JPS50136357U - - Google Patents

Info

Publication number
JPS50136357U
JPS50136357U JP1974047724U JP4772474U JPS50136357U JP S50136357 U JPS50136357 U JP S50136357U JP 1974047724 U JP1974047724 U JP 1974047724U JP 4772474 U JP4772474 U JP 4772474U JP S50136357 U JPS50136357 U JP S50136357U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1974047724U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974047724U priority Critical patent/JPS50136357U/ja
Publication of JPS50136357U publication Critical patent/JPS50136357U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/072
    • H10W72/241

Landscapes

  • Wire Bonding (AREA)
JP1974047724U 1974-04-25 1974-04-25 Pending JPS50136357U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974047724U JPS50136357U (enExample) 1974-04-25 1974-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974047724U JPS50136357U (enExample) 1974-04-25 1974-04-25

Publications (1)

Publication Number Publication Date
JPS50136357U true JPS50136357U (enExample) 1975-11-10

Family

ID=28186437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974047724U Pending JPS50136357U (enExample) 1974-04-25 1974-04-25

Country Status (1)

Country Link
JP (1) JPS50136357U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160946A (ja) * 1984-12-31 1986-07-21 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 半導体装置の接続構造体
WO2001026147A1 (en) * 1999-10-04 2001-04-12 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
WO2001026155A1 (fr) * 1999-10-01 2001-04-12 Seiko Epson Corporation Dispositif a semi-conducteur, procede et dispositif permettant d'obtenir ce dernier, carte de circuit imprime et equipement electronique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509341A (enExample) * 1973-05-23 1975-01-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509341A (enExample) * 1973-05-23 1975-01-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61160946A (ja) * 1984-12-31 1986-07-21 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 半導体装置の接続構造体
WO2001026155A1 (fr) * 1999-10-01 2001-04-12 Seiko Epson Corporation Dispositif a semi-conducteur, procede et dispositif permettant d'obtenir ce dernier, carte de circuit imprime et equipement electronique
WO2001026147A1 (en) * 1999-10-04 2001-04-12 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US6744122B1 (en) 1999-10-04 2004-06-01 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device

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