JPS6117146B2 - - Google Patents
Info
- Publication number
- JPS6117146B2 JPS6117146B2 JP55116596A JP11659680A JPS6117146B2 JP S6117146 B2 JPS6117146 B2 JP S6117146B2 JP 55116596 A JP55116596 A JP 55116596A JP 11659680 A JP11659680 A JP 11659680A JP S6117146 B2 JPS6117146 B2 JP S6117146B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- electrode metal
- base
- emitter
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/59—
-
- H10W72/983—
Landscapes
- Bipolar Transistors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55116596A JPS5740942A (en) | 1980-08-22 | 1980-08-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55116596A JPS5740942A (en) | 1980-08-22 | 1980-08-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5740942A JPS5740942A (en) | 1982-03-06 |
| JPS6117146B2 true JPS6117146B2 (enExample) | 1986-05-06 |
Family
ID=14691053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55116596A Granted JPS5740942A (en) | 1980-08-22 | 1980-08-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5740942A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001061804A1 (fr) * | 2000-02-16 | 2001-08-23 | Nichia Corporation | Dispositif de laser semiconducteur au nitrure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0646959B1 (en) * | 1993-09-30 | 2001-08-16 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Metallization and bonding process for manufacturing power semiconductor devices |
-
1980
- 1980-08-22 JP JP55116596A patent/JPS5740942A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001061804A1 (fr) * | 2000-02-16 | 2001-08-23 | Nichia Corporation | Dispositif de laser semiconducteur au nitrure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5740942A (en) | 1982-03-06 |
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