JPS5117666A - - Google Patents
Info
- Publication number
- JPS5117666A JPS5117666A JP49089043A JP8904374A JPS5117666A JP S5117666 A JPS5117666 A JP S5117666A JP 49089043 A JP49089043 A JP 49089043A JP 8904374 A JP8904374 A JP 8904374A JP S5117666 A JPS5117666 A JP S5117666A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/536—
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- H10W72/59—
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- H10W72/934—
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- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49089043A JPS5117666A (enExample) | 1974-08-05 | 1974-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49089043A JPS5117666A (enExample) | 1974-08-05 | 1974-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5117666A true JPS5117666A (enExample) | 1976-02-12 |
Family
ID=13959852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49089043A Pending JPS5117666A (enExample) | 1974-08-05 | 1974-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5117666A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5797636A (en) * | 1980-12-09 | 1982-06-17 | Mitsubishi Electric Corp | Semiconductor device |
| JPS57195834U (enExample) * | 1981-06-09 | 1982-12-11 | ||
| US6414415B1 (en) | 1999-02-18 | 2002-07-02 | Murata Manufacturing Co., Ltd. | Surface acoustic wave device and method for manufacturing the same |
| EP2339622A1 (en) * | 2009-12-23 | 2011-06-29 | Nxp B.V. | Wirebonding Process |
-
1974
- 1974-08-05 JP JP49089043A patent/JPS5117666A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5797636A (en) * | 1980-12-09 | 1982-06-17 | Mitsubishi Electric Corp | Semiconductor device |
| JPS57195834U (enExample) * | 1981-06-09 | 1982-12-11 | ||
| US6414415B1 (en) | 1999-02-18 | 2002-07-02 | Murata Manufacturing Co., Ltd. | Surface acoustic wave device and method for manufacturing the same |
| EP2339622A1 (en) * | 2009-12-23 | 2011-06-29 | Nxp B.V. | Wirebonding Process |