JPS61160946A - 半導体装置の接続構造体 - Google Patents

半導体装置の接続構造体

Info

Publication number
JPS61160946A
JPS61160946A JP60177787A JP17778785A JPS61160946A JP S61160946 A JPS61160946 A JP S61160946A JP 60177787 A JP60177787 A JP 60177787A JP 17778785 A JP17778785 A JP 17778785A JP S61160946 A JPS61160946 A JP S61160946A
Authority
JP
Japan
Prior art keywords
chip
thin film
apertures
pattern
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60177787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0239097B2 (enExample
Inventor
ロバート・マークス
ダグラス・ウオーレス・フエルプス、ジユニア
ウイリアム・キヤロル・ワード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS61160946A publication Critical patent/JPS61160946A/ja
Publication of JPH0239097B2 publication Critical patent/JPH0239097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/479—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60177787A 1984-12-31 1985-08-14 半導体装置の接続構造体 Granted JPS61160946A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68769684A 1984-12-31 1984-12-31
US687696 1984-12-31

Publications (2)

Publication Number Publication Date
JPS61160946A true JPS61160946A (ja) 1986-07-21
JPH0239097B2 JPH0239097B2 (enExample) 1990-09-04

Family

ID=24761445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60177787A Granted JPS61160946A (ja) 1984-12-31 1985-08-14 半導体装置の接続構造体

Country Status (3)

Country Link
EP (1) EP0186818B1 (enExample)
JP (1) JPS61160946A (enExample)
DE (1) DE3582038D1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2210200B (en) * 1987-12-10 1990-06-06 Westinghouse Brake & Signal Semiconductor contact arrangement
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US5742100A (en) * 1995-03-27 1998-04-21 Motorola, Inc. Structure having flip-chip connected substrates
JP3578581B2 (ja) * 1997-02-28 2004-10-20 富士通株式会社 ベアチップの実装構造および実装方法およびそれに用いるインターポーザ
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
DE10240461A1 (de) * 2002-08-29 2004-03-11 Infineon Technologies Ag Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung
KR101701380B1 (ko) 2010-08-17 2017-02-01 해성디에스 주식회사 소자 내장형 연성회로기판 및 이의 제조방법
CN103681557B (zh) * 2012-09-11 2017-12-22 恩智浦美国有限公司 半导体器件及其组装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136357U (enExample) * 1974-04-25 1975-11-10

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045863A (en) * 1971-06-03 1977-09-06 Siemens Aktiengesellschaft Method of producing metallic carrier system for a multi-electrode semiconductor strip
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136357U (enExample) * 1974-04-25 1975-11-10

Also Published As

Publication number Publication date
JPH0239097B2 (enExample) 1990-09-04
EP0186818A2 (en) 1986-07-09
EP0186818B1 (en) 1991-03-06
EP0186818A3 (en) 1987-03-18
DE3582038D1 (de) 1991-04-11

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