JPS61154196A - アウタ−リ−ドボンデイング装置 - Google Patents

アウタ−リ−ドボンデイング装置

Info

Publication number
JPS61154196A
JPS61154196A JP59273748A JP27374884A JPS61154196A JP S61154196 A JPS61154196 A JP S61154196A JP 59273748 A JP59273748 A JP 59273748A JP 27374884 A JP27374884 A JP 27374884A JP S61154196 A JPS61154196 A JP S61154196A
Authority
JP
Japan
Prior art keywords
semiconductor device
outer lead
printed circuit
lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59273748A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466118B2 (fr
Inventor
岡村　實
龍男 佐藤
秀明 三好
神田　祐司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Marine Instr Co Ltd
Original Assignee
NEC Corp
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP59273748A priority Critical patent/JPS61154196A/ja
Publication of JPS61154196A publication Critical patent/JPS61154196A/ja
Publication of JPH0466118B2 publication Critical patent/JPH0466118B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP59273748A 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置 Granted JPS61154196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273748A JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273748A JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61139291A Division JPS6284529A (ja) 1986-06-17 1986-06-17 キヤリヤテ−プ打抜装置

Publications (2)

Publication Number Publication Date
JPS61154196A true JPS61154196A (ja) 1986-07-12
JPH0466118B2 JPH0466118B2 (fr) 1992-10-22

Family

ID=17532022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273748A Granted JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61154196A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135738U (fr) * 1988-03-08 1989-09-18

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPS59175132A (ja) * 1983-03-23 1984-10-03 Nec Corp テ−プキヤリア方式による半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPS59175132A (ja) * 1983-03-23 1984-10-03 Nec Corp テ−プキヤリア方式による半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135738U (fr) * 1988-03-08 1989-09-18
JPH0514512Y2 (fr) * 1988-03-08 1993-04-19

Also Published As

Publication number Publication date
JPH0466118B2 (fr) 1992-10-22

Similar Documents

Publication Publication Date Title
US5894657A (en) Mounting apparatus for electronic component
JPH07106796A (ja) 電子部品実装装置
JP2008100482A (ja) Ｔｃｐ実装装置におけるキャリアテープの接続方法、それを用いるｔｃｐ実装装置及び表示装置の製造方法
JP2013021074A (ja) 電子回路部品の立上がり防止方法および電子回路製造システム
JPS61154196A (ja) アウタ−リ−ドボンデイング装置
JPH0226379B2 (fr)
JPH11238762A (ja) フリップチップボンディング方法及び装置
JPS61166095A (ja) アウターリードボンディング装置
JP2861304B2 (ja) アウターリードボンディング方法
JPH0453097B2 (fr)
JP3175737B2 (ja) 電子部品実装装置および電子部品実装方法
JPS6340328A (ja) アウタ−リ−ドボンデイング装置
JPS6139532A (ja) ボンデイング装置
JP2832744B2 (ja) インナーリードボンディング方法
JP3233137B2 (ja) 電子部品実装装置および電子部品実装方法
JPH0685447A (ja) 電子部品の搭載接続方法および装置
JP3232980B2 (ja) 電子部品の打抜方法
JP3857946B2 (ja) 電子部品のボンディング方法及びボンディング装置
JP2853286B2 (ja) フィルムキャリアテープの処理装置
JPH0131694B2 (fr)
JPH0878479A (ja) アウタリ−ドボンディング装置およびアウタリ−ドボンディング方法
JPH03217089A (ja) Ｉｃ部品の切断分離方法
JPH0418699B2 (fr)
JPH0691131B2 (ja) フィルムキャリァ
JP2614741B2 (ja) タブボンディング用サーモードツール及び該サーモードツールによるタブボンディング方法