JPS6389280U - - Google Patents
Info
- Publication number
- JPS6389280U JPS6389280U JP1986185142U JP18514286U JPS6389280U JP S6389280 U JPS6389280 U JP S6389280U JP 1986185142 U JP1986185142 U JP 1986185142U JP 18514286 U JP18514286 U JP 18514286U JP S6389280 U JPS6389280 U JP S6389280U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flip chip
- board
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図、第２図はそれぞれ本考案実施例、およ
び従来における混成集積回路の組立構造図である
。
各図において、１：フリツプチツプ、１１：半
田バンプ、２：セラミツク製のプリント基板、３
：窒化アルミセラミツク製の接続基板、４：半田
接合部。
FIGS. 1 and 2 are diagrams showing the assembly structure of an embodiment of the present invention and a conventional hybrid integrated circuit, respectively. In each figure, 1: flip chip, 11: solder bump, 2: ceramic printed circuit board, 3
: Connection board made of aluminum nitride ceramic, 4: Solder joint.
Claims (1)
プチツプを実装して成る混成集積回路において、
フリツプチツプとプリント基板との間にフリツプ
チツプの外形に対応した寸法で、かつ熱膨張係数
がフリツプチツプとプリント基板との中間の値を
示す材料で作られた接続基板を介装し、該接続基
板とフリツプチツプとの間、および接続基板とプ
リント基板との間をそれぞれ半田付けして組立構
成したことを特徴とする混成集積回路の組立構造
。 (2) 実用新案登録請求の範囲第１項記載の組立
構造において、フリツプチツプがシリコン半導体
素子、プリント基板がセラミツク基板、接続基板
が窒化アルミセラミツク基板であることを特徴と
する混成集積回路の組立構造。[Claims for Utility Model Registration] (1) In a hybrid integrated circuit consisting of a flip chip with solder bumps mounted on a printed circuit board,
A connecting board made of a material having dimensions corresponding to the external shape of the flip chip and having a coefficient of thermal expansion between those of the flip chip and the printed circuit board is interposed between the flip chip and the printed circuit board, and the connecting board and the printed circuit board are connected to each other. 1. An assembly structure of a hybrid integrated circuit, characterized in that the assembly is constructed by soldering between the connecting board and the printed circuit board, and between the connecting board and the printed circuit board. (2) An assembled structure of a hybrid integrated circuit according to claim 1, wherein the flip chip is a silicon semiconductor element, the printed circuit board is a ceramic substrate, and the connection substrate is an aluminum nitride ceramic substrate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185142U JPS6389280U (en) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185142U JPS6389280U (en) | 1986-12-01 | 1986-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389280U true JPS6389280U (en) | 1988-06-10 |
Family
ID=31133488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986185142U Pending JPS6389280U (en) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389280U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994005134A1 (en) * | 1992-08-26 | 1994-03-03 | Tdk Corporation | Electronic component |
| JPH07183333A (en) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Electronic package and manufacture thereof |
| JPH0883818A (en) * | 1994-09-12 | 1996-03-26 | Nec Corp | Electronic parts assembly body |
-
1986
- 1986-12-01 JP JP1986185142U patent/JPS6389280U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994005134A1 (en) * | 1992-08-26 | 1994-03-03 | Tdk Corporation | Electronic component |
| JPH07183333A (en) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Electronic package and manufacture thereof |
| JPH0883818A (en) * | 1994-09-12 | 1996-03-26 | Nec Corp | Electronic parts assembly body |