JPS6130749B2 - - Google Patents

Info

Publication number
JPS6130749B2
JPS6130749B2 JP55156354A JP15635480A JPS6130749B2 JP S6130749 B2 JPS6130749 B2 JP S6130749B2 JP 55156354 A JP55156354 A JP 55156354A JP 15635480 A JP15635480 A JP 15635480A JP S6130749 B2 JPS6130749 B2 JP S6130749B2
Authority
JP
Japan
Prior art keywords
resin
lead
lead frame
plated
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55156354A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5779653A (en
Inventor
Mitsuru Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55156354A priority Critical patent/JPS5779653A/ja
Publication of JPS5779653A publication Critical patent/JPS5779653A/ja
Publication of JPS6130749B2 publication Critical patent/JPS6130749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55156354A 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device Granted JPS5779653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55156354A JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55156354A JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS5779653A JPS5779653A (en) 1982-05-18
JPS6130749B2 true JPS6130749B2 (https=) 1986-07-15

Family

ID=15625916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55156354A Granted JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5779653A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
US4876587A (en) * 1987-05-05 1989-10-24 National Semiconductor Corporation One-piece interconnection package and process
FR2629272B1 (fr) * 1988-03-22 1990-11-09 Bull Sa Support de circuit integre de haute densite et appareil d'etamage selectif des conducteurs du support

Also Published As

Publication number Publication date
JPS5779653A (en) 1982-05-18

Similar Documents

Publication Publication Date Title
US5703398A (en) Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
JP2989406B2 (ja) 半導体装置用プリプレーテッドフレーム及びその製造方法
JPS6130749B2 (https=)
JPS62205653A (ja) リ−ドフレ−ムおよび半導体装置の製造方法
JPS59161850A (ja) 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム
KR100479243B1 (ko) 전기도금된리드를가진반도체장치의제조방법
JPS59144160A (ja) プラスチツク封止型ｉｃ
KR800000215B1 (ko) 부분 도금법
JPS61163644A (ja) 半導体装置の封止方法と封止部材
KR100196896B1 (ko) 반도체 패키지
JPS6210030B2 (https=)
JPH07147292A (ja) 半導体装置の製造方法
JPS6364052B2 (https=)
JP2003249605A (ja) 半導体装置、その製造方法、及びその金型
JPH04253364A (ja) リードフレーム
JP2001094027A (ja) 半導体装置及びその製造方法
JPH0637123A (ja) 半導体装置
JP2743567B2 (ja) 樹脂封止型集積回路
JPS5942977B2 (ja) 半導体装置の製造方法
JPS5998548A (ja) プラスチツクパツケ−ジ半導体装置
JPS5831546A (ja) 半導体装置の製造方法
JPH0423459A (ja) 半導体装置およびその製造方法並びにそれに使用されるリードフレーム
JPH0422340B2 (https=)
JPH0834276B2 (ja) リードフレームの製造方法
JPS63120450A (ja) 半導体装置の製造方法およびこれに用いるリ−ドフレ−ム