DE3582038D1 - Verfahren zum verbinden von stiften mit halbleiterplaettchen. - Google Patents

Verfahren zum verbinden von stiften mit halbleiterplaettchen.

Info

Publication number
DE3582038D1
DE3582038D1 DE8585115710T DE3582038T DE3582038D1 DE 3582038 D1 DE3582038 D1 DE 3582038D1 DE 8585115710 T DE8585115710 T DE 8585115710T DE 3582038 T DE3582038 T DE 3582038T DE 3582038 D1 DE3582038 D1 DE 3582038D1
Authority
DE
Germany
Prior art keywords
semiconductor boards
pens
connecting pens
boards
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585115710T
Other languages
English (en)
Inventor
Robert Marks
Phelps, Jr
William Carroll Ward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3582038D1 publication Critical patent/DE3582038D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE8585115710T 1984-12-31 1985-12-10 Verfahren zum verbinden von stiften mit halbleiterplaettchen. Expired - Fee Related DE3582038D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68769684A 1984-12-31 1984-12-31

Publications (1)

Publication Number Publication Date
DE3582038D1 true DE3582038D1 (de) 1991-04-11

Family

ID=24761445

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585115710T Expired - Fee Related DE3582038D1 (de) 1984-12-31 1985-12-10 Verfahren zum verbinden von stiften mit halbleiterplaettchen.

Country Status (3)

Country Link
EP (1) EP0186818B1 (de)
JP (1) JPS61160946A (de)
DE (1) DE3582038D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2210200B (en) * 1987-12-10 1990-06-06 Westinghouse Brake & Signal Semiconductor contact arrangement
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US5742100A (en) * 1995-03-27 1998-04-21 Motorola, Inc. Structure having flip-chip connected substrates
JP3578581B2 (ja) * 1997-02-28 2004-10-20 富士通株式会社 ベアチップの実装構造および実装方法およびそれに用いるインターポーザ
US6040630A (en) 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
DE10240461A1 (de) 2002-08-29 2004-03-11 Infineon Technologies Ag Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung
KR101701380B1 (ko) 2010-08-17 2017-02-01 해성디에스 주식회사 소자 내장형 연성회로기판 및 이의 제조방법
CN103681557B (zh) * 2012-09-11 2017-12-22 恩智浦美国有限公司 半导体器件及其组装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045863A (en) * 1971-06-03 1977-09-06 Siemens Aktiengesellschaft Method of producing metallic carrier system for a multi-electrode semiconductor strip
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
JPS50136357U (de) * 1974-04-25 1975-11-10

Also Published As

Publication number Publication date
JPH0239097B2 (de) 1990-09-04
EP0186818B1 (de) 1991-03-06
JPS61160946A (ja) 1986-07-21
EP0186818A2 (de) 1986-07-09
EP0186818A3 (en) 1987-03-18

Similar Documents

Publication Publication Date Title
DE3581428D1 (de) Verfahren zum ueberziehen von arzneiformen.
DE3578614D1 (de) Verfahren zum herstellen von chip-einfuegungsschichten.
DE3680281D1 (de) Verfahren zum verbinden von silikonbeschichtetem gewebe.
DE3684380D1 (de) Verfahren zum einebnen von halbleiteranordnungen.
DE3672059D1 (de) Verfahren zum komprimieren von zwei-pegeldaten.
DE3583377D1 (de) Verfahren zum reinigen von textilien mit cyclischen siloxanen.
AT383149B (de) Verfahren zum galvanischen metallisieren von gegenstaenden
DE3876744D1 (de) Verfahren zum aufbringen von konversionsueberzuegen.
DE3577408D1 (de) Verfahren zum einlegen von dokumenten.
DE3579942D1 (de) Verfahren zum loesbarmachen von interferon.
DE3582856D1 (de) Verfahren zum manipulieren von fluessigkeiten.
DE3673102D1 (de) Verfahren zum stabilisieren von organopolysiloxanen.
DE3481144D1 (de) Verfahren zum identifizieren von objekten.
DE3778639D1 (de) Verfahren zum stapelverbinden von draehten.
DE3767747D1 (de) Verfahren zum bestimmen von abmessungen.
DE3578942D1 (de) Verfahren zum haerten von gelatine.
DE3481487D1 (de) Verfahren zum sortieren von gegenstaenden.
DE3574963D1 (de) Verfahren zum verstaerken von keramischen koerpern.
DE3677878D1 (de) Verfahren zum sintern von presslingen.
DE3582038D1 (de) Verfahren zum verbinden von stiften mit halbleiterplaettchen.
DE3667781D1 (de) Verfahren zum verbinden von keramischen gegenstaenden.
ATE33395T1 (de) Verfahren zum polymerisieren von olefinen.
DE3577113D1 (de) Verfahren zum auswechsein von brueckenlagern.
DE3764026D1 (de) Verfahren zum aufbereiten von gebrauchten primaerzellen.
AT380790B (de) Verfahren zum stabilisieren von beta-lactamantibiotika

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee