JPS6210030B2 - - Google Patents

Info

Publication number
JPS6210030B2
JPS6210030B2 JP53026563A JP2656378A JPS6210030B2 JP S6210030 B2 JPS6210030 B2 JP S6210030B2 JP 53026563 A JP53026563 A JP 53026563A JP 2656378 A JP2656378 A JP 2656378A JP S6210030 B2 JPS6210030 B2 JP S6210030B2
Authority
JP
Japan
Prior art keywords
pellet
lead
solder
lead frame
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53026563A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54119878A (en
Inventor
Reisei Kawase
Tadashi Ooshio
Takeshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2656378A priority Critical patent/JPS54119878A/ja
Publication of JPS54119878A publication Critical patent/JPS54119878A/ja
Publication of JPS6210030B2 publication Critical patent/JPS6210030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2656378A 1978-03-10 1978-03-10 Manufacture for semiconductor device Granted JPS54119878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2656378A JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2656378A JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54119878A JPS54119878A (en) 1979-09-18
JPS6210030B2 true JPS6210030B2 (https=) 1987-03-04

Family

ID=12196994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2656378A Granted JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54119878A (https=)

Also Published As

Publication number Publication date
JPS54119878A (en) 1979-09-18

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