JPH0321859U - - Google Patents
Info
- Publication number
- JPH0321859U JPH0321859U JP1989082588U JP8258889U JPH0321859U JP H0321859 U JPH0321859 U JP H0321859U JP 1989082588 U JP1989082588 U JP 1989082588U JP 8258889 U JP8258889 U JP 8258889U JP H0321859 U JPH0321859 U JP H0321859U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- semiconductor
- mounting means
- semiconductor substrate
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図ないし第７図は本考案の第１実施例に係
り、第１図は第１実施例の固体撮像装置の構造を
示す断面図、第２図は半導体チツプの製造プロセ
スを示す説明図、第３図は半導体チツプの平面図
、第４図は半導体チツプの底面図、第５図は実装
基板の断面図、第６図は実装基板の平面図、第７
図は実装基板の底面図、第８図は本考案の第２実
施例の構造を示す断面図、第９図は本考案の第３
実施例の構造を示す断面図である。
１……固体撮像装置、２……光電変換回路、３
……回路パターン、４……半導体チツプ、５……
バンプ、６，１２……印刷回路、７……実装基板
、１０，１１……スルーホール、１３……外部リ
ード。
1 to 7 relate to a first embodiment of the present invention, FIG. 1 is a sectional view showing the structure of a solid-state imaging device of the first embodiment, and FIG. 2 is an explanatory diagram showing the manufacturing process of a semiconductor chip. , FIG. 3 is a plan view of the semiconductor chip, FIG. 4 is a bottom view of the semiconductor chip, FIG. 5 is a sectional view of the mounting board, FIG. 6 is a plan view of the mounting board, and FIG.
The figure is a bottom view of the mounting board, FIG. 8 is a sectional view showing the structure of the second embodiment of the present invention, and FIG. 9 is the third embodiment of the present invention.
FIG. 3 is a cross-sectional view showing the structure of an example. 1... Solid-state imaging device, 2... Photoelectric conversion circuit, 3
...Circuit pattern, 4...Semiconductor chip, 5...
Bump, 6, 12... Printed circuit, 7... Mounting board, 10, 11... Through hole, 13... External lead.
Claims (1)
た実装用手段を厚み方向に接続する接続手段を有
する半導体基板と、 表面に半導体実装面、裏面又は側面側に入出力
端子を備えた実装手段と、 からなり、前記実装手段の前記半導体実装面に
、前記半導体基板の前記実装用手段をフエイスボ
ンデイングして実装したことを特徴とする固体撮
像装置。[Scope of Claim for Utility Model Registration] A semiconductor substrate having a connection means for connecting a photoelectric conversion circuit means provided on the front surface and a mounting means provided on the back surface in the thickness direction, and a semiconductor substrate having a semiconductor mounting surface on the front surface, a semiconductor mounting surface on the back surface, or a mounting means on the back surface or side surface. 1. A solid-state imaging device comprising: a mounting means having an output terminal; and the mounting means of the semiconductor substrate is mounted on the semiconductor mounting surface of the mounting means by face bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082588U JPH085566Y2 (en) | 1989-07-12 | 1989-07-12 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082588U JPH085566Y2 (en) | 1989-07-12 | 1989-07-12 | Solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0321859U true JPH0321859U (en) | 1991-03-05 |
| JPH085566Y2 JPH085566Y2 (en) | 1996-02-14 |
Family
ID=31629541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989082588U Expired - Lifetime JPH085566Y2 (en) | 1989-07-12 | 1989-07-12 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085566Y2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004059740A1 (en) * | 2002-12-25 | 2004-07-15 | Olympus Corporation | Solid-state imager and method for manufacturing same |
| JP2004205517A (en) * | 2002-12-23 | 2004-07-22 | Ge Medical Systems Global Technology Co Llc | Method and system for detector assembly for x-ray image |
| JP2004319530A (en) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | Optical semiconductor device and its manufacturing process |
| JP2005501414A (en) * | 2001-08-24 | 2005-01-13 | カール−ツアイス−シュティフツンク | Method and printed circuit package for forming contacts |
| JP2005520346A (en) * | 2002-03-03 | 2005-07-07 | インテロン・エイエス | Pixel sensor array and manufacturing method thereof |
| JP2005322851A (en) * | 2004-05-11 | 2005-11-17 | Fuji Photo Film Co Ltd | Solid-state imaging apparatus |
| JP2009194396A (en) * | 2003-08-28 | 2009-08-27 | Fujikura Ltd | Semiconductor package and method of manufacturing the same |
| WO2010131462A1 (en) * | 2009-05-13 | 2010-11-18 | パナソニック株式会社 | Solid-state image pickup element |
| JP2014108282A (en) * | 2012-12-03 | 2014-06-12 | Olympus Corp | Imaging device, endoscope, and method for manufacturing imaging device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4000507B2 (en) * | 2001-10-04 | 2007-10-31 | ソニー株式会社 | Method for manufacturing solid-state imaging device |
| JP4542768B2 (en) | 2003-11-25 | 2010-09-15 | 富士フイルム株式会社 | Solid-state imaging device and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291129A (en) * | 1986-06-11 | 1987-12-17 | Nec Corp | Semiconductor device |
| JPS6331858A (en) * | 1986-07-24 | 1988-02-10 | Mazda Motor Corp | Slip controller for automobile |
-
1989
- 1989-07-12 JP JP1989082588U patent/JPH085566Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291129A (en) * | 1986-06-11 | 1987-12-17 | Nec Corp | Semiconductor device |
| JPS6331858A (en) * | 1986-07-24 | 1988-02-10 | Mazda Motor Corp | Slip controller for automobile |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005501414A (en) * | 2001-08-24 | 2005-01-13 | カール−ツアイス−シュティフツンク | Method and printed circuit package for forming contacts |
| JP2005520346A (en) * | 2002-03-03 | 2005-07-07 | インテロン・エイエス | Pixel sensor array and manufacturing method thereof |
| JP2004205517A (en) * | 2002-12-23 | 2004-07-22 | Ge Medical Systems Global Technology Co Llc | Method and system for detector assembly for x-ray image |
| JP4651937B2 (en) * | 2002-12-23 | 2011-03-16 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | X-ray image detector assembly and imaging system |
| WO2004059740A1 (en) * | 2002-12-25 | 2004-07-15 | Olympus Corporation | Solid-state imager and method for manufacturing same |
| JP2004319530A (en) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | Optical semiconductor device and its manufacturing process |
| JP2009194396A (en) * | 2003-08-28 | 2009-08-27 | Fujikura Ltd | Semiconductor package and method of manufacturing the same |
| JP2005322851A (en) * | 2004-05-11 | 2005-11-17 | Fuji Photo Film Co Ltd | Solid-state imaging apparatus |
| WO2010131462A1 (en) * | 2009-05-13 | 2010-11-18 | パナソニック株式会社 | Solid-state image pickup element |
| JP2014108282A (en) * | 2012-12-03 | 2014-06-12 | Olympus Corp | Imaging device, endoscope, and method for manufacturing imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085566Y2 (en) | 1996-02-14 |