JPS5779653A - Lead frame for resin-sealed semiconductor device - Google Patents

Lead frame for resin-sealed semiconductor device

Info

Publication number
JPS5779653A
JPS5779653A JP55156354A JP15635480A JPS5779653A JP S5779653 A JPS5779653 A JP S5779653A JP 55156354 A JP55156354 A JP 55156354A JP 15635480 A JP15635480 A JP 15635480A JP S5779653 A JPS5779653 A JP S5779653A
Authority
JP
Japan
Prior art keywords
resin
lead
lead frame
tin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55156354A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130749B2 (https=
Inventor
Mitsuru Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55156354A priority Critical patent/JPS5779653A/ja
Publication of JPS5779653A publication Critical patent/JPS5779653A/ja
Publication of JPS6130749B2 publication Critical patent/JPS6130749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55156354A 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device Granted JPS5779653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55156354A JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55156354A JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS5779653A true JPS5779653A (en) 1982-05-18
JPS6130749B2 JPS6130749B2 (https=) 1986-07-15

Family

ID=15625916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55156354A Granted JPS5779653A (en) 1980-11-06 1980-11-06 Lead frame for resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5779653A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876587A (en) * 1987-05-05 1989-10-24 National Semiconductor Corporation One-piece interconnection package and process
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
US4985749A (en) * 1988-03-22 1991-01-15 Bull S.A. Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942455A (en) * 1986-10-13 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
US5026669A (en) * 1986-10-13 1991-06-25 Mitsubishi Denki Kabushiki Kaisha Method of eliminating burrs on a lead frame with a thin metal coating
US4876587A (en) * 1987-05-05 1989-10-24 National Semiconductor Corporation One-piece interconnection package and process
US4985749A (en) * 1988-03-22 1991-01-15 Bull S.A. Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads
US5081949A (en) * 1988-03-22 1992-01-21 Bull S.A. Apparatus for selective tinning of substrate leads

Also Published As

Publication number Publication date
JPS6130749B2 (https=) 1986-07-15

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