JPS53147463A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS53147463A JPS53147463A JP6233577A JP6233577A JPS53147463A JP S53147463 A JPS53147463 A JP S53147463A JP 6233577 A JP6233577 A JP 6233577A JP 6233577 A JP6233577 A JP 6233577A JP S53147463 A JPS53147463 A JP S53147463A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- gold electrodes
- impairing
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Abstract
PURPOSE: To satisfactorily bond metal layers and connecting wires without impairing the adhesion of gold electrodes and glass films by providing an intervening metal layer only around the gold electrodes.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6233577A JPS53147463A (en) | 1977-05-27 | 1977-05-27 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6233577A JPS53147463A (en) | 1977-05-27 | 1977-05-27 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53147463A true JPS53147463A (en) | 1978-12-22 |
Family
ID=13197148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6233577A Pending JPS53147463A (en) | 1977-05-27 | 1977-05-27 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53147463A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0342935U (en) * | 1989-09-01 | 1991-04-23 |
-
1977
- 1977-05-27 JP JP6233577A patent/JPS53147463A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0342935U (en) * | 1989-09-01 | 1991-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52143785A (en) | Semiconductor device | |
JPS53147463A (en) | Production of semiconductor device | |
JPS5212575A (en) | Production method of semi-conductor device | |
JPS5348671A (en) | Electrode structure of semiconductor element | |
JPS5441673A (en) | Semiconductor device and its manufacture | |
JPS5250167A (en) | Semiconductor device | |
JPS5411690A (en) | Semiconductor laser unit | |
JPS522282A (en) | Semiconductor device | |
JPS5356969A (en) | Production of tape for tape carrier | |
JPS53140967A (en) | Production of electrodes of semiconductor device | |
JPS5435791A (en) | Semiconductor pressure sensor | |
JPS52142485A (en) | Wire bonding device | |
JPS5324268A (en) | Pro duction of semiconductor device and bonding wire for the same | |
JPS51132764A (en) | Semiconductor device | |
JPS5413775A (en) | Lead frame for semiconductor devices | |
JPS53117970A (en) | Resin seal type semiconductor device | |
JPS5295175A (en) | Pellet bonding | |
JPS5314558A (en) | Semiconductor device | |
JPS5397367A (en) | Semiconductor device and its manufacture | |
JPS5283166A (en) | Semiconductor device and its production | |
JPS5360172A (en) | Production of semiconductor device | |
JPS5422167A (en) | Manufactuare of circuit block | |
JPS5279657A (en) | Wire bonding device | |
JPS5313875A (en) | Semiconductor device | |
JPS5396670A (en) | Pellet bonding method |