CN103681557B - 半导体器件及其组装方法 - Google Patents

半导体器件及其组装方法 Download PDF

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Publication number
CN103681557B
CN103681557B CN201210334279.8A CN201210334279A CN103681557B CN 103681557 B CN103681557 B CN 103681557B CN 201210334279 A CN201210334279 A CN 201210334279A CN 103681557 B CN103681557 B CN 103681557B
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China
Prior art keywords
tube core
semiconductor devices
die support
support part
substrate
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CN201210334279.8A
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CN103681557A (zh
Inventor
黄美权
王欢
王津生
周乃阔
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NXP USA Inc
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NXP USA Inc
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Priority to CN201210334279.8A priority Critical patent/CN103681557B/zh
Priority to US13/854,137 priority patent/US8878348B2/en
Publication of CN103681557A publication Critical patent/CN103681557A/zh
Priority to US14/499,240 priority patent/US9129948B2/en
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Publication of CN103681557B publication Critical patent/CN103681557B/zh
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Abstract

本发明涉及一种半导体器件及其组装方法，半导体器件具有由单片导电材料整体形成的管芯支撑件和外部引线。管芯安装衬底安装在管芯支撑件上，其中键合焊盘耦合到衬底的外部连接器侧上相应的外部连接焊盘。管芯通过管芯连接焊盘附连到管芯安装衬底。键合线将管芯连接焊盘选择性地电耦合到外部引线和键合焊盘，并且导电外部凸起安装到外部连接焊盘。包封剂覆盖管芯和键合线。外部凸起位于封装体的表面安装侧的中心区域，并且外部引线从靠近管芯支撑件的位置朝向封装体的外围边缘向外凸出。

Description

半导体器件及其组装方法
技术领域
本发明涉及半导体封装，特别涉及封装的半导体器件，其具有呈现为球栅阵列或其他类似的外部连接器阵列的导电外部凸起。
背景技术
存在多种类型的半导体封装体。此类封装体通常用安装在非导电衬底或引线框架上的半导体管芯形成。衬底或引线框架的引线上的外部连接器被金属丝键合到管芯上的管芯连接焊盘以提供容易地电连接管芯到电路板等上的装置。在连接器和焊盘被金属丝键合后，半导体管芯和连接器被包封(封装)在复合物例如塑料材料中，留下衬底的外部焊盘或多段引线暴露在外。外部连接器或暴露的引线向电路板提供管芯的外部电连接。
用增加数量的外部连接器(即增加的引脚或引线计数)组装(加工)半导体器件(封装的半导体管芯)。由于已经通过使用金属丝键合引线连接技术和球栅阵列(BGA)连接增加了信号线和电源线的数量，电子产业已经尝试增加管芯触点的密度。然而，金属丝键合引线连接是通常布置在封装器件的所有侧边上的外围焊盘。这些引线是相对大的并因此增加封装器件的最小可获得尺寸。
相反，BGA器件具有安装或附连到载体衬底的半导体管芯。焊料球附着到载体衬底的下表面，并且封装器件的最小可获得尺寸可以小于金属丝键合引线连接类型的器件的尺寸。虽然BGA器件提供对金属丝键合引线连接类型的器件的有益替换，但是当将BGA器件安装到印刷电路板(PCB)时焊料回流期间载体衬底易于受到扭曲的影响。这种扭曲通常表现为载体衬底的外部PCB面对表面从平坦表面变形为微凸表面，其可能导致较差的焊接连接或开路电路。因此可能有益的是降低或至少缓解BGA或其他栅格阵列、载体衬底扭曲的可能性。
发明内容
在本发明的一个实施例中，提供一种半导体器件，其包括由单片导电材料整体形成的管芯支撑件和外部引线。存在安装在管芯支撑件上的管芯安装衬底，其具有管芯安装侧和相反的外部连接器侧，其中管芯安装侧具有耦合到衬底的外部连接器侧上相应的外部连接焊盘的键合焊盘。该器件具有半导体管芯，该半导体管芯具有附连到管芯安装衬底的管芯安装侧的管芯支撑安装表面以及与管芯连接焊盘相关联的相反的管芯连接焊盘表面，其中管芯连接焊盘是半导体管芯的电路节点。存在将管芯连接焊盘选择性地电耦合到外部引线和键合焊盘的键合线，并且导电外部凸起安装到外部连接焊盘上。包封材料被用于至少部分包封管芯和键合线，其中外部凸起位于封装体的表面安装侧的中心区域。外部引线在表面安装侧上从接近管芯支撑件的位置朝向封装体的外围边缘向外凸出。
在本发明的另一个实施例中，提供一种用于封装或组装半导体器件的方法。该方法包括提供由单片导电材料整体形成的管芯支撑件和外部引线。该方法还包括将管芯安装衬底安装到管芯支撑件上，该管芯安装衬底具有管芯安装侧和安装在管芯支撑件上的相反的外部连接器侧，其中管芯安装侧具有耦合到衬底的外部连接器侧上相应的外部连接焊盘的键合焊盘。还执行将半导体管芯安装到管芯安装衬底，该半导体管芯具有附连到管芯安装衬底的管芯安装侧的管芯支撑安装表面以及与管芯连接焊盘相关联的相反的管芯连接焊盘表面，其中管芯连接焊盘是半导体管芯的电路节点。该方法还包括将管芯连接焊盘选择性地电耦合到外部引线和键合焊盘，并且将导电外部凸起安装到外部连接焊盘上。用包封材料包封管芯的至少一部分以形成半导体器件，其中外部凸起位于封装体或器件的表面安装侧的中心区域。外部引线在表面安装侧上从接近管芯支撑件的位置朝向器件的外围边缘向外凸出。
附图说明
可以通过参考优选实施例的以下描述以及附图来最佳地理解本发明及其目标和优点，其中：
图1是根据本发明实施例的导电引线框架片的平面顶视图；
图2是根据本发明实施例的图1的导电引线框架片沿1-1’的截面侧视图；
图3是根据本发明实施例在图1的导电引线框架片上形成的部分组装的器件的平面顶视图；
图4是根据本发明实施例的图3的部分组装的器件沿3-3’的截面侧视图；
图5是根据本发明实施例的图3的金属丝键合的部分组装的器件的平面顶视图；
图6是根据本发明实施例的图5的金属丝键合的部分组装的器件沿5-5’的截面侧视图；
图7是根据本发明实施例的图5的金属丝键合的部分组装的器件的底侧平面图；
图8是根据本发明实施例在包封后图5的金属丝键合的部分组装的器件沿5-5’的截面侧视图；
图9是根据本发明实施例的两个相邻切单后(singulated)半导体器件的截面侧视图；
图10是根据本发明实施例的图9的切单后半导体器件之一的底侧平面图；
图11是根据本发明实施例安装在电路板上的图10的半导体器件之一的截面侧视图；
图12是根据本发明实施例的半导体器件的截面侧视图；
图13是根据本发明实施例的导电引线框架片的平面顶视图；以及
图14是根据本发明实施例用于组装半导体器件的方法的流程图。
具体实施方式
结合附图在下面阐述的详细说明书旨在作为本发明的当前优选实施例的一种描述，而不希望表示可以实施本发明的唯一形式。应该理解相同或等价的功能可以由确定为包含在本发明的精神和范围内的不同实施例来实现。在附图中，始终使用类似的数字来指示类似的元件。此外，术语“包括”、“包含”或其任何其他变体旨在覆盖非排他性的内含物，从而包括一系列元件或步骤的系统、电路、器件组件和方法步骤并不是仅包括这些元素，而是可以包括没有特别列出的或此类系统、电路、器件组件或步骤固有的其他元件或步骤。在没有更多限制的情况下，由“包括...”引领的元件或步骤并不排除存在包括该元件或步骤的额外相同的元件或步骤。
现在参考图1，其示出根据本发明的优选实施例的导电引线框架片100的平面顶视图。引线框架片100具有多个引线框架101，每个引线框架包括管芯支撑件102以及从管芯支撑件102延伸到另一管芯支撑件102或片边界区域104的多个外部引线103。导电引线框架片100以及因此每个管芯支撑件102和外部引线103是由单片导电材料例如铜、铝或类似金属或其合金整体形成的。就本领域所知，片100可以镀覆其他金属或金属合金。在一个实施例中，该片包括镀覆了可焊接金属的铜，该可焊接金属本身镀覆了贵金属例如金或钯。在该实施例中，管芯支撑件102包括形成包围中心引线框架空间107的矩形框架的两组间隔开的平行构件105、106。
图2示出根据本发明的优选实施例的导电引线框架片100沿1-1’的截面侧视图。如图所示，管芯支撑件102和外部引线103位于同一平面内。
参考图3，其示出根据本发明的优选实施例在导电引线框架片100上形成的部分组装的器件300的平面顶视图。每个部分组装的器件300包括具有键合焊盘303的管芯安装侧302的非导电的管芯安装衬底301。
每个器件300也具有半导体管芯304，该半导体管芯具有附连到沉积有环氧树脂或其他形式的粘合剂例如胶带的管芯安装衬底301的管芯支撑安装表面308。半导体管芯304还具有与管芯连接焊盘306相关联且与管芯支撑安装表面308相反的管芯连接焊盘表面305。连接焊盘306是半导体管芯304的电路节点，并且每个焊盘306通常可以是：电源输入节点；数据输入或输出节点；或者信号路径输入或输出节点，这对于本领域技术人员来说是显然的。
参考图4，其示出根据本发明的优选实施例的部分组装的器件300沿3-3’的截面侧视图。如图所示，管芯安装衬底301包括管芯安装侧302和安装到管芯支撑件102上且沉积有环氧树脂或其他形式的粘合剂的相反的外部连接器侧402。管芯安装侧302包括耦合到衬底301的外部连接器侧402上相应的外部连接焊盘403的键合焊盘303。在这方面，键合焊盘303通过传导通孔或在该实施例中通过传导流道(runner)404耦合到它们相应的外部连接焊盘403。
参考图5，其示出根据本发明的优选实施例的金属丝键合的部分组装的半导体器件500(包括部分组装的器件300)的平面顶视图。金属丝键合的部分组装半导体器件500具有呈现为外部引线键合线501和外部连接焊盘键合线502的键合线。外部引线键合线501被用于将管芯连接焊盘306选择性地电耦合到外部引线103，而外部连接焊盘键合线502被用于经由键合焊盘303将管芯连接焊盘306选择性地电耦合到外部连接焊盘403。对本领域技术人员来说显然的是，为了图表的简单和清楚，并未示出所有的键合线501、502。键合线501、502可以利用可购买的金属丝键合设备来附连。
图6是根据本发明的优选实施例的金属丝键合的部分组装的半导体器件500沿5-5’的截面侧视图。每个金属丝键合的部分组装的半导体器件500具有安装到外部连接焊盘403的导电外部凸起601。在该实施例中，外部凸起601位于每个封装体500的中心区域602，间隔开的平行构件105和106包围中心区域602(中心引线框架空间107)。更具体地，管芯安装衬底301横跨间隔开的平行构件105、106，并且外部凸起601位于封装体500的表面安装侧603的中心区域602。外部凸起601通常是焊料球例如布置为形成球栅阵列(BGA)604的C4焊料球。然而，外部凸起601可以采用其他形式，例如引脚栅格阵列(PGA)的引脚。
参考图7，其示出根据本发明的优选实施例的金属丝键合的部分组装的器件500的底侧平面图。如图所示，凸起601是均匀分布的并且位于表面安装侧603的中心区域602，并形成焊料球的中心定位的BGA604。图中还示出封装分离(切单)平面702和管芯支撑件至引线的分离平面703，这在下面更详细地描述。
参考图8，其示出根据本发明的优选实施例在包封后金属丝键合的部分组装的器件500沿5-5’的截面侧视图。器件500用包封材料801进行包封，该包封材料至少部分包封管芯304、管芯安装衬底301、键合线501、502和引线103。包封材料801优选是防水的电绝缘复合物，其通常是在单一连续块802中注模的模塑复合物(molding compound)，其需要切割、锯开或以其他方式分离(切单)以形成单独的封装体。
参考图9，其示出根据本发明的优选实施例的两个相邻切单后半导体器件900的截面侧视图。器件900已经通过沿着封装分离平面702的锯开或切割工艺被分离(切单)，由此分割外部引线103并在包封材料801的连续块801中形成分割槽902。这些分割槽902具有限定每个器件900的外围边缘903的表面。此外，每个切单后器件900已经在外部引线103中切出通道901以电隔离引线103和其相应的管芯支撑件102。通道901被切至一定深度以使得它们稍微切到包封材料801中。然而，通道901可以被切到引线103中以便在包封材料801中消除通道901。
参考图10，其示出根据本发明的优选实施例的切单后器件900之一的底侧平面图。如图清晰地示出，呈现为焊料球601的外部凸起位于封装体900的表面安装侧603的中心区域602。此外，外部引线在表面安装侧603上从靠近管芯支撑件102的位置(通道901)朝向器件900的外围边缘903向外凸出。通道901处于管芯支撑件102和引线103之间的包封材料801的表面安装侧603中，这些通道901中的每一个平行于外围边缘903之一。
每个外部引线103具有与外围边缘903之一齐平的外围末端1010。此外，每个外围边缘903与一个或多个引线103的外围末端齐平。换句话说，切单后器件900具有类似于方形扁平封装(QFP)引线的引线。
在图11中，示出根据本发明的优选实施例安装到电路板1100的半导体器件900之一的截面侧视图。器件900正在经受焊料回流工艺(在回流炉中)，其中焊料膏1110已经被施加到电路板1100上的焊盘1120、1130。焊盘是与相应就位引线103或焊料球601对准的引线焊盘1120或阵列焊盘1130。如图所示，引线焊盘1120上的焊料膏1110已经回流，而焊料膏1120尚未回流，因为与引线焊盘1120相比，阵列焊盘1130稍微地不直接暴露于来自回流炉的热量。然而，这种焊料膏回流差异并不需要必然是这种情况，焊料膏1110可以被混合为以便它在每个焊盘1120、1130上同时回流。
参考图12，其示出根据本发明另一优选实施例的半导体器件1200的截面侧视图。器件1200基本上与器件900相同并且因此为了避免重复仅描述不同之处。在该实施例中，管芯安装衬底1210具有将半导体管芯304热耦合到管芯支撑件102的导热流道1220。因此，管芯支撑件102可以用作能够根据需要焊接到电路板热沉的热沉(heat sink)。为了有利于管芯支撑件102的热沉功能，管芯支撑安装表面308被附连到沉积有导热环氧树脂或其他形式的导热粘合剂的管芯安装衬底1210。类似地，半导体管芯304也被附连到沉积有导热环氧树脂或其他形式的导热粘合剂的管芯安装衬底1210。
参考图13，其示出根据本发明另一优选实施例的导电引线框架片1300的平面顶视图。引线框架片1300具有多个引线框架1310，每个引线框架包括管芯支撑件1320和从管芯支撑件1320延伸到相邻管芯支撑件1320的多个外部引线1330。导电引线框架片1300以及因此每个管芯支撑件1320和外部引线1330是由单片导电材料例如铜、铝或类似金属或其合金整体形成的。在一个实施例中，片1300包括镀覆其他一种或多种金属的铜或铜合金的片，例如镀覆了可焊接金属的铜，该可焊接金属镀覆了贵金属例如金或钯，这在本领域是已知的。在该实施例中，管芯支撑件102包括部分地包围中心引线框架空间1307的单组平行间隔构件105、106，管芯安装衬底将在由虚线矩形1380指示的位置横跨该中心引线框架空间1370。导电引线框架片1300可以被用于形成类似于前述实施例的引线框架封装体。
参考图14，其示出根据本发明的优选实施例用于组装半导体器件的方法1400的流程图。将参考图1-10所示并在前面描述的实施例来描述方法1400。然而，也可以利用其他实施例例如导电引线框架片1300来执行该方法。
在步骤1410处，方法1400开始于提供由导电材料的引线框架片100整体形成的管芯支撑件102和外部引线103。在步骤1420处，管芯安装衬底301被安装在管芯支撑件102上，并且在步骤1430处，半导体管芯304被附连到管芯安装衬底301。
在步骤1440处，管芯连接焊盘306被选择性地电耦合或连接到外部引线103和键合焊盘303，例如通过使用键合线和当前可用的金属丝键合设备。在步骤1450处，导电外部凸起601被附连到外部连接焊盘403。凸起601可以包括焊料球例如C4焊料球并且由本领域技术人员已知的方法进行附连。在步骤1460处，执行包封工艺，例如转移注模，从而用包封材料801包封或覆盖至少管芯304的一部分以形成被封装的半导体器件900。
在步骤1470处，通常通过切割(或锯开)执行电隔离管芯支撑件102和引线103的工艺，这不可避免地在包封材料801的表面安装侧603中留下通道901。切单还通过在包封材料801的连续块801中形成分割槽902来执行，从而提供单独的半导体器件900。
有利地，本发明提供一种组合的栅格阵列和外部引线表面安装的封装体。外部引线103为封装体提供额外的刚性，从而降低或至少缓解载体衬底或封装体在焊料回流期间扭曲的可能性。管芯支撑件102也可以帮助降低或至少缓解载体衬底或封装体在焊料回流期间的扭曲，并且管芯支撑件102也可以具有利于散热的附加益处。
为了图示说明和描述的目的已经展示了本发明的优选实施例的描述，但是这并不意味着是排他性的或者将本发明局限于所公开的形式。本领域技术人员将认识到可以在不偏离其广泛的创新性概念的情况下对上面描述的实施例做出各种变化。因此，应该理解本发明并不局限于所公开的特定实施例，而是覆盖由随附权利要求书限定的本发明的精神和范围内的修改。

Claims (19)

1.一种半导体器件，其包括：
由单片导电材料整体形成的管芯支撑件和外部引线；
管芯安装衬底，具有管芯安装侧和安装在所述管芯支撑件上的相反的外部连接器侧，其中所述管芯安装侧具有耦合到所述衬底的所述外部连接器侧上相应的外部连接焊盘的键合焊盘；
半导体管芯，其具有附连到所述管芯安装衬底的所述管芯安装侧的管芯支撑安装表面以及具有相关联的管芯连接焊盘的相反的管芯连接焊盘表面，其中所述管芯连接焊盘是所述半导体管芯的电路节点；
键合线，其将所述管芯连接焊盘选择性地电耦合到所述外部引线和所述键合焊盘；
导电外部凸起，其附连到所述外部连接焊盘；以及
包封材料，其至少部分地包封所述管芯和所述键合线，
其中所述外部凸起位于所述器件的表面安装侧的中心区域，并且所述外部引线从接近所述管芯支撑件的位置朝向所述器件的外围边缘从所述表面安装侧向外凸出；
其中所述管芯支撑件是包围所述中心区域的框架。
2.如权利要求1所述的半导体器件，其中所述管芯支撑件包括至少部分地包围所述中心区域的两个间隔开的平行构件。
3.如权利要求2所述的半导体器件，其中所述管芯安装衬底横跨所述两个间隔开的平行构件。
4.如权利要求1所述的半导体器件，其中所述框架是矩形。
5.如权利要求1所述的半导体器件，其中所述外部凸起形成栅格阵列。
6.如权利要求1所述的半导体器件，其中所述外部凸起是形成球栅阵列的球。
7.如权利要求1所述的半导体器件，其中每个所述外部引线具有与所述外围边缘之一齐平的外围末端。
8.如权利要求7所述的半导体器件，其中每个所述外围边缘具有外围末端，至少一个所述外部引线与该外围末端齐平。
9.如权利要求1所述的半导体器件，其中在所述管芯支撑件与所述外部引线之间的所述包封材料的所述表面安装侧中形成通道。
10.如权利要求9所述的半导体器件，其中每个所述通道平行于外围边缘。
11.如权利要求1所述的半导体器件，其中所述管芯安装衬底具有将所述半导体管芯热耦合到所述管芯支撑件的导热流道。
12.一种用于组装半导体器件的方法，该方法包括：
提供由单片导电材料整体形成的管芯支撑件和外部引线；
将管芯安装衬底安装到所述管芯支撑件上，所述管芯安装衬底具有管芯安装侧和安装在所述管芯支撑件上的相反的外部连接器侧，其中所述管芯安装侧具有耦合到所述衬底的所述外部连接器侧上相应的外部连接焊盘的键合焊盘；
将半导体管芯安装到所述管芯安装衬底，所述半导体管芯具有附连到所述管芯安装衬底的所述管芯安装侧的管芯支撑安装表面以及具有相关联的管芯连接焊盘的相反的管芯连接焊盘表面，其中所述管芯连接焊盘是所述半导体管芯的电路节点；
将所述管芯连接焊盘选择性地电耦合到所述外部引线和所述键合焊盘；
将导电外部凸起附连到所述外部连接焊盘；以及
用包封材料包封所述管芯的至少一部分以形成所述半导体器件；
其中所述外部凸起位于所述器件的表面安装侧的中心区域，并且所述外部引线在所述器件的所述表面安装侧上从接近所述管芯支撑件的位置朝向所述器件的外围边缘向外凸出；
其中所述管芯支撑件是包围所述中心区域的框架。
13.如权利要求12所述的组装半导体器件的方法，进一步包括将所述管芯支撑件与所述引线电隔离。
14.如权利要求13所述的组装半导体器件的方法，其中将所述管芯支撑件与所述引线电隔离包括：在二者之间切割通道。
15.如权利要求14所述的组装半导体器件的方法，其中所述通道被切入所述包封材料的所述表面安装侧中。
16.如权利要求12所述的组装半导体器件的方法，其中所述管芯支撑件包括至少部分地包围所述中心区域的两个间隔开的平行构件。
17.如权利要求16所述的组装半导体器件的方法，其中所述管芯安装衬底横跨所述两个间隔开的平行构件。
18.如权利要求12所述的组装半导体器件的方法，其中所述外部凸起形成栅格阵列。
19.如权利要求12所述的组装半导体器件的方法，其中每个所述外部引线具有与所述外围边缘之一齐平的外围末端。
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US20140070388A1 (en) 2014-03-13
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US20150011053A1 (en) 2015-01-08
US8878348B2 (en) 2014-11-04

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