutting method of conductive member, and method for manufacturing circuit device |
| CN106925921A (en) * | 2015-12-31 | 2017-07-07 | 苏州博阳能源设备有限公司 | Solar cell busbar welder |
| CN106914567A (en) * | 2017-05-03 | 2017-07-04 | 宜兴市吉泰电子有限公司 | The general shearing die and cutting method of electronic encapsulation shell outer lead technique line |
| JP2018207610A (en) * | 2017-05-31 | 2018-12-27 | アイシン精機株式会社 | Rotary electric machine |
| CN107900257A (en) * | 2017-12-31 | 2018-04-13 | 陈惠海 | A kind of device for being used to process stirrup |
| CN107900257B (en) * | 2017-12-31 | 2024-03-15 | 陈惠海 | Device for machining stirrups |
| CN110523846A (en) * | 2019-09-30 | 2019-12-03 | 中国电子科技集团公司第四十研究所 | A kind of general knife edge die of hydrid integrated circuit metal shell exit |
| CN114160871A (en) * | 2021-12-11 | 2022-03-11 | 中国科学院长春光学精密机械与物理研究所 | Shearing auxiliary tool for surface-mounted device lead |
| CN114160871B (en) * | 2021-12-11 | 2022-11-01 | 中国科学院长春光学精密机械与物理研究所 | Shearing auxiliary tool for surface-mounted device lead |
| CN114749586A (en) * | 2022-04-28 | 2022-07-15 | 三河建华高科有限责任公司 | Electronic component stitch bending and shearing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0740601B2 (en) | 1995-05-01 |
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