JPS6134258B2 - - Google Patents
Info
- Publication number
- JPS6134258B2 JPS6134258B2 JP55175993A JP17599380A JPS6134258B2 JP S6134258 B2 JPS6134258 B2 JP S6134258B2 JP 55175993 A JP55175993 A JP 55175993A JP 17599380 A JP17599380 A JP 17599380A JP S6134258 B2 JPS6134258 B2 JP S6134258B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- bonding pad
- sio
- base
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/59—
-
- H10W72/934—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175993A JPS5797636A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175993A JPS5797636A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5797636A JPS5797636A (en) | 1982-06-17 |
| JPS6134258B2 true JPS6134258B2 (enExample) | 1986-08-06 |
Family
ID=16005821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55175993A Granted JPS5797636A (en) | 1980-12-09 | 1980-12-09 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5797636A (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117666A (enExample) * | 1974-08-05 | 1976-02-12 | Hitachi Ltd |
-
1980
- 1980-12-09 JP JP55175993A patent/JPS5797636A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5797636A (en) | 1982-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001144121A (ja) | 半導体装置およびその製造方法 | |
| JPS594853B2 (ja) | 半導体装置 | |
| JPH03278554A (ja) | チップトレーの構造 | |
| JP3208319B2 (ja) | 半導体装置の製造方法 | |
| JPS6134258B2 (enExample) | ||
| JPH11121457A (ja) | 半導体装置の製造方法 | |
| JP2000196005A (ja) | 半導体装置 | |
| JPS6484724A (en) | Semiconductor device | |
| JP2756826B2 (ja) | 半導体装置及びその製造方法 | |
| JPS63120431A (ja) | 電力用半導体装置 | |
| JPH08204066A (ja) | 半導体装置 | |
| JPS6117146B2 (enExample) | ||
| JPH05259274A (ja) | 半導体装置及びその製造方法 | |
| JPH08181164A (ja) | 半導体装置 | |
| JPH02144946A (ja) | 半導体装置 | |
| JPS60130163A (ja) | 半導体集積回路 | |
| KR100264518B1 (ko) | 압력센서의 제조방법 | |
| KR970006741B1 (ko) | 적외선 박막 센서의 제조방법 | |
| JPS60178636A (ja) | 半導体装置 | |
| JPS62174941A (ja) | 半導体集積回路 | |
| JPH04323821A (ja) | 半導体装置及びその電極用導電体の形成方法 | |
| JP3302811B2 (ja) | マイクロ波半導体装置 | |
| JPH05211374A (ja) | 光半導体装置の製造方法 | |
| JPS6159747A (ja) | 半導体装置の製造方法 | |
| JPS6118350B2 (enExample) |