JPS61164072U - - Google Patents
Info
- Publication number
- JPS61164072U JPS61164072U JP4169586U JP4169586U JPS61164072U JP S61164072 U JPS61164072 U JP S61164072U JP 4169586 U JP4169586 U JP 4169586U JP 4169586 U JP4169586 U JP 4169586U JP S61164072 U JPS61164072 U JP S61164072U
- Authority
- JP
- Japan
- Prior art keywords
- board
- areas
- resist
- bumps
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第３図は従来の電子部品の取付け構
造を説明するための要部構成断面図、第４図乃至
第６図は本考案による電子部品の取付け構造を説
明するための要部構成断面図である。
図中、１：電子部品、１ａ，１ａ′：チツプバ
ンプ、３：基板、１０：レジスト材料、１１ａ，
１１ａ′：ペースト状はんだ材料。
1 to 3 are cross-sectional views of main parts for explaining the conventional mounting structure for electronic components, and FIGS. 4 to 6 are main parts for explaining the mounting structure for electronic parts according to the present invention. FIG. In the figure, 1: electronic component, 1a, 1a': chip bump, 3: substrate, 10: resist material, 11a,
11a': Paste solder material.
Claims (1)
品上に突出したバンプと前記基板上の接続端子と
を結合するものにおいて、 前記基板上の前記バンプ部分に対応する領域と
その近傍領域以外を被覆するレジストと、 前記基板上のレジストが被覆されていない領域
に印刷又は塗布され、溶融によつて前記バンプと
前記接続端子とを結合させるペースト状はんだ材
料とから成ること特徴とする電子部分の取付け構
造。[Claims for Utility Model Registration] An electronic component and a board are opposed to each other, and a bump protruding on the electronic component and a connecting terminal on the board are connected, which corresponds to the bump portion on the board. a resist that covers areas other than the areas where the bumps and the connecting terminals are covered; and a paste-like solder material that is printed or applied on areas of the substrate where the resist is not covered and that joins the bumps and the connection terminals by melting. The mounting structure of the electronic parts is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169586U JPS61164072U (en) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169586U JPS61164072U (en) | 1986-03-19 | 1986-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61164072U true JPS61164072U (en) | 1986-10-11 |
Family
ID=30551763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4169586U Pending JPS61164072U (en) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61164072U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933564A (en) * | 1972-07-26 | 1974-03-28 | ||
| JPS5416669A (en) * | 1977-07-07 | 1979-02-07 | Mitsubishi Electric Corp | Method of manufacturing hybrid integrated circuit device |
-
1986
- 1986-03-19 JP JP4169586U patent/JPS61164072U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933564A (en) * | 1972-07-26 | 1974-03-28 | ||
| JPS5416669A (en) * | 1977-07-07 | 1979-02-07 | Mitsubishi Electric Corp | Method of manufacturing hybrid integrated circuit device |
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