JPS61256658A - 電気絶縁性基板材料の製造方法 - Google Patents

電気絶縁性基板材料の製造方法

Info

Publication number
JPS61256658A
JPS61256658A JP60097596A JP9759685A JPS61256658A JP S61256658 A JPS61256658 A JP S61256658A JP 60097596 A JP60097596 A JP 60097596A JP 9759685 A JP9759685 A JP 9759685A JP S61256658 A JPS61256658 A JP S61256658A
Authority
JP
Japan
Prior art keywords
substrate material
powder
insulating substrate
electrically insulating
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60097596A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482059B2 (enExample
Inventor
Akira Senda
晃 千田
Osamu Yamada
修 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP60097596A priority Critical patent/JPS61256658A/ja
Publication of JPS61256658A publication Critical patent/JPS61256658A/ja
Publication of JPH0482059B2 publication Critical patent/JPH0482059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Ceramic Products (AREA)
JP60097596A 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法 Granted JPS61256658A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60097596A JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60097596A JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Publications (2)

Publication Number Publication Date
JPS61256658A true JPS61256658A (ja) 1986-11-14
JPH0482059B2 JPH0482059B2 (enExample) 1992-12-25

Family

ID=14196615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60097596A Granted JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Country Status (1)

Country Link
JP (1) JPS61256658A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000327424A (ja) * 1999-05-12 2000-11-28 Sumitomo Osaka Cement Co Ltd 窒化アルミニウム基焼結体とその製造方法及びそれを用いたサセプター

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111978A (ja) * 1982-12-16 1984-06-28 株式会社東芝 電気絶縁性放熱基板材料
JPS605551A (ja) * 1983-06-23 1985-01-12 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
JPS6027653A (ja) * 1983-07-21 1985-02-12 株式会社日立製作所 セラミツク抵抗材料
JPS6036376A (ja) * 1983-08-08 1985-02-25 株式会社日立製作所 炭化ケイ素系抵抗材料及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111978A (ja) * 1982-12-16 1984-06-28 株式会社東芝 電気絶縁性放熱基板材料
JPS605551A (ja) * 1983-06-23 1985-01-12 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
JPS6027653A (ja) * 1983-07-21 1985-02-12 株式会社日立製作所 セラミツク抵抗材料
JPS6036376A (ja) * 1983-08-08 1985-02-25 株式会社日立製作所 炭化ケイ素系抵抗材料及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000327424A (ja) * 1999-05-12 2000-11-28 Sumitomo Osaka Cement Co Ltd 窒化アルミニウム基焼結体とその製造方法及びそれを用いたサセプター

Also Published As

Publication number Publication date
JPH0482059B2 (enExample) 1992-12-25

Similar Documents

Publication Publication Date Title
US5214005A (en) Glass-aluminum nitride composite material
JP2567491B2 (ja) 高熱伝導性着色窒化アルミニウム焼結体およびその製造方法
JPS63190761A (ja) 窒化アルミニウム質焼結体
JPS63210043A (ja) 高熱伝導性ガラス−セラミツク複合体
JPS61256658A (ja) 電気絶縁性基板材料の製造方法
JPS61291480A (ja) 窒化アルミニウム製基材の表面処理組成物
CN118026648A (zh) 一种高强度低损耗氧化铝陶瓷及其制备方法和应用
JPH1179872A (ja) メタライズ窒化ケイ素系セラミックス、その製造方法及びその製造に用いるメタライズ組成物
JPS5891059A (ja) 複合セラミツクス焼結体及びその製造方法
JPS6121965A (ja) アルミナ質焼結体とその製造方法
JPS63295479A (ja) 窒化アルミニウム焼結体およびその製造方法
JPS61261270A (ja) 窒化アルミニウム焼結体の製造方法
JPS6230663A (ja) 電子回路基板用材料
JPS63265858A (ja) 多層基板用低温焼結磁器組成物
JP3049941B2 (ja) 窒化アルミニウム焼結体の製造方法
JPS61286267A (ja) 窒化アルミニウム質焼結体の製造方法
JPS6236066A (ja) 炭化珪素質焼結体およびその製造方法
JPS6369761A (ja) 窒化アルミニウム質焼結体の製造方法
JPS62171964A (ja) 窒化アルミニウム系焼結体
JPS59111978A (ja) 電気絶縁性放熱基板材料
JPS62132762A (ja) 磁器組成物
JPH04280880A (ja) メタライザ及びセラミックスメタライズ基板
JPS5969474A (ja) 高熱伝導性セラミツクスの製造方法
JP3341782B2 (ja) セラミックス基板およびその製造方法
JPS61251575A (ja) 炭化珪素質焼結体とその製造方法