JPS5740942A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5740942A
JPS5740942A JP55116596A JP11659680A JPS5740942A JP S5740942 A JPS5740942 A JP S5740942A JP 55116596 A JP55116596 A JP 55116596A JP 11659680 A JP11659680 A JP 11659680A JP S5740942 A JPS5740942 A JP S5740942A
Authority
JP
Japan
Prior art keywords
bonding pad
concave section
section
semiconductor device
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55116596A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117146B2 (enExample
Inventor
Yuji Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55116596A priority Critical patent/JPS5740942A/ja
Publication of JPS5740942A publication Critical patent/JPS5740942A/ja
Publication of JPS6117146B2 publication Critical patent/JPS6117146B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP55116596A 1980-08-22 1980-08-22 Semiconductor device Granted JPS5740942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55116596A JPS5740942A (en) 1980-08-22 1980-08-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55116596A JPS5740942A (en) 1980-08-22 1980-08-22 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5740942A true JPS5740942A (en) 1982-03-06
JPS6117146B2 JPS6117146B2 (enExample) 1986-05-06

Family

ID=14691053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55116596A Granted JPS5740942A (en) 1980-08-22 1980-08-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5740942A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773899A (en) * 1993-09-30 1998-06-30 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Bonding pad for a semiconductor chip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL202938B1 (pl) * 2000-02-16 2009-08-31 Nichia Corp Azotkowe półprzewodnikowe urządzenie laserowe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773899A (en) * 1993-09-30 1998-06-30 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Bonding pad for a semiconductor chip
US5869357A (en) * 1993-09-30 1999-02-09 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Metallization and wire bonding process for manufacturing power semiconductor devices

Also Published As

Publication number Publication date
JPS6117146B2 (enExample) 1986-05-06

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