JPH0482059B2 - - Google Patents

Info

Publication number
JPH0482059B2
JPH0482059B2 JP60097596A JP9759685A JPH0482059B2 JP H0482059 B2 JPH0482059 B2 JP H0482059B2 JP 60097596 A JP60097596 A JP 60097596A JP 9759685 A JP9759685 A JP 9759685A JP H0482059 B2 JPH0482059 B2 JP H0482059B2
Authority
JP
Japan
Prior art keywords
powder
weight
silicon carbide
thermal conductivity
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60097596A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61256658A (ja
Inventor
Akira Senda
Osamu Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP60097596A priority Critical patent/JPS61256658A/ja
Publication of JPS61256658A publication Critical patent/JPS61256658A/ja
Publication of JPH0482059B2 publication Critical patent/JPH0482059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Ceramic Products (AREA)
JP60097596A 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法 Granted JPS61256658A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60097596A JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60097596A JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Publications (2)

Publication Number Publication Date
JPS61256658A JPS61256658A (ja) 1986-11-14
JPH0482059B2 true JPH0482059B2 (enExample) 1992-12-25

Family

ID=14196615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60097596A Granted JPS61256658A (ja) 1985-05-08 1985-05-08 電気絶縁性基板材料の製造方法

Country Status (1)

Country Link
JP (1) JPS61256658A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3756345B2 (ja) * 1999-05-12 2006-03-15 住友大阪セメント株式会社 窒化アルミニウム基焼結体とその製造方法及びそれを用いたサセプター

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111978A (ja) * 1982-12-16 1984-06-28 株式会社東芝 電気絶縁性放熱基板材料
JPS605551A (ja) * 1983-06-23 1985-01-12 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
JPS6027653A (ja) * 1983-07-21 1985-02-12 株式会社日立製作所 セラミツク抵抗材料
JPS6036376A (ja) * 1983-08-08 1985-02-25 株式会社日立製作所 炭化ケイ素系抵抗材料及びその製造方法

Also Published As

Publication number Publication date
JPS61256658A (ja) 1986-11-14

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