JPS61216349A - ガラス端子のメツキ方法 - Google Patents

ガラス端子のメツキ方法

Info

Publication number
JPS61216349A
JPS61216349A JP60057368A JP5736885A JPS61216349A JP S61216349 A JPS61216349 A JP S61216349A JP 60057368 A JP60057368 A JP 60057368A JP 5736885 A JP5736885 A JP 5736885A JP S61216349 A JPS61216349 A JP S61216349A
Authority
JP
Japan
Prior art keywords
plating
glass
leads
conductive wire
glass terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60057368A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0149022B2 (enExample
Inventor
Masato Mochizuki
望月　正登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP60057368A priority Critical patent/JPS61216349A/ja
Publication of JPS61216349A publication Critical patent/JPS61216349A/ja
Publication of JPH0149022B2 publication Critical patent/JPH0149022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60057368A 1985-03-20 1985-03-20 ガラス端子のメツキ方法 Granted JPS61216349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60057368A JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60057368A JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Publications (2)

Publication Number Publication Date
JPS61216349A true JPS61216349A (ja) 1986-09-26
JPH0149022B2 JPH0149022B2 (enExample) 1989-10-23

Family

ID=13053643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60057368A Granted JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Country Status (1)

Country Link
JP (1) JPS61216349A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295590A (ja) * 2009-08-31 2009-12-17 Nec Schott Components Corp 電子部品の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295590A (ja) * 2009-08-31 2009-12-17 Nec Schott Components Corp 電子部品の製造方法

Also Published As

Publication number Publication date
JPH0149022B2 (enExample) 1989-10-23

Similar Documents

Publication Publication Date Title
JP3572628B2 (ja) 半導体装置及びその製造方法
JPH02275660A (ja) 電気ピンおよびその製造方法
JP3116412B2 (ja) 半導体装置のバンプ電極形成方法、表示装置及び電子印字装置
JPS61216349A (ja) ガラス端子のメツキ方法
JP2000295821A (ja) 対導線配列及び対導線の端部接合方法及びそれを用いた回転電機の巻線製造方法
CN116798887A (zh) Igbt模块端子焊接方法
JP3173215B2 (ja) ハイブリッドｉｃのリードフレームの位置決め構造及びハイブリッドｉｃの製造方法
JP2022079208A (ja) 端子と電線の接合構造及び接合方法
JP3191684B2 (ja) 電気めっきリードを有する半導体素子の製造方法
JP2868943B2 (ja) 半導体素子電極とリードとの接続構造および実装方法
JPH02140906A (ja) リード線の接続構造
JPS614264A (ja) 自動ギヤングボンデイング用接続テ−プと半導体素子の組合せ
JPS61177704A (ja) チツプ型インダクタの製造方法
JPH01274459A (ja) 半導体装置用ステムの製造方法
JPH0883662A (ja) スーパーマイクロコネクタの製造方法
JPH04266036A (ja) プラスチックパッケージされてなる半導体装置
JPH019158Y2 (enExample)
JPS614263A (ja) 自動ギヤングボンデイング用接続テ−プ
JPH07207497A (ja) 電子部品のメッキ方法及びメッキ用治具
JPH11288815A (ja) 磁心、リードフレームおよびそれらを用いたチップインダクタ、並びに、その製造方法
JPH03503341A (ja) 半導体装置の製造方法および製造装置
JPH054213A (ja) セラミツクスパツケージのめつき方法
JPS63133514A (ja) 小型インダクタの製造方法
JPH03117522A (ja) 放電加工方法
JPH04240759A (ja) ピン構造体及びその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term