JPS54119878A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54119878A
JPS54119878A JP2656378A JP2656378A JPS54119878A JP S54119878 A JPS54119878 A JP S54119878A JP 2656378 A JP2656378 A JP 2656378A JP 2656378 A JP2656378 A JP 2656378A JP S54119878 A JPS54119878 A JP S54119878A
Authority
JP
Japan
Prior art keywords
solder
solder plating
molten
bonding
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2656378A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210030B2 (https=
Inventor
Reisei Kawase
Tadashi Oshio
Takeshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2656378A priority Critical patent/JPS54119878A/ja
Publication of JPS54119878A publication Critical patent/JPS54119878A/ja
Publication of JPS6210030B2 publication Critical patent/JPS6210030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2656378A 1978-03-10 1978-03-10 Manufacture for semiconductor device Granted JPS54119878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2656378A JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2656378A JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54119878A true JPS54119878A (en) 1979-09-18
JPS6210030B2 JPS6210030B2 (https=) 1987-03-04

Family

ID=12196994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2656378A Granted JPS54119878A (en) 1978-03-10 1978-03-10 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54119878A (https=)

Also Published As

Publication number Publication date
JPS6210030B2 (https=) 1987-03-04

Similar Documents

Publication Publication Date Title
GB1457806A (en) Semiconductor device manufacture
GB1159979A (en) Improvements in and relating to Methods of Electrically Connecting Objects
JPS5586130A (en) Connection of semiconductor element
US3233309A (en) Method of producing electrically asymmetrical semiconductor device of symmetrical mechanical design
JPS54119878A (en) Manufacture for semiconductor device
JPS5737867A (en) Semiconductor device
JPS54129880A (en) Manufacture for semiconductor device
JPS5951741B2 (ja) 樹脂封止形半導体装置
JPS56101752A (en) Semiconductor device
JPS61177754A (ja) 樹脂封止形半導体装置
JPS5996742A (ja) 半田付け方法
JPS5518029A (en) Method of fabricating resin sealed type semiconductor device
KR810001418Y1 (ko) 반도체 장치
JPS57141933A (en) Semiconductor device
JPS57114242A (en) Semiconductor device
JPS568851A (en) Lead wire connecting method of semiconductor device
JPS54119876A (en) Manufacture for semiconductor device
JPS59208758A (ja) 複合半導体装置用半導体素子
JPS61134031A (ja) 半導体素子用熱圧着装置
JPS5445575A (en) Manufacture for semiconductor device
JPS58200546A (ja) 半導体装置
JPS5914908B2 (ja) インナ−リ−ドボンデイング装置
JPS54140470A (en) Semiconductor device
JPH0155577B2 (https=)
JPS54100262A (en) Semiconductor device